Patents by Inventor Allen Tseng
Allen Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240158920Abstract: Disclosed herein is a system for treating a magnesium or a magnesium alloy substrate comprising: a first pretreatment composition comprising a fluorometallic acid and free fluoride in an amount of 10 ppm to 500 ppm based on total weight of the first pretreatment composition and having a pH of 1.0 to 4.0; and a second pretreatment composition comprising a lanthanide series metal, the second pretreatment composition being substantially free of peroxide. Also disclosed are methods of treating a magnesium or magnesium alloy substrate. Treated magnesium and magnesium alloy substrates also are disclosed.Type: ApplicationFiled: January 19, 2022Publication date: May 16, 2024Applicant: PPG Industries Ohio, Inc.Inventors: Kuldeep Kumar, Rachel Dory Harris, Elizabeth Stephenie Brown-Tseng, Kristi Maree Allen, Steven Edward Bowles, Silvia Bezer, Steven Joseph Lemon, Mark William McMillen
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Publication number: 20240150593Abstract: Disclosed is a sealing composition for treating a metal substrate comprising: a polyolefin component; and a colloidal layered silicate. Also disclosed is a system for treating a metal substrate comprising: a cleaner composition; and/or a pretreatment composition for treating at least a portion of the substrate, the pretreatment composition comprising a Group IVB metal; and a sealing composition for treating at least a portion of the substrate treated with the cleaner composition and/or the pretreated composition, the sealing composition comprising a polyolefin component. Also disclosed is a method of treating a substrate comprising contacting at least a portion of a surface of the substrate with any of the compositions disclosed herein or any of the systems disclosed herein.Type: ApplicationFiled: March 4, 2022Publication date: May 9, 2024Applicant: PPG Industries Ohio, Inc.Inventors: Corey James DeDomenic, Kristi Maree Allen, Elizabeth Stephenie Brown-Tseng, Peter Lawrence Votruba-Drzal, Silvia Bezer, Michael Gerard Olah, Steven Edward Bowles, Mary Lyn Chong Lim, Mark William McMillen
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Publication number: 20220031865Abstract: The invention described herein provides gene therapy vectors, such as adeno-associated virus (AAV) vectors, that co-express a functional protein (such as a miniaturized human micro-dystrophin gene product) and one or more additional coding sequences for an RNAi sequence (siRNA, shRNA, miRNA), an antisense sequence, a guide sequence for a gene editing enzyme (such as an sgRNA for CRISPR/Cas9, or a crRNA for CRISPR/Casl2a), and/or a micro RNA, and methods of using the vectors to treat subjects suffering from a muscular dystrophy such as DMD/BMD.Type: ApplicationFiled: December 11, 2019Publication date: February 3, 2022Inventors: Senthil Ramu, Joel Schneider, Kathy Ye Morgan, Wen Allen Tseng, Fatih Ozsolak, Meghan Soustek-Kramer, Eric Reyes, Sarath Mandava
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Patent number: 11150189Abstract: A method of manufacturing a light source carrier with at least one light source, including: providing a substrate with a plurality of light source groups disposed thereon, wherein each light source group includes the at least one light source; irradiating a first light upon one of the light source groups through a first mask; capturing a photoluminescent light emitted by the one of the light source groups to acquire data; comparing the data with a reference to determine whether the one of the light source groups is qualified; providing a carrier; and transferring the one of the light source groups from the substrate to the carrier if the one of the light source groups is qualified.Type: GrantFiled: September 3, 2019Date of Patent: October 19, 2021Assignee: INNOLUX CORPORATIONInventors: Wan-Ting Ke, Allen Tseng, Wen-Hsiang Liao, Yi-Chen Chou
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Publication number: 20210115413Abstract: Disclosed herein are methods of generating proteoglycans with distinct glycan structures in engineered, non-naturally occurring eukaryotic cells. These methods make accessible a dynamic range of protein glycosylation. Compositions of engineered, non-naturally occurring cells capable of generating these proteoglycans are also disclosed herein.Type: ApplicationFiled: June 20, 2019Publication date: April 22, 2021Applicants: Massachusetts Institute of Technology, Pfizer Inc.Inventors: Michelle Chang, Leonid A. Gaydukov, Giyoung Jung, Nevin M. Summers, Timothy Kuan-Ta Lu, Ron Weiss, John Scarcelli, Richard Cornell, Jeffrey Marshall, Bruno Figueroa, Wen Allen Tseng
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Patent number: 9478578Abstract: An embodiment semiconductor device includes a substrate such as a silicon or silicon-containing film, a pixel array supported by the substrate, and a metal stress release feature arranged around a periphery of the pixel array. The metal stress release feature may be formed from metal strips or discrete metal elements. The metal stress release feature may be arranged in a stress release pattern that uses a single line or a plurality of lines. The metal stress release pattern may also use metal corner elements at ends of the lines.Type: GrantFiled: October 26, 2015Date of Patent: October 25, 2016Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chi-Cherng Jeng, Chun-Hao Chou, Tsung-Han Tsai, Kuo-Cheng Lee, Volume Chien, Yen-Hsung Ho, Allen Tseng
