Patents by Inventor Alexander Reisenzahn

Alexander Reisenzahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package assembly including wave guide
    Patent number: 9048248
    Abstract: Some embodiments herein relate to a transmitter. The transmitter includes an integrated circuit (IC) package including a first antenna configured to radiate a first electromagnetic signal therefrom. A printed circuit board (PCB) substrate includes a waveguide configured to receive the first electromagnetic signal and to generate a waveguide signal based thereon. A second antenna can be electrically coupled to the waveguide and can radiate a second electromagnetic signal that corresponds to the waveguide signal. Other devices and methods are also disclosed.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: June 2, 2015
    Assignee: Infineon Technologies AG
    Inventors: Linus Maurer, Alexander Reisenzahn, Markus Treml, Thomas Wickgruber
  • INTEGRATED CIRCUIT PACKAGE ASSEMBLY INCLUDING WAVE GUIDE
    Publication number: 20120187511
    Abstract: Some embodiments herein relate to a transmitter. The transmitter includes an integrated circuit (IC) package including a first antenna configured to radiate a first electromagnetic signal therefrom. A printed circuit board (PCB) substrate includes a waveguide configured to receive the first electromagnetic signal and to generate a waveguide signal based thereon. A second antenna can be electrically coupled to the waveguide and can radiate a second electromagnetic signal that corresponds to the waveguide signal. Other devices and methods are also disclosed.
    Type: Application
    Filed: March 30, 2012
    Publication date: July 26, 2012
    Applicant: Infineon Technologies AG
    Inventors: Linus Maurer, Alexander Reisenzahn, Markus Treml, Thomas Wickgruber
  • Integrated circuit package assembly including wave guide
    Patent number: 8169060
    Abstract: Some embodiments herein relate to a transmitter. The transmitter includes an integrated circuit (IC) package including a first antenna configured to radiate a first electromagnetic signal therefrom. A printed circuit board (PCB) substrate includes a waveguide configured to receive the first electromagnetic signal and to generate a waveguide signal based thereon. A second antenna can be electrically coupled to the waveguide and can radiate a second electromagnetic signal that corresponds to the waveguide signal. Other devices and methods are also disclosed.
    Type: Grant
    Filed: March 29, 2010
    Date of Patent: May 1, 2012
    Assignee: Infineon Technologies AG
    Inventors: Linus Maurer, Alexander Reisenzahn, Markus Treml, Thomas Wickgruber
  • Integrated Circuit Package Assembly Including Wave Guide
    Publication number: 20110234472
    Abstract: Some embodiments herein relate to a transmitter. The transmitter includes an integrated circuit (IC) package including a first antenna configured to radiate a first electromagnetic signal therefrom. A printed circuit board (PCB) substrate includes a waveguide configured to receive the first electromagnetic signal and to generate a waveguide signal based thereon. A second antenna can be electrically coupled to the waveguide and can radiate a second electromagnetic signal that corresponds to the waveguide signal. Other devices and methods are also disclosed.
    Type: Application
    Filed: March 29, 2010
    Publication date: September 29, 2011
    Applicant: Infineon Technologies AG
    Inventors: Linus Maurer, Alexander Reisenzahn, Markus Treml, Thomas Wickgruber