Abstract: A cooling apparatus includes a direct-bonded copper (“DBC”) substrate, the DBC substrate having a plurality of micro-structure tabs formed on a fluid impingement side of the DBC substrate, and a jet head in complementary opposition to the fluid impingement side. The jet head has a first plurality of micro-jets facing the fluid impingement side, each of the first plurality of micro-jets having a nozzle, and a second plurality of micro-jets facing the fluid impingement side so the jet head is configured to deliver a fluid to the plurality of micro-structure tabs through the first and second plurality of micro-jets.

Abstract: A cooling apparatus includes a direct-bonded copper (“DBC”) substrate, the DBC substrate having a plurality of micro-structure tabs formed on a fluid impingement side of the DBC substrate, and a jet head in complementary opposition to the fluid impingement side. The jet head has a first plurality of micro-jets facing the fluid impingement side, each of the first plurality of micro-jets having a nozzle, and a second plurality of micro-jets facing the fluid impingement side so the jet head is configured to deliver a fluid to the plurality of micro-structure tabs through the first and second plurality of micro-jets.

Abstract: A self contained device for harvesting electrical energy from linear and rotary motion has a sensor with amplifiers for tensile stretching of a piezoelectric body with magnification of the applied force. The piezoelectric body is a monolithic plate with surface electrodes covering its top and bottom surfaces.

Abstract: A method of manufacturing wafers of semiconductor material incorporates the steps of: providing an elongated ingot of semiconductor material having a curved surface along the direction of elongation; mounting a structure for ingot mounting on each of the end surfaces of the ingot; positioning the ingot mounting structures on fixture structures to mount the ingot; and rotating the mounted ingot. The positioned ingot mounting structures are released and the ingot is removed from the fixture structures; however, during the course of the process the mounting structures are again positioned on fixture structures to mount the ingot and the ingot is rotated a second time. The method is adapted for accurate centering of the ingot during processing involving the sawing of the ingot to provide opposed elongated planes therealong (including rotation of the ingot in accomplishing such) and involving further rotation of the ingot during grinding.