Abstract: Testing is performed on a semiconductor die (50) having a plurality of protruding electrical contacts (52) formed thereon. The test method uses a carrier (100) having a plurality of wells (110) formed in a dielectric layer (118) thereon. At least a portion of the protruding electrical contacts (52) is inserted into a corresponding portion of the plurality of wells (110) in order to make electrical connections between the semiconductor die (50) and the carrier (100) with minimal damage to the protruding electrical contacts (52). Testing (e.g. functional testing, burn-in testing, full-speed testing) of the semiconductor die (50) may then be performed using the electrical connections. Once testing of the semiconductor die (50) is completed, the semiconductor die (50) is removed from the carrier (100) and the carrier (100) may be reused for testing a different semiconductor die.

Abstract: A packaging tray includes a base member, first and second side members, and a first top member. The base member has a first plurality of channels defined therein. The first and second side members extend from the base and are rotatable with respect to the base. The first top member extends from one of the first and second side members and is rotatable with respect to the one of the first and second side members. The first top member includes a second plurality of channels defined therein. The first plurality of channels are aligned with the second plurality of channels.

Abstract: A semiconductor device (20) has a plurality of TAB leads (28) which facilitate lead bonding. The device is comprised of a semiconductor die (22) having a plurality of bonding pads (24) located thereon. On each of the bonding pads is a bump (26). Bonded to each of the bumps is a TAB lead (28) which has a recessed portion, such as a hole (30). The recessed portion or hole is placed over a protrusion of the bump, for example a tail of a ball bump, such that the lead is guided into the appropriate position relative to the bump during lead bonding, thereby preventing misalignment. The presence of the recessed portion in the lead also eliminates the need to flatten bumps prior to lead bonding.

Abstract: A continuous ionizer adapted to introduce selected ions into a continually flowing stream of liquid. To ensure that a maximum concentration of ions is incorporated, the continuous ionizer is configured so that turbulent and intimate mixing of the ionizing gas and liquid to be ionized occurs. The flow of ionizing gas is regulated by a liquid level sensor to prevent a gas/liquid mixture from proceeding downstream from the ionizer. The apparatus and method of this invention are particularly suited to situations where deionized water is used in a process which causes undesired static electricity discharges, and clean, ion-possessing water is preferred, such as semiconductor processing.