Abstract: A method of forming a tap into an intermediate point on a continuous coaxial cable, and a coaxial cable tap housing suitable for forming such a tap. The tap housing includes a recess and an alignment element having a predetermined spatial relationship with the recess. The recess has an entry, an exit and a passage connecting the entry and exit. When the tap housing is fixed to a cable, the exit of the recess is closer to the outer conductor of the cable than the entry of the recess is to the outer conductor. The alignment element is used to position a cutting tool which is inserted through the entry of the recess to form an opening in the outer conductor and a cavity in the dielectric under the opening. A tap insert, which includes a coupler assembly, is mounted to the housing, and the coupler assembly is inserted through the entry of the recess and through the opening into the cavity formed in the cable. In specific embodiments, the recess and opening are elongated.

Abstract: A digital loop system with a distributed architecture that provides telephone services with high reliability and quality and is cost-effective to install. The system is central office powered and uses a trunk unit interface to interface with a wide range of mechanical and electronic switches. The trunk unit interface connects to remote terminals via digital transmission lines. The remote terminals drive a large number of subscriber circuits through short subscriber loops. The distributed digital loop system employs sealed and environmentally hardened packaging for flexible outdoor installation. The electronic circuitry used by the remote terminals is divided into modules for flexible, incremental deployment of the system.

Abstract: A digital loop system with a distributed architecture that provides telephone services with high reliability and quality and is cost-effective to install. The system is central office powered and uses a trunk unit interface to interface with a wide range of mechanical and electronic switches. The trunk unit interface connects to remote terminals via digital transmission lines. The remote terminals drive a large number of subscriber circuits through short subscriber loops. The distributed digital loop system employs sealed and environmentally hardened packaging for flexible outdoor installation. The electronic circuitry used by the remote terminals is divided into modules for flexible, incremental deployment of the system.

Abstract: The invention provides a technique for interconnecting electronic components in which interconnection wires are bonded to contacts on a first component without the use of a material other than the materials of the contacts and the wires; the wires are then severed to a desired length of between 2d and 20d, where d is the diameter of the wires, and bonded to contacts on the second component by means of a conductive material such as solder. Preferably, solder is provided as pools located in recesses in a layer of insulating material. The invention also provides a bonding head for a wire bonder for bonding the wire to the contact on the first component and for weakening or severing the wire at the desired point.

Abstract: A technique for weakening an interconnection wire provided on a contact on an electronic component, in which the wire is weakened by means of an arc which is created between the wire and an electrode provided in an aperture in the wall of the bonding head of the wire bonder through which the wire is supplied, the arc being generated by an electric field between the wire and the electrode. The electric field has a second portion in which its polarity is reversed, for controlling the dispersion of charged particles emitted from the wire. The electric field may be created by an arc generator which includes a capacitor which discharges through a transformer.

Abstract: A technique for interconnecting electronic components in which interconnection wires are bonded to contacts on a first component without the use of a material other than the materials of the contacts and the wires; the wires are then severed to a desired length of between 2d and 20d, where d is the diameter of the wires, and bonded to contacts on the second component by means of a conductive material such as solder. Preferably, solder is provided as pools located in recesses in a layer of insulting material. The wire may be bonded to the contact on the first component by means of a wire bonder having a bonding head which weakens or severs the wire to the desired length.