Abstract: Methods for monitoring and controlling process variables of interest during the substrate manufacturing process is provided. Numerical estimates for selected attributes of a feature of interest may be analyzed and applied in a numerical estimator to estimate the process variable of interest for a given product process run. The resulting estimations may be used to provide feedback control data for error correction on subsequent product substrate.

Abstract: A method of process variation compensation in step-and-scan lithography which comprises estimating a magnitude of a process error over a full imaged substrate surface and applying error correction during scan exposure over the full imaged substrate surface is provided in the disclosed embodiments.

Abstract: In an embodiment in accordance with the present invention, methods for dynamic detection and correction of focus and tilt variations that occur during a specific product layer exposure is by focus and tilt pre-compensation during wafer exposure. The method provides two spaced apart paths that provide both defocus and tilt measurements. A reference plane is defined by using three reference areas or fields. The data is fitted, using least squares or max/min error, to a “plane”, that is, to straight equidistant lines, the deviation from “plane” is computed as error from a set of straight equidistant lines. Lateral displacements of each band into focus error is converted using the formula: ?Z=?X*?.

Abstract: Methods for monitoring and controlling process variables of interest during the substrate manufacturing process is provided. Numerical estimates for selected attributes of a feature of interest may be analyzed and applied in a numerical estimator to estimate the process variable of interest for a given product process run. The resulting estimations may be used to provide feedback control data for error correction on subsequent product substrate.

Abstract: A method and apparatus for constraining a substrate in-plane is provided. A substrate retainer having a retainer body and contact surface configured to engage a portion of a back side of a substrate, and a flexure coupled to the retainer body and configured to restrict one or more degrees of movement of a substrate with respect to the substrate retainer.

Abstract: A method of process variation compensation in step-and-scan lithography which comprises estimating a magnitude of a process error over a full imaged substrate surface and applying error correction during scan exposure over the full imaged substrate surface is provided in the disclosed embodiments.

Abstract: In an embodiment in accordance with the present invention, methods for dynamic detection and correction of focus and tilt variations that occur during a specific product layer exposure is by focus and tilt pre-compensation during wafer exposure. The method provides two spaced apart paths that provide both defocus and tilt measurements. A reference plane is defined by using three reference areas or fields. The data is fitted, using least squares or max/min error, to a “plane”, that is, to straight equidistant lines, the deviation from “plane” is computed as error from a set of straight equidistant lines. Lateral displacements of each band into focus error is converted using the formula: &Dgr;Z=&Dgr;X*&thgr;.

Abstract: A pattern is formed on a substrate by the process of providing a substrate having a surface with previously patterned features having a non-uniform electromagnetic reflectivity, applying a second image recording material to the surface, employing the features with a non-uniform physical property of reflectivity to delineate a desired pattern in the second image recording material and applying electromagnetic energy to take advantage of the reflectivity features to provide variable processing of the second material.

Abstract: A pattern is formed on a substrate by the process of providing a substrate having a surface with previously patterned features having a non-uniform electromagnetic reflectivity, applying a second image recording material to the surface, employing the features with a non-uniform physical property of reflectivity to delineate a desired pattern in the second image recording material and applying electromagnetic energy to take advantage of the reflectivity features to provide variable processing of the second material.

Abstract: A method and apparatus is provided for estimating the centerline of an alignment/overlay measurement target by means of projecting light from a tunable, variable wavelength the illumination source onto the target, then performing optical observation of the measurement mark and providing an output signal representing the quantity measured in the observation, computing from the output signal a criterion of signal asymmetry to provide an output product, and tuning the tunable illumination source as a function of the output product. As a result tuning adjustment of the wavelength of illumination is employed to expose an observed feature, and the illumination source is tuned until the criterion is minimized, thus improving the accuracy of the estimated centerline.