Patents by Inventor Alexander Goudelev
Alexander Goudelev has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9972889Abstract: A multiband antenna apparatus and an electronic apparatus having the multiband antenna apparatus are provided. The multiband antenna apparatus includes: a low frequency antenna which transmits and receives at least one low frequency band signal; and a high frequency antenna which transmits and receives at least one high frequency band signal, wherein the low frequency antenna includes a single wing part which emits an electric wave.Type: GrantFiled: July 2, 2013Date of Patent: May 15, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Won-bin Hong, Young-ju Lee, Alexander Goudelev, Kwang-hyun Baek
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Patent number: 9923277Abstract: An antenna and emission filter are provided. The antenna includes a substrate; an emitter on a substrate wherein the emitter is configured to emit electromagnetic signals; a feeding portion connected to the emitter; and an emission filter comprising a plurality of emission filter cells formed on the substrate in order to filter a surface wave caused by the emitter, wherein each of the plurality of emission filter cells comprises an inductor pattern portion electrically connected with an adjacent emission filter cell to form an inductor; and a capacitor pattern portion distanced from the adjacent emission cell to form a capacitor.Type: GrantFiled: April 22, 2014Date of Patent: March 20, 2018Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kwang-hyun Baek, Alexander Goudelev, Won-bin Hong, Young-ju Lee
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Patent number: 9337526Abstract: An antenna-printed circuit board (PCB) package is provided. The antenna-PCB package includes a PCB; an antenna portion formed on an upper surface of the PCB and inside the PCB; and a radio frequency integrated circuit (RFIC) chip bonded to a lower surface of the PCB.Type: GrantFiled: June 27, 2012Date of Patent: May 10, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Won-bin Hong, Alexander Goudelev, Kwang-hyun Baek, Young-hwan Kim
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Patent number: 9041074Abstract: A multilayered antenna package including: a radio frequency integrated circuit (RFIC) interface layer that is configured to transmit a radio frequency (RF) signal; a first dielectric layer that is disposed on the RFIC interface layer; a coplanar waveguide layer that is disposed on the first dielectric layer and is configured to receive the RF signal transmitted by RFIC layer; a second dielectric layer disposed on the coplanar waveguide layer; and an antenna portion that is disposed on the second dielectric layer and is configured to irradiate a signal that is transmitted from the coplanar waveguide layer.Type: GrantFiled: June 22, 2012Date of Patent: May 26, 2015Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Won-bin Hong, Alexander Goudelev, Kwang-hyun Baek, Young-hwan Kim
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Publication number: 20140313096Abstract: An antenna and emission filter are provided. The antenna includes a substrate; an emitter on a substrate wherein the emitter is configured to emit electromagnetic signals; a feeding portion connected to the emitter; and an emission filter comprising a plurality of emission filter cells formed on the substrate in order to filter a surface wave caused by the emitter, wherein each of the plurality of emission filter cells comprises an inductor pattern portion electrically connected with an adjacent emission filter cell to form an inductor; and a capacitor pattern portion distanced from the adjacent emission cell to form a capacitor.Type: ApplicationFiled: April 22, 2014Publication date: October 23, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kwang-hyun BAEK, Alexander GOUDELEV, Won-bin HONG, Young-ju LEE
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Publication number: 20140125526Abstract: A multiband antenna apparatus and an electronic apparatus having the multiband antenna apparatus are provided. The multiband antenna apparatus includes: a low frequency antenna which transmits and receives at least one low frequency band signal; and a high frequency antenna which transmits and receives at least one high frequency band signal, wherein the low frequency antenna includes a single wing part which emits an electric wave.Type: ApplicationFiled: July 2, 2013Publication date: May 8, 2014Inventors: Won-bin HONG, Young-ju LEE, Alexander GOUDELEV, Kwang-hyun BAEK
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Publication number: 20140125541Abstract: An end fire antenna apparatus built in an electronic apparatus includes a printed circuit board (PCB), at least one main antenna built in the PCB and configured to radiate a radio wave, and a ground plate disposed on a side surface of the PCB, the ground plate being electrically isolated from the at least one main antenna. The at least one main antenna has a pillar shape uniformly extending along a thickness direction of the PCB.Type: ApplicationFiled: November 8, 2013Publication date: May 8, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Won-bin HONG, Alexander GOUDELEV, Kwang-hyun BAEK, Young-ju LEE
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Publication number: 20130099006Abstract: An antenna-printed circuit board (PCB) package is provided. The antenna-PCB package includes a PCB; an antenna portion formed on an upper surface of the PCB and inside the PCB; and a radio frequency integrated circuit (RFIC) chip bonded to a lower surface of the PCB.Type: ApplicationFiled: June 27, 2012Publication date: April 25, 2013Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Won-bin HONG, Alexander GOUDELEV, Kwang-hyun BAEK, Young-hwan KIM
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Publication number: 20130099389Abstract: A multilayered antenna package including: a radio frequency integrated circuit (RFIC) interface layer that is configured to transmit a radio frequency (RF) signal; a first dielectric layer that is disposed on the RFIC interface layer; a coplanar waveguide layer that is disposed on the first dielectric layer and is configured to receive the RF signal transmitted by RFIC layer; a second dielectric layer disposed on the coplanar waveguide layer; and an antenna portion that is disposed on the second dielectric layer and is configured to irradiate a signal that is transmitted from the coplanar waveguide layer.Type: ApplicationFiled: June 22, 2012Publication date: April 25, 2013Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Won-bin HONG, Alexander GOUDELEV, Kwang-hyun BAEK, Young-hwan KIM
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Patent number: 7301499Abstract: Disclosed is a built-in type antenna apparatus for a portable terminal which separates an antenna from a slot antenna and includes an additional sub-antenna. The built-in type antenna apparatus includes a first planar antenna having a shorting point and a feeding point; a second planar antenna provided at a position adjacent to the first planar antenna, the second planar antenna having a shorting point and providing at least one slot; and a sub-antenna electrically connected to the first planar antenna and electromagnetically coupled with the second planar antenna.Type: GrantFiled: September 20, 2005Date of Patent: November 27, 2007Assignee: Samsung Electronics Co., Ltd.Inventors: Yong-Joo Shin, Alexander Goudelev, Wan-Jin Choi
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Publication number: 20060244664Abstract: Disclosed is a built-in type antenna apparatus for a portable terminal which separates an antenna from a slot antenna and includes an additional sub-antenna. The built-in type antenna apparatus includes a first planar antenna having a shorting point and a feeding point; a second planar antenna provided at a position adjacent to the first planar antenna, the second planar antenna having a shorting point and providing at least one slot; and a sub-antenna electrically connected to the first planar antenna and electromagnetically coupled with the second planar antenna.Type: ApplicationFiled: September 20, 2005Publication date: November 2, 2006Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yong-Joo Shin, Alexander Goudelev, Wan-Jin Choi