Patents by Inventor Allan F. Camp

Allan F. Camp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making wear-resistant printed wiring member
    Patent number: 8801914
    Abstract: A method for making a printed wiring member including wire-bondable contact pads and wear-resistant connector pads, the method includes a) providing a blank printed wiring member comprising a copper foil laminated to a dielectric substrate; b) masking the blank printed wiring member to protect regions of the copper foil; c) removing copper in unprotected regions of the blank printed wiring member to form a patterned printed wiring member including contact pads and connector pads; d) depositing a nickel coating on the patterned printed wiring member; e) electrolytically depositing a hard gold layer on the nickel coating; and f) depositing palladium on a surface of the hard gold layer to improve bondability of the contact pads while preserving wear resistance of the connector pads.
    Type: Grant
    Filed: May 26, 2011
    Date of Patent: August 12, 2014
    Assignee: Eastman Kodak Company
    Inventors: Samuel Chen, Allan F. Camp, Charles I. Levey, Vincent J. Andrews
  • METHOD OF MAKING WEAR-RESISTANT PRINTED WIRING MEMBER
    Publication number: 20120298517
    Abstract: A method for making a printed wiring member including wire-bondable contact pads and wear-resistant connector pads, the method includes a) providing a blank printed wiring member comprising a copper foil laminated to a dielectric substrate; b) masking the blank printed wiring member to protect regions of the copper foil; c) removing copper in unprotected regions of the blank printed wiring member to form a patterned printed wiring member including contact pads and connector pads; d) depositing a nickel coating on the patterned printed wiring member; e) electrolytically depositing a hard gold layer on the nickel coating; and f) depositing palladium on a surface of the hard gold layer to improve bondability of the contact pads while preserving wear resistance of the connector pads.
    Type: Application
    Filed: May 26, 2011
    Publication date: November 29, 2012
    Inventors: Samuel Chen, Allan F. Camp, Charles I. Levey, Vincent J. Andrews
  • Methods of forming semiconductor structure
    Patent number: 6436793
    Abstract: A method of forming a semiconductor structure from a first wafer and a second wafer. A pit or groove is formed in a lower surface of the first wafer. The lower surface of the first wafer is bonded to an upper surface of the second wafer. A groove is then formed on an upper surface of the first wafer, such that an opening is formed in the first wafer that exposes at least one alignment reference target on the upper surface of the second wafer. The bonded first wafer and second wafer is then diced using the exposed at least one alignment reference target to form a semiconductor structure.
    Type: Grant
    Filed: December 28, 2000
    Date of Patent: August 20, 2002
    Assignee: Xerox Corporation
    Inventors: Gary A. Kneezel, Daniel E. Kuhman, Brian T. Ormond, Ackerman C. John, Almon P. Fisher, Allan F. Camp, Lawrence H. Herko
  • Methods of forming semiconductor structure
    Publication number: 20020086452
    Abstract: A method of forming a semiconductor structure from a first wafer and a second wafer. A pit or groove is formed in a lower surface of the first wafer. The lower surface of the first wafer is bonded to an upper surface of the second wafer. A groove is then formed on an upper surface of the first wafer, such that an opening is formed in the first wafer that exposes at least one alignment reference target on the upper surface of the second wafer. The bonded first wafer and second wafer is then diced using the exposed at least one alignment reference target to form a semiconductor structure.
    Type: Application
    Filed: December 28, 2000
    Publication date: July 4, 2002
    Inventors: Gary A. Kneezel, Daniel E. Kuhman, Brian T. Ormond, John C. Ackerman, Almon P. Fisher, Allan F. Camp, Lawrence H. Herko