Abstract: A method for producing an insulation panel, including a cover layer and a layer of insulating material located thereon, between which the layer of insulating material is located. The insulating material is produced by metering at least two components of a reactive mixture, mixing and feeding them to an inlet of a distributor. The reactive mixture is guided in the distributor along a flow path to at least five nozzle openings and discharged. The reactive mixture is applied from each nozzle opening in a free jet onto the upper side of the cover layer which moves in a conveying direction relative to the distributor. The impact points of the jet of reactive mixture on the cover layer lie substantially on a line which extends transversely to the conveying direction. The distance of the two laterally outermost impact points is at least 70% of the width.

Abstract: The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which an at least partly crosslinked hotmelt adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.

Abstract: The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which a pressure-sensitive adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.

Abstract: Method for encapsulating an electronic arrangement against permeates wherein a pressure-sensitive adhesive mass based on butylene block copolymers is applied to and around the areas of the electronic arrangement to be encapsulated.

Abstract: Method for encapsulating an electronic arrangement against permeates wherein a pressure-sensitive adhesive mass based on butylene block copolymers is applied to and around the areas of the electronic arrangement to be encapsulated.

Abstract: The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which an at least partly crosslinked hotmelt adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.

Abstract: The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which a pressure-sensitive adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated.

Abstract: Thermally-activated and hardenable adhesive foil for adhesion of electronic components and flexible printed circuit paths having an adhesive material composed of at least a) one chemically crosslinked or at least partially crosslinked polyurethane, b) one at least bifunctional epoxy resin, c) one hardener for the epoxy resin, in which the epoxy groups react chemically with the hardener at high temperatures, in which at least one of the starting materials of the polyurethane is a hydroxyl-functionalized polycarbonate and at least one of the starting materials of the polyurethane has a functionality greater than two