Patents by Inventor Alexandre Blander
Alexandre Blander has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9042120Abstract: An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.Type: GrantFiled: October 1, 2013Date of Patent: May 26, 2015Assignee: International Business Machines CorporationInventors: Martin Beaumier, Alexandre Blander, Pascale Gagnon, Michael A. Gaynes, Eric Giguere, Eric Salvas, Luc Tousignant
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Patent number: 8910853Abstract: In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.Type: GrantFiled: July 1, 2013Date of Patent: December 16, 2014Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Donald W. Henderson, Gareth G. Hougham, Hsichang Liu, Eric D. Perfecto, Srinivasa S.N. Reddy, Krystyna W. Semkow, Kamalesh K. Srivastava, Brian R. Sundlof, Julien Sylvestre, Renee L. Weisman
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Patent number: 8786059Abstract: A structure and method for producing the same is disclosed. The structure includes an organic passivation layer with solids suspended therein. Preferential etch to remove a portion of the organic material and expose portions of such solids creates enhanced surface roughness, which provides a significant advantage with respect to adhesion of that passivation layer to the packaging underfill material.Type: GrantFiled: May 10, 2012Date of Patent: July 22, 2014Assignee: International Business Machines CorporationInventors: Alexandre Blander, Jon A Casey, Timothy H Daubenspeck, Ian D Melville, Jennifer V Muncy, Marie-Claude Paquet
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Publication number: 20140016283Abstract: An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.Type: ApplicationFiled: October 1, 2013Publication date: January 16, 2014Applicant: International Business Machines CorporationInventors: Martin Beaumier, Alexandre Blander, Pascale Gagnon, Michael A. Gaynes, Eric Giguere, Eric Salvas, Luc Tousignant
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Patent number: 8614900Abstract: An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.Type: GrantFiled: May 18, 2011Date of Patent: December 24, 2013Assignee: International Business Machines CorporationInventors: Martin Beaumier, Alexandre Blander, Pascale Gagnon, Michael A. Gaynes, Eric Giguere, Eric Salvas, Luc Tousignant
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Publication number: 20130284495Abstract: In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.Type: ApplicationFiled: July 1, 2013Publication date: October 31, 2013Inventors: Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Donald W. Henderson, Gareth G. Hougham, Hsichang Liu, Eric D. Perfecto, Srinivasa S.N. Reddy, Krystyna W. Semkow, Kamalesh K. Srivastava, Brian R. Sundlof, Julien Sylvestre, Renee L. Weisman
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Patent number: 8493746Abstract: In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.Type: GrantFiled: February 12, 2010Date of Patent: July 23, 2013Assignee: International Business Machines CorporationInventors: Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Donald W. Henderson, Gareth G. Hougham, Hsichang Liu, Eric D. Perfecto, Srinivasa S. N. Reddy, Krystyna W. Semkow, Kamalesh K. Srivastava, Brian R. Sundlof, Julien Sylvestre, Renee L. Weisman
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Publication number: 20120228748Abstract: A structure and method for producing the same is disclosed. The structure includes an organic passivation layer with solids suspended therein. Preferential etch to remove a portion of the organic material and expose portions of such solids creates enhanced surface roughness, which provides a significant advantage with respect to adhesion of that passivation layer to the packaging underfill material.Type: ApplicationFiled: May 10, 2012Publication date: September 13, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: ALEXANDRE BLANDER, JON A. CASEY, TIMOTHY H. DAUBENSPECK, IAN D. MELVILLE, JENNIFER V. MUNCY, MARIE-CLAUDE PAQUET
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Patent number: 8236615Abstract: A structure and method for producing the same is disclosed. The structure includes an organic passivation layer with solids suspended therein. Preferential etch to remove a portion of the organic material and expose portions of such solids creates enhanced surface roughness, which provides a significant advantage with respect to adhesion of that passivation layer to the packaging underfill material.Type: GrantFiled: November 25, 2009Date of Patent: August 7, 2012Assignee: International Business Machines CorporationInventors: Alexandre Blander, Jon A Casey, Timothy H Daubenspeck, Ian D Melville, Jennifer V Muncy, Marie-Claude Paquet
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Publication number: 20110292621Abstract: An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.Type: ApplicationFiled: May 18, 2011Publication date: December 1, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Martin Beaumier, Alexandre Blander, Pascale Gagnon, Michael A. Gaynes, Eric Giguere, Eric Salvas, Luc Tousignant
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Publication number: 20110121469Abstract: A structure and method for producing the same is disclosed. The structure includes an organic passivation layer with solids suspended therein. Preferential etch to remove a portion of the organic material and expose portions of such solids creates enhanced surface roughness, which provides a significant advantage with respect to adhesion of that passivation layer to the packaging underfill material.Type: ApplicationFiled: November 25, 2009Publication date: May 26, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Alexandre Blander, Jon A. Casey, Timothy H. Daubenspeck, Ian D. Melville, Jennifer V. Muncy, Marie-Claude Paquet
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Publication number: 20100200271Abstract: In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.Type: ApplicationFiled: February 12, 2010Publication date: August 12, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Donald W. Henderson, Gareth G. Hougham, Hsichang Liu, Eric D. Perfecto, Srinivasa S.N. Reddy, Krystyna W. Semkow, Kamalesh K. Srivastava, Brian R. Sundlof, Julien Sylvestre, Renee L. Weisman
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Patent number: 7512518Abstract: A method of using acoustic signals in the form of waves or pulses to non-destructively measure the thickness of a bonding layer sandwiched between and bonding together overlying and underlying materials different from the bonding layer especially when the thickness of the bonding layer is so small that the features (maxima, minima, time position) of the echo from the interface of the bonding layer and the overlying material is indistinguishable, i.e., not independently observable from the features (maxima, minima, time position) of the echo from the interface of the bonding layer and the underlying material.Type: GrantFiled: July 19, 2007Date of Patent: March 31, 2009Assignee: International Business Machines CorporationInventors: Alexandre Blander, Richard Brassard, Carl Savard, Julien Sylvestre
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Publication number: 20080021673Abstract: A method of using acoustic signals in the form of waves or pulses to non-destructively measure the thickness of a bonding layer sandwiched between and bonding together overlying and underlying materials different from the bonding layer especially when the thickness of the bonding layer is so small that the features (maxima, minima, time position) of the echo from the interface of the bonding layer and the overlying material is indistinguishable, i.e., not independently observable from the features (maxima, minima, time position) of the echo from the interface of the bonding layer and the underlying material.Type: ApplicationFiled: July 19, 2007Publication date: January 24, 2008Inventors: Alexandre Blander, Richard Brassard, Carl Savard, Julien Sylvestre