Abstract: An x-ray source assembly capable of producing x-rays suitable for use in medical, explosive detection, and other areas. The assembly includes a housing having a two-part socket member (which holds the assembly's x-ray tube therein) positioned therein. The two-part housing defines an opening through with the tube's x-rays are emitted.

Abstract: An x-ray source assembly capable of producing x-rays suitable for use in medical, explosive detection, and other areas. The assembly includes a housing having a two-part socket member (which holds the assembly's x-ray tube therein) positioned therein. The two-part housing defines an opening through with the tube's x-rays are emitted.

Abstract: A method for aligning a plurality of thin film transistor tiles for constructing a flat panel display. A coverplate is arranged on a coverplate support. A first layer of a bonding material is applied to at least one of a first side of each of the tiles and a surface of the coverplate on which the tiles are to be secured. The tiles are arranged on the coverplate, such that the first layer of bonding material is arranged between the tiles and the coverplate. The tiles are connected to an alignment apparatus. The tiles are aligned relative to each other and the coverplate. The tiles are at least partially secured to the coverplate.

Abstract: A selectively compliant chuck for assembling tiles into larger LCD displays facilitates alignment between a cover plate and a tile. A linear clutch is positioned between the tile chuck and the tile chuck carrier. This allows each chuck to float in the axis perpendicular to the tile's mating surface. The chuck has freedom to move linearly in this axis, and allows for pitch and roll motion as well. This floating connection can be turned on or off at will. Thus, a tile attached to the chuck can be lowered to intimately contact a cover plate and the chuck will compliantly move for high mating tolerances. Thereafter, the clutch can be locked to fix the chuck in it's current position. In this manner, the tile can be raised so that an adhesive can be applied to the cover plate. The tile can then be lowered back over the adhesive with the clutch locked and alignment maintained.

Abstract: A system for aligning and attaching together a plurality of thin film transistor tiles for constructing a flat panel display. A coverplate loading station where a coverplate that the tiles are to be attached to is arranged on a coverplate support. A coverplate bonding material dispensing station where a bonding material for bonding the tiles to the coverplate is applied to a surface of the coverplate. A tile placement station where the tiles are arranged on the coverplate. A tile aligning and securing station where the tiles are aligned relative to each other and the coverplate by the tile aligner and where the tiles are at least partially bonded to the coverplate. A tile assembly bonding material dispensing station where a bonding material is applied to a surface of the tiles opposite the side that the coverplate is bonded to. A backplate placement station where a backplate is arranged on the tiles.

Abstract: A method for aligning a plurality of thin film transistor tiles for constructing a flat panel display. A coverplate is arranged on a coverplate support. A first layer of a bonding material is applied to at least one of a first side of each of the tiles and a surface of the coverplate on which the tiles are to be secured. The tiles are arranged on the coverplate, such that the first layer of bonding material is arranged between the tiles and the coverplate. The tiles are connected to an alignment apparatus. The tiles are aligned relative to each other and the coverplate. The tiles are at least partially secured to the coverplate.

Abstract: A system for aligning and attaching together a plurality of thin film transistor tiles for constructing a flat panel display. A coverplate loading station where a coverplate that the tiles are to be attached to is arranged on a coverplate support. A coverplate bonding material dispensing station where a bonding material for bonding the tiles to the coverplate is applied to a surface of the coverplate. A tile placement station where the tiles are arranged on the coverplate. A tile aligning and securing station where the tiles are aligned relative to each other and the coverplate by the tile aligner and where the tiles are at least partially bonded to the coverplate. A tile assembly bonding material dispensing station where a bonding material is applied to a surface of the tiles opposite the side that the coverplate is bonded to. A backplate placement station where a backplate is arranged on the tiles.

Abstract: A method for aligning a plurality of thin film transistor tiles for constructing a flat panel display. A coverplate is arranged on a coverplate support. A first layer of a bonding material is applied to at least one of a first side of each of the tiles and a surface of the coverplate on which the tiles are to be secured. The tiles are arranged on the coverplate, such that the first layer of bonding material is arranged between the tiles and the coverplate. The tiles are connected to an alignment apparatus. The tiles are aligned relative to each other and the coverplate. The tiles are at least partially secured to the coverplate.