Patents by Inventor Alex Ruyack

Alex Ruyack has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Self-destructing chip
    Patent number: 9842812
    Abstract: Embodiments herein provide for a self-destructing chip including at least a first die and a second die. The first die includes an electronic circuit, and the second die is composed of one or more polymers that disintegrates at a first temperature. The second die defines a plurality of chambers, wherein a first subset of the chambers contain a material that reacts with oxygen in an exothermic manner. A second subset of the chambers contain an etchant to etch materials of the first die. In response to a trigger event, the electronic circuit is configured to expose the material in the first subset of chambers to oxygen in order to heat the second die to at least the first temperature, and is configured to release the etchant from the second subset of the chambers to etch the first die.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: December 12, 2017
    Assignee: Honeywell International Inc.
    Inventors: Steven Tin, Jeffrey James Kriz, Steven J. Eickhoff, Jeff A. Ridley, Amit Lal, Christopher Ober, Serhan Ardanuc, Ved Gund, Alex Ruyack, Katherine Camera
  • SELF-DESTRUCTING CHIP
    Publication number: 20170025365
    Abstract: Embodiments herein provide for a self-destructing chip including at least a first die and a second die. The first die includes an electronic circuit, and the second die is composed of one or more polymers that disintegrates at a first temperature. The second die defines a plurality of chambers, wherein a first subset of the chambers contain a material that reacts with oxygen in an exothermic manner. A second subset of the chambers contain an etchant to etch materials of the first die. In response to a trigger event, the electronic circuit is configured to expose the material in the first subset of chambers to oxygen in order to heat the second die to at least the first temperature, and is configured to release the etchant from the second subset of the chambers to etch the first die.
    Type: Application
    Filed: March 17, 2015
    Publication date: January 26, 2017
    Inventors: Steven Tin, Jeffrey James Kriz, Steven J. Eickhoff, Jeff A. Ridley, Amit Lal, Christopher Ober, Serhan Ardanuc, Ved Gund, Alex Ruyack, Katherine Camera