Abstract: Described herein are pick and place devices having reconfigurable nozzle subassemblies, as well as related devices and methods. In some embodiments, a pick and place device may have a reusable base plate, and a plurality of reusable vacuum nozzle subassemblies that are removably coupled to the base plate in a first configuration. In some embodiments, plurality of vacuum nozzle subassemblies may be removed, then removably re-coupled to the base plate in a second configuration. In some embodiments, a pick and place device may include a base plate, a plurality of nozzle subassemblies removably attached to the base plate, where individual nozzle subassemblies include a vacuum nozzle, a vacuum connection, and a base; and a top plate coupled to the base plate, where the top plate includes a plurality of openings configured to seat the plurality of nozzle subassemblies.

Abstract: A carrier medium for a semiconductor die includes a carrier tape with at least one pocket for the die to sit in and a selectively applied non-activated adhesive on the carrier tape.

Abstract: A carrier medium for a semiconductor die includes a carrier tape with at least one pocket for the die to sit in and a selectively applied non-activated adhesive on the carrier tape.

Abstract: Described herein are pick and place devices having reconfigurable nozzle subassemblies, as well as related devices and methods. In some embodiments, a pick and place device may have a reusable base plate, and a plurality of reusable vacuum nozzle subassemblies that are removably coupled to the base plate in a first configuration. In some embodiments, plurality of vacuum nozzle subassemblies may be removed, then removably re-coupled to the base plate in a second configuration. In some embodiments, a pick and place device may include a base plate, a plurality of nozzle subassemblies removably attached to the base plate, where individual nozzle subassemblies include a vacuum nozzle, a vacuum connection, and a base; and a top plate coupled to the base plate, where the top plate includes a plurality of openings configured to seat the plurality of nozzle subassemblies.

Abstract: Disclosed is an electrical connector assembly. The electrical connector assembly comprises a land grid array socket and the pick-and-placed (PnP) cap. The land grid array socket comprises a socket body and a loading mechanism. The PnP cap is removably attached to the peripheral edge of the socket body for covering a first surface of the socket body. The loading mechanism comprising a loading plate is mounted over the socket body and the PnP cap. The PnP cap detachably engages the loading plate, when the loading plate is mounted over the PnP cap.

Abstract: Embodiments of the invention provide single loading mechanism that both pushes a semiconductor package against a socket and pushes a cooling solution against the semiconductor package. This loading mechanism may take up less motherboard real estate than if two different attachment and loading mechanisms were used.

Abstract: A cooling device includes a heat sink (110) having a plurality of fins (111) and a piezoelectric assembly (120) having an actuator (121) and a plurality of blades (122) coupled to the actuator. The actuator includes a plurality of metal electrodes (227) and a plurality of piezoelectric layers (228). The fins of the heat sink are intertwined with the blades of the piezoelectric assembly.

Abstract: Embodiments of the invention provide single loading mechanism that both pushes a semiconductor package against a socket and pushes a cooling solution against the semiconductor package. This loading mechanism may take up less motherboard real estate than if two different attachment and loading mechanisms were used.

Abstract: A heat sink attachment clip for attaching a heat sink assembly to a frame, the heat sink attachment clip includes a pair of attachment brackets. Each attachment bracket has one or more attachment legs and each attachment leg has a clip attachment means for engagement with a corresponding frame attachment means. A levered cam is used to bear on heat sink assembly. The levered cam is moveable from a first position in which the levered cam does not press the heat sink assembly against the frame to a second position in which the levered cam the heat sink assembly presses the heat sink assembly against the frame. A a handle connects the levered cams of the two attachment clips so that movement of the handle engages both levered cams simultaneously.

Abstract: A folded fin heat sink assembly and a method of fabricating a folded fin heat sink assembly for use as a cooling solution in micro-electronics and/or telecommunication applications. The heat sink assembly is formed by placing a sheet or paste of Sn—Zn solder upon a copper base plate, placing one or more aluminum folded fin assemblies on the solder sheet or paste, heating the base plate, the folded fin assembly and the solder to a temperature exceeding the liquidus temperature of the solder and allowing the solder to flow, and cooling the solder to form a soldered joint between the base plate and the folded fin assembly.

Abstract: A heat sink attachment clip for attaching a heat sink assembly to a frame, the heat sink attachment clip includes a pair of attachment brackets. Each attachment bracket has one or more attachment legs and each attachment leg has a clip attachment means for engagement with a corresponding frame attachment means. A levered cam is used to bear on heat sink assembly. The levered cam is moveable from a first position in which the levered cam does not press the heat sink assembly against the frame to a second position in which the levered cam the heat sink assembly presses the heat sink assembly against the frame. A a handle connects the levered cams of the two attachment clips so that movement of the handle engages both levered cams simultaneously.

Abstract: A folded fin heat sink assembly and a method of fabricating a folded fin heat sink assembly for use as a cooling solution in micro-electronics and/or telecommunication applications. The heat sink assembly is formed by placing a sheet or paste of Sn—Zn solder upon a copper base plate, placing one or more aluminum folded fin assemblies on the solder sheet or paste, heating the base plate, the folded fin assembly and the solder to a temperature exceeding the liquidus temperature of the solder and allowing the solder to flow, and cooling the solder to form a soldered joint between the base plate and the folded fin assembly.