Abstract: Provided herein is a method of processing an electronic device including operating a processing chamber at a first temperature while a workpiece is being processed and removing the workpiece and a carrier holding the workpiece from the processing chamber while decreasing the temperature within the processing chamber to a second temperature significantly lower than the first temperature. The method also includes increasing the temperature within the processing chamber to a third temperature significantly greater than the second temperature and significantly less than the first temperature while the processing chamber has no workpiece or carrier within.

Abstract: Provided herein is a method of processing an electronic device including operating a processing chamber at a first temperature while a workpiece is being processed and removing the workpiece and a carrier holding the workpiece from the processing chamber while decreasing the temperature within the processing chamber to a second temperature significantly lower than the first temperature. The method also includes increasing the temperature within the processing chamber to a third temperature significantly greater than the second temperature and significantly less than the first temperature while the processing chamber has no workpiece or carrier within.

Abstract: A method and apparatus for reducing byproduct induced defects in a processing tool is provided. A purge gas is introduced into a vessel of the processing tool. The vessel is heated to a temperature above a vaporization temperature of the byproduct. The temperature is maintained for a predetermined period of time. The vessel is purged to remove at least a portion of the byproduct.

Abstract: An LPCVD system is provided in which a thermocouple mounting system is configured to inhibit motion of a thermocouple with respect to an LPCVD reactor. The thermocouple mounting system includes an improved thermocouple mounting bushing that forms a fixable engagement with a thermocouple mounting hub. The thermocouple mounting bushing compresses a clip ring against both the thermocouple and the thermocouple mounting hub during use to inhibit motion of the thermocouple. The improved thermocouple mounting system inhibits contact between the thermocouple and a quartz liner within the reactor during use, thus minimizing formation of contaminating particles. The thermocouple mounting system further maintains the thermocouple in proper alignment according to design criteria such that accurate temperature readings are supplied to a temperature controller during use.