Patents by Inventor Alexander SOSKOV

Alexander SOSKOV has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Eddy current thickness measurement apparatus
    Patent number: 9057146
    Abstract: A sheet of a material is disposed in a melt of the material. The sheet is formed using a cooling plate in one instance. An exciting coil and sensing coil are positioned downstream of the cooling plate. The exciting coil and sensing coil use eddy currents to determine a thickness of the solid sheet on top of the melt.
    Type: Grant
    Filed: August 24, 2010
    Date of Patent: June 16, 2015
    Assignee: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Gary J. Rosen, Frank Sinclair, Alexander Soskov, James S. Buff
  • Hardware plasma interlock system
    Patent number: 9060411
    Abstract: A hardware interlock system for monitoring operation of RF plasma sources. The hardware interlock system includes an RF generator operative to transmit a forward RF power used to generate plasma in a plasma chamber. A derivative based hardware interlock circuit is coupled in series with the RF generator. The derivative based hardware interlock circuit determines a reflected RF power derivative value indicative of the speed of change in reflected RF power values in the RF plasma ion source. An analog/digital (A/D) logic circuit is coupled with the derivative based hardware interlock circuit. The A/D logic circuit can shut down the RF generator output when the reflected RF power derivative value exceeds a threshold.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: June 16, 2015
    Assignee: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Costel Biloiu, Alexander Soskov, Chris Leavitt
  • EDDY CURRENT THICKNESS MEASUREMENT APPARATUS
    Publication number: 20120048496
    Abstract: A sheet of a material is disposed in a melt of the material. The sheet is formed using a cooling plate in one instance. An exciting coil and sensing coil are positioned downstream of the cooling plate. The exciting coil and sensing coil use eddy currents to determine a thickness of the solid sheet on top of the melt.
    Type: Application
    Filed: August 24, 2010
    Publication date: March 1, 2012
    Applicant: VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
    Inventors: Gary J. ROSEN, Frank SINCLAIR, Alexander SOSKOV, James S. BUFF