Abstract: A wall structure and a method for constructing the wall of a building provide protection for inhabitants of the building against ballistic projectiles impacting the wall. The wall structure includes an outer panel and an inner panel. The inner panel is a composite structure that includes a metal sheet having a first face attached to a wallboard panel. Preferably, a sheet of self-healing material is attached to a second face of the metal sheet. A cavity formed between the outer and inner panels is filled with sand or another granular material. A flexible sheet suspended in the cavity provides additional protection. Preferably, a sheet of woven para-aramid fiber such as Kevlar® brand fiber is loosely attached to the flexible sheet to provide further protection.

Abstract: A shear wall structure is formed on a building wall or section thereof designed to accommodate anticipated wind or seismic shear loads by initially securing one or more subsurface shear panels on the interior or exterior sides of the wood or steel framing studs. Each shear panel consists of a thin steel sheet (0.015? to 0.060? thick) laminated to a thin rigid sheet material such as medium density fiberboard ( 1/16? to ¼? thick). Subsequently, the shear panels are covered with a conventional interior (e.g., drywall panels) or exterior (e.g., plaster) finishing materials.

Abstract: A compression post for a shear wall includes a plate mounted to the bottom of an end post of a shear wall. The plate is sized to conform to the lower end of each end post. An extended portion (e.g., a cylinder) is positioned perpendicularly to the plate. The extended portion has a cross section sized to fit through a hole in a mudsill of the shear wall and has a length selected to conform with a thickness of the mudsill. When the shear wall is mounted on a structural support (e.g., a footing or foundation), forces applied to the end post pass through the plate and the extended portion to the structural support. The extended portion may be secured to the plate (e.g., by spot welding, press fitting, bolting, or threaded engagement) or the two portions may be independent. The two portions may also be a cast unitary body.

Abstract: A method for insuring that the sidewall of a P+ PN+ layered junction mesa semiconductor structure is tapered smoothly from the P layer to the N+ layer of the structure upon formation thereof by immersion of a wafer comprised of the structure in an etchant of 3% HF and 97% HNO.sub.3, comprising the steps of placing an etch mask dot having a diameter slightly less than the greatest diameter required for the N+ layer above the P+ layer at a preselected site on the wafer, preselecting a specific ratio of etchant quantity to P silicon quantity, immersing the wafer in the preselected quantity of the etchant, and withdrawing the wafer from the etchant at the instant at which the silicon is removed from around the dot.

Abstract: An improved method of manufacturing a semi-conductor device having a lead bonded to a surface thereof, wherein the device is fabricated by removing a section of a substrate which surrounds a surface portion of the substrate comprising the surface to which the lead is bonded, includes bonding the lead to the surface portion of the substrate prior to removing the section.