Abstract: An electrode having a substrate with a first layer covering at least a portion of the substrate, and a second layer covering at least a portion of the first layer is disclosed. The first layer includes a porous layer consisting of a carbide, nitride or carbonitride of at least one of the metals titanium, vanadium, zirconium, niobium, molybdenum, hafnium, tantalum or tungsten. The second layer includes iridium. In a method according to the present invention, a substrate is provided. A first layer is provided over at least a portion of the substrate, and a second layer is provided over at least a portion of the first layer. The first layer includes a layer consisting of a carbide, nitride or carbonitride of at least one of the metals titanium, vanadium, zirconium, niobium, molybdenum, hafnium, tantalum or tungsten. The second layer includes iridium.

Abstract: A feedthrough device and brazing process for joining the constituent parts of the feedthrough while allowing a lead to pass therethrough in a nonconductive manner is described. The feedthrough comprises at least one lead, a ferrule defining a capacitor recess and an insulator recess. An insulator disposed in the insulator recess defines a passageway allowing the lead to pass therethrough. A capacitor disposed in the capacitor recess defines a capacitor passageway allowing the lead to pass therethrough. The capacitor comprises first and second sets of plates, the first set being conductively coupled to the ferrule and the second set being conductively coupled to the lead. The braze joints between the insulator and the lead and between the insulator and ferrule are formed first at a first temperature using an insulator braze material.

Abstract: An electrode having a substrate with a first layer covering at least a portion of the substrate, and a second layer covering at least a portion of the first layer is disclosed. The first layer includes a porous layer consisting of a carbide, nitride or carbonitride of at least one of the metals titanium, vanadium, zirconium, niobium, molybdenum, hafnium, tantalum or tungsten. The second layer includes iridium. In a method according to the present invention, a substrate is provided. A first layer is provided over at least a portion of the substrate, and a second layer is provided over at least a portion of the first layer. The first layer includes a layer consisting of a carbide, nitride or carbonitride of at least one of the metals titanium, vanadium, zirconium, niobium, molybdenum, hafnium, tantalum or tungsten. The second layer includes iridium.

Abstract: A feedthrough device and brazing process for joining the constituent parts of the feedthrough device, while allowing a lead to pass therethrough in a nonconductive manner. The feedthrough comprises at least one lead, a ferrule defining a capacitor recess and defining an insulator recess, an insulator disposed in the insulator recess of the ferrule, the insulator defining a passageway sized to allow the lead to pass therethrough. The feedthrough further comprises a capacitor disposed in the capacitor recess and defining a capacitor passageway sized to allow the lead to pass threrethrough, and the capacitor comprises first and second sets of plates, wherein the first set of plates is conductively coupled to the ferrule and the second set of plates is conductively coupled to the lead. Brazing is a two step process wherein the braze joints between the insulator and the lead and between the insulator and ferrule are formed first at a first temperature using an insulator braze material.

Abstract: A feedthrough device and brazing process for joining the constituent parts of the feedthrough device, while allowing a lead to pass therethrough in a nonconductive manner. The feedthrough comprises at least one lead, a ferrule defining a capacitor recess and defining an insulator recess, an insulator disposed in the insulator recess of the ferrule, the insulator defining a passageway sized to allow the lead to pass therethrough. The feedthrough further comprises a capacitor disposed in the capacitor recess and defining a capacitor passageway sized to allow the lead to pass threrethrough, and the capacitor comprises first and second sets of plates, wherein the first set of plates is conductively coupled to the ferrule and the second set of plates is conductively coupled to the lead. Brazing is a two step process wherein the braze joints between the insulator and the lead and between the insulator and ferrule are formed first at a first temperature using an insulator braze material.

Abstract: An electrode having a substrate with a first layer covering at least a portion of the substrate, and a second layer covering at least a portion of the first layer is disclosed. The first layer includes a porous layer consisting of a carbide, nitride or carbonitride of at least one of the metals titanium, vanadium, zirconium, niobium, molybdenum, hafnium, tantalum or tungsten. The second layer includes iridium.

Abstract: Filtered feedthrough assembly (100, 200) is formed by mounting a filter support assembly (130, 130', 230) having a capacitor (110,210) mounted thereto, to a conductive feedthrough (10, 10'). The conductive feedthrough includes a metallic ferrule (14, 14') having a centrally disposed through opening (28) extending between opposing ends thereof. At least one elongate lead wire (12) extends through the ferrule through opening. A hermetic seal insulator (20, 20') is disposed within the central opening of the ferrule and is sealed thereto. The filter support assembly (130, 130', 230) includes an insulative substrate (132, 132', 132") having a first metallization pattern (133, 314) formed on an upper surface (138, 138") thereof. A second metallization pattern (135, 316) is formed on the lower surface (124, 124') of substrate (132, 132', 132").

Abstract: A filtered feedthrough assembly (100, 100', 100", 200, 200", 300) for use in implantable medical devices is provided. The filtered feedthrough assembly provides at least one chip capacitor (110, 210) or an LC circuit coupled between a lead wire (12) and an end surface (18) of a metallic ferrule (14). The chip capacitor is secured in position by means of a [non-conductive film (122) and] conductive material (120) applied to opposing ends of the chip capacitor. The end portion of the feedthrough and chip capacitor may be encapsulated by an encapsulant (102) to provide a moisture resistant coating therefor.

Abstract: A dielectric ceramic composition is disclosed comprising lead magnesium niobate and strontium titanate, barium titanate or a combination thereof. Dopants such as Ta, La, Y, Eu, Nd, Sm, Gd, W, Si, Zr and Sb may also be included in the composition. The lead magnesium niobate with strontium titanate and/or barium titanate composition has been found to possess extremely favorable properties such as high dielectric constant, low dielectric loss, high breakdown strength, low field-induced strain, high electrical resistivity and exceptionally high energy storage capacity. A process is also disclosed for the production of dielectric ceramic materials which includes the use of hot isostatic pressing in an oxygen-containing atmosphere. The disclosed dielectric compositions are useful in capacitors for many applications, including medical devices such as defibrillators and pacemakers.

Abstract: A thermoelectric heat pump having first and second substrates with first and second copper metalizations formed thereon. The first and second copper metalizations are coated with nickel for soldering with a 90-10 lead-antimony solder having a eutectic temperature of about 251 degrees Celsius to nickel plates coated on first and second ends of n-type and p-type thermoelectric elements. The n-type and p-type semiconductor elements are arranged in an array of rows and columns with alternatively n-type and p-type elements connected in series with a first n-type element having a lead for connection to first terminal of a dc power source and a last p-type element having a lead for connection to a second terminal of a dc power source.