Abstract: A circumcision device and methods for using and manufacturing the same are disclosed. Embodiments of the circumcision device include a connector that permits the circumcision device to be connected by hand to and disconnected by hand from a tissue holding member while the tissue holding member is holding penile tissue. The connector permits the circumcision device to rotate while connected to the tissue holding member. Embodiments include a blade (cutting member) that is bent at an angle that may be oblique, and the blade may include a slot on either side of or across the bend. Further embodiments include at least one gripping member that extends perpendicularly to the axis the device rotates around, while additional embodiments include at least one gripping member that is aligned with the connector to assist in connection and removal of the device from a tissue holding member.

Abstract: Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.

Abstract: Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.

Abstract: Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.

Abstract: Features of substrates are copper electroplated by a method which involves copper electroplating selectively deposited seed layers or seed layers of photoresist defined features with a copper electroplating composition containing select suppressor compounds and select leveler compounds which enable anisotropic plating. Optionally, the seed layers can be treated with an aqueous solution of sulfur containing accelerators prior to copper electroplating.

Abstract: Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.

Abstract: A user input panel dynamically expands to accommodate user input, such as handwritten or keyboard input. Expansion may occur in one or two out of four possible directions, depending upon the language to be written or typed. For example, when writing English words, the input panel may expand to the right as the user writes and then downward when the input panel has fully expanded rightward.

Abstract: A user input panel dynamically expands to accommodate user input, such as handwritten or keyboard input. Expansion may occur in one or two out of four possible directions, depending upon the language to be written or typed. For example, when writing English words, the input panel may expand to the right as the user writes and then downward when the input panel has fully expanded rightward.