Abstract: A method of generating a computer-generated hologram from a three-dimensional image comprising a plurality of two-dimensional image layers is provided. The method comprises generating hologram data for each layer of the image, and updating the hologram data of at least one layer of the image based on the hologram data of the other layers of the image.

Abstract: An aircraft weight and balance system includes a user interface that displays an interior layout of an aircraft with seat icons and cargo icons corresponding to seats and cargo zones onboard the aircraft. The seat and cargo icons are moveable to different locations within the interior layout, and an updated weight and center-of-gravity of the aircraft is automatically determined based on the different locations of the seat and cargo icons. An aircraft weight and balance method includes displaying an interior layout of an aircraft on a user interface including seat icons corresponding to seats onboard the aircraft, moving one or more of the seat icons to a different location within the interior layout based on a user input, determining an updated weight and center-of-gravity of the aircraft based on a current location of the seat icons, and displaying the updated weight and center-of-gravity of the aircraft on the user interface.

Abstract: An integrated circuit having a semiconductor substrate with a barrier layer is disclosed. The arrangement includes a semiconductor substrate and a metallic element. A carbon-based barrier layer is disposed between the semiconductor substrate and the metallic element.

Abstract: A substrate has at least one feedthrough with at least one channel from a first main surface of the substrate to a second main surface of the substrate. The at least one channel is closed off with a first material. The at least one closed-off channel is filled with an electrically conductive second material.

Abstract: A substrate with first and second main surfaces includes at least one channel extending from the first main surface to the second main surface. The at least one channel includes a first cross-sectional area at a first location and a second cross-sectional area at a second location. An electrically conductive first material is disposed in the at least one channel.

Abstract: An integrated circuit having a semiconductor substrate with a barrier layer is disclosed. The arrangement includes a semiconductor substrate and a metallic element. A carbon-based barrier layer is disposed between the semiconductor substrate and the metallic element.

Abstract: An integrated circuit having a semiconductor substrate with a barrier layer is disclosed. The arrangement includes a semiconductor substrate and a metallic element. A carbon-based barrier layer is disposed between the semiconductor substrate and the metallic element.

Abstract: An article including a substrate having a blind hole formed therein, wherein the blind hole is defined by a floor and a sidewall and a solder connection is provided. The solder connection may couple a first contact pad to a second contact pad. The first contact pad may cover a first field of the floor of the blind hole, and may also promote wetting of a solder material of the solder connection. Wetting may be impeded on a second field of the floor of the blind hole. The second contact pad may be arranged above a surface of a further substrate, wherein the surface of the further substrate may be oriented perpendicularly to the floor of the blind hole in the substrate.

Abstract: An integrated circuit that comprises a substrate and a structured layer on the substrate. The structured layer comprises an opening to the substrate, a first field and a second field on the substrate, wherein the first field and the second field, at least in part, overlap with the opening. The integrated circuit further comprises a first material in the area of the first field and a second material in the area of the second field. The first material impedes a wetting by a solder material, and the second provides a wetting by the solder material.

Abstract: The invention relates to a method of preparing 2,4-dichloro-7H-pyrrolo[2,3-h]quinazoline (II): from 1H-pyrrolo[2,3-h]quinazoline-2,4-dione.

Abstract: An article including a substrate having a blind hole formed therein, wherein the blind hole is defined by a floor and a sidewall and a solder connection is provided. The solder connection may couple a first contact pad to a second contact pad. The first contact pad may cover a first field of the floor of the blind hole, and may also promote wetting of a solder material of the solder connection. Wetting may be impeded on a second field of the floor of the blind hole. The second contact pad may be arranged above a surface of a further substrate, wherein the surface of the further substrate may be oriented perpendicularly to the floor of the blind hole in the substrate.

Abstract: An integrated circuit that comprises a substrate and a structured layer on the substrate. The structured layer comprises an opening to the substrate, a first field and a second field on the substrate, wherein the first field and the second field, at least in part, overlap with the opening. The integrated circuit further comprises a first material in the area of the first field and a second material in the area of the second field. The first material impedes a wetting by a solder material, and the second provides a wetting by the solder material.

Abstract: An integrated circuit having a semiconductor substrate with a barrier layer is disclosed. The arrangement includes a semiconductor substrate and a metallic element. A carbon-based barrier layer is disposed between the semiconductor substrate and the metallic element.

Abstract: The invention relates to processes for the preparation of the bicyclic oxazine carboxaldehyde Compound 1: The invention also relates to the use of Compound 1 in the preparation of ?-lactamase inhibitors.

Abstract: Method for producing a macroporous silicon substrate suitable as a carrier for microelectronic components. Blind holes are produced from a front surface of the substrate. An insulator layer is produced on the front and rear surfaces of the substrate. Selective isotropic etching is performed from the rear surface with uncovering of blind hole ends produced such that respective blind hole walls formed by the insulator layer project from the substrate on the rear surface and are defined in this region only by the insulator layer forming the respective blind hole wall. A further insulator layer is then produced on the surfaces of the substrate. A plurality of the blind holes are then filled with a metal or a metal alloy by introducing the substrate into a melt thereof under pressure in a process chamber containing the melt. The melt is then asymmetrically cooled in the blind holes from the front surface, so that the metal or the alloy contracts toward and lies on a plane with the rear surface of the substrate.

Abstract: A substrate with first and second main surfaces includes at least one channel extending from the first main surface to the second main surface. The at least one channel includes a first cross-sectional area at a first location and a second cross-sectional area at a second location. An electrically conductive first material is disposed in the at least one channel.

Abstract: A substrate has at least one feedthrough with at least one channel from a first main surface of the substrate to a second main surface of the substrate. The at least one channel is closed off with a first material. The at least one closed-off channel is filled with an electrically conductive second material.

Abstract: Device having a flat macroporous support material made of silicon and having surfaces, a plurality of pores each having a diameter in a range of from 500 nm to 100 ?m distributed over at least one surface region of the support material and extending from one surface through to the opposite surface of the support material, at least one region having one or more pores with SiO2 pore walls, and a frame of walls with a silicon core surrounding the at least one region and arranged essentially parallel to longitudinal axes of the pores and open towards the surfaces, wherein the silicon core merges into silicon dioxide over a cross section towards an outer side of the walls forming the frame.

Abstract: One exemplary miniaturized detection coil former for NMR spectroscopy includes a macroporous carrier material having a first surface and a second surface situated opposite thereto, as well as a multiplicity of discrete pores formed in the carrier material and having a diameter in the range of 500 nm to 100 ?m being arranged in a manner distributed over at least one surface region. The pores extend through the carrier material from the first to the second surface. A radiofrequency microcoil is embedded in the macroporous carrier material. The detection coil former finds particular utility in an NMR overall analysis system for the NMR-spectroscopic analysis of chemical compounds in the liquid phase.

Abstract: There is provided a process for the preparation of bicyclicheteroaryl carboxaldehydes having the structural Formula I where X and Y are defined in the specification The bicyclic heteroaryl carboxaldehydes are useful as intermediates in the preparation of ?-lactamase inhibitors.