Abstract: The description relates to cooling electronic components, such as computing devices. One example includes a rack defining a volume and multiple sealed chassis modules removably fluidly coupled to a two-phase condenser tank via a vapor coupler and a liquid coupler. Individual sealed chassis modules can contain one or more electronic components immersed in two-phase coolant that when heated by operation of the electronic components experiences a phase change from a liquid phase to a gas phase and travels to the two-phase condenser tank via the vapor coupler and is cooled in the two-phase condenser tank until experiencing a phase change back into the liquid phase. Individual sealed chassis modules can be decoupled from the two-phase condenser tank without releasing two-phase coolant and an entirety of the multiple sealed chassis modules and the condenser tank are contained in the volume of the rack.

Abstract: A thermal management device includes a wicking heat spreader and a boiling enhancement surface feature positioned on at least one interior surface of the wicking heat spreader.

Abstract: The description relates to passive two-phase immersion cooling of computers, such as servers. One example can include multiple liquid immersion tanks configured to contain servers immersed in a liquid-phase of a coolant having a boiling point below a maximum operating temperature of the servers such that operation of the servers generates heat that is transferred to the liquid phase of the coolant and causes a portion of the coolant to boil to a gas phase of the coolant. The example can include a single phase separator tank and a single heat exchanger coupled to the multiple liquid immersion tanks as a sealed cooling system and configured to receive the gas phase of the coolant and configured to transition the gas phase of the coolant back to the liquid phase of the coolant and to automatically deliver liquid phase of the coolant to an individual liquid immersion tank responsive to further boiling producing additional gas phase of the coolant that evacuates the individual liquid immersion tank.

Abstract: The description relates to passive two-phase immersion cooling of computers, such as servers. One example can include multiple liquid immersion tanks configured to contain servers immersed in a liquid-phase of a coolant having a boiling point below a maximum operating temperature of the servers such that operation of the servers generates heat that is transferred to the liquid phase of the coolant and causes a portion of the coolant to boil to a gas phase of the coolant. The example can include a single phase separator tank and a single heat exchanger coupled to the multiple liquid immersion tanks as a sealed cooling system and configured to receive the gas phase of the coolant and configured to transition the gas phase of the coolant back to the liquid phase of the coolant and to automatically deliver liquid phase of the coolant to an individual liquid immersion tank responsive to further boiling producing additional gas phase of the coolant that evacuates the individual liquid immersion tank.

Abstract: A heat sink includes a body with an expansion chamber therein. The body is configured to receive heat from a heat source. The expansion chamber is configured to expand a working fluid from an inlet port to an outlet port of the heat sink. An immersion system includes a heat sink and a pressurizing mechanism for pressurizing the working fluid prior to the inlet port.

Abstract: An immersion cooling thermal management system includes a heat duct thermally coupled to a heat-generating electronic component. The heat duct has an inlet at a first longitudinal end of a channel and an outlet at an opposite second longitudinal end of the channel. The heat-generating electronic component is thermally coupled with the channel longitudinally between the inlet and the outlet. The outlet of the channel is higher than the inlet relative to a direction of gravity.

Abstract: Systems with indium application to heat transfer surfaces and related methods are described. A system includes a chassis, arranged inside a housing, having at least one slot for receiving a blade. The blade, arranged in a slot of the chassis, includes a first circuit board having a plurality of components mounted on a substrate. The blade further includes a first heat spreader comprising a metal. The first heat spreader including metal is arranged to transfer heat from the first circuit board to a cooling system via a first interface between a first surface of the first heat spreader and a second surface of the chassis, and where indium is permanently bonded to either the first surface of the first heat spreader, or the second surface of the chassis, or both the first surface of the first heat spreader and the second surface of the chassis.

Abstract: The description relates to cooling electronic components, such as computing devices. One example includes a rack defining a volume and multiple sealed chassis modules removably fluidly coupled to a two-phase condenser tank via a vapor coupler and a liquid coupler. Individual sealed chassis modules can contain one or more electronic components immersed in two-phase coolant that when heated by operation of the electronic components experiences a phase change from a liquid phase to a gas phase and travels to the two-phase condenser tank via the vapor coupler and is cooled in the two-phase condenser tank until experiencing a phase change back into the liquid phase. Individual sealed chassis modules can be decoupled from the two-phase condenser tank without releasing two-phase coolant and an entirety of the multiple sealed chassis modules and the condenser tank are contained in the volume of the rack.

Abstract: Systems with indium application to heat transfer surfaces and related methods are described. A system includes a chassis, arranged inside a housing, having at least one slot for receiving a blade. The blade, arranged in a slot of the chassis, includes a first circuit board having a plurality of components mounted on a substrate. The blade further includes a first heat spreader comprising a metal. The first heat spreader including metal is arranged to transfer heat from the first circuit board to a cooling system via a first interface between a first surface of the first heat spreader and a second surface of the chassis, and where indium is permanently bonded to either the first surface of the first heat spreader, or the second surface of the chassis, or both the first surface of the first heat spreader and the second surface of the chassis.