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Patent number: 9324752Abstract: The disclosure provides an image sensor device and a manufacturing method. The image sensor device includes a semiconductor substrate and a light sensing region in the semiconductor substrate. The image sensor device also includes a light blocking structure in the semiconductor substrate and adjacent to the light sensing region. A sidewall of the light blocking structure is a curved surface.Type: GrantFiled: February 27, 2014Date of Patent: April 26, 2016Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Volume Chien, Kun-Huei Lin, Chia-Yu Wei, Allen Tseng, Chi-Cherng Jeng, Chuan-Pu Liu
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Publication number: 20160043129Abstract: An embodiment semiconductor device includes a substrate such as a silicon or silicon-containing film, a pixel array supported by the substrate, and a metal stress release feature arranged around a periphery of the pixel array. The metal stress release feature may be formed from metal strips or discrete metal elements. The metal stress release feature may be arranged in a stress release pattern that uses a single line or a plurality of lines. The metal stress release pattern may also use metal corner elements at ends of the lines.Type: ApplicationFiled: October 26, 2015Publication date: February 11, 2016Inventors: Chi-Cherng Jeng, Chun-Hao Chou, Tsung-Han Tsai, Kuo-Cheng Lee, Volume Chien, Yen-Hsung Ho, Allen Tseng
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Patent number: 9201195Abstract: The present disclosure provides an integrated circuit device comprising a substrate having a back surface and a sensing region disposed in the substrate and being operable to sense radiation projected towards the back surface of the substrate. The device further includes a waveguide disposed over the back surface of the substrate. The waveguide is aligned with the sensing region such that the waveguide is operable to transmit the radiation towards the aligned sensing region. The waveguide includes a waveguide wall, and an inner region disposed adjacent to the waveguide wall. A diffractive index of the waveguide wall is less than a diffractive index of the inner region.Type: GrantFiled: June 28, 2013Date of Patent: December 1, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Allen Tseng, Che-Min Lin, Zen-Fong Huang, Volume Chien, Chi-Cherng Jeng
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Patent number: 9196642Abstract: An embodiment semiconductor device includes a substrate such as a silicon or silicon-containing film, a pixel array supported by the substrate, and a metal stress release feature arranged around a periphery of the pixel array. The metal stress release feature may be formed from metal strips or discrete metal elements. The metal stress release feature may be arranged in a stress release pattern that uses a single line or a plurality of lines. The metal stress release pattern may also use metal corner elements at ends of the lines.Type: GrantFiled: December 7, 2012Date of Patent: November 24, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tsung-Han Tsai, Allen Tseng, Yen-Hsung Ho, Chun-Hao Chou, Kuo-Cheng Lee, Volume Chien, Chi-Cherng Jeng
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Publication number: 20150243696Abstract: The disclosure provides an image sensor device and a manufacturing method. The image sensor device includes a semiconductor substrate and a light sensing region in the semiconductor substrate. The image sensor device also includes a light blocking structure in the semiconductor substrate and adjacent to the light sensing region. A sidewall of the light blocking structure is a curved surface.Type: ApplicationFiled: February 27, 2014Publication date: August 27, 2015Applicant: Taiwan Semiconductor Manufacturing Co., LtdInventors: Volume CHIEN, Kun-Huei LIN, Chia-Yu WEI, Allen TSENG, Chi-Cherng JENG, Chuan-Pu LIU
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Publication number: 20150003777Abstract: The present disclosure provides an integrated circuit device comprising a substrate having a back surface and a sensing region disposed in the substrate and being operable to sense radiation projected towards the back surface of the substrate. The device further includes a waveguide disposed over the back surface of the substrate. The waveguide is aligned with the sensing region such that the waveguide is operable to transmit the radiation towards the aligned sensing region. The waveguide includes a waveguide wall, and an inner region disposed adjacent to the waveguide wall. A diffractive index of the waveguide wall is less than a diffractive index of the inner region.Type: ApplicationFiled: June 28, 2013Publication date: January 1, 2015Inventors: Allen Tseng, Che-Min Lin, Zen-Fong Huang, Volume Chien, Chi-Cherng Jeng
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Publication number: 20140070352Abstract: An embodiment semiconductor device includes a substrate such as a silicon or silicon-containing film, a pixel array supported by the substrate, and a metal stress release feature arranged around a periphery of the pixel array. The metal stress release feature may be formed from metal strips or discrete metal elements. The metal stress release feature may be arranged in a stress release pattern that uses a single line or a plurality of lines. The metal stress release pattern may also use metal corner elements at ends of the lines.Type: ApplicationFiled: December 7, 2012Publication date: March 13, 2014Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Tsung-Han Tsai, Allen Tseng, Yen-Hsung Ho, Chun-Hao Chou, Kuo-Cheng Lee, Volume Chien, Chi-Cherng Jeng