Abstract: A method for imaging a surface, including scanning a first region of the surface with a primary charged particle beam at a first scan rate so as to generate a first secondary charged particle beam from the first region, and scanning a second region of the surface with the primary charged particle beam at a second scan rate faster than the first scan rate so as to generate a second secondary charged particle beam from the second region. The method also includes receiving the first secondary charged particle beam and the second secondary charged particle beam at a detector configured to generate a signal in response to the beams, and forming an image of the first and the second regions in response to the signal.

Abstract: A method for writing a master image on a substrate includes dividing the master image into a matrix of frames, each frame including an array of pixels defining a respective frame image in a respective frame position within the master image. An electron beam is scanned in a raster pattern over the substrate, while shaping the electron beam responsively to the respective frame image of each of the frames as the electron beam is scanned over the respective frame position, so that in each frame, the electron beam simultaneously writes a multiplicity of the pixels onto the substrate.

Abstract: A method for scanning a surface, consisting of focusing an array of beams using optics having an axis, so as to irradiate a region of the surface intercepted by the axis, such that each beam irradiates a portion of a respective sub-region within the region. The method further includes moving at least one of the array and the surface so as to cause a translation of the surface relative to the axis in a first direction. During the translation in the first direction, each of the beams is scanned over the respective sub-region in a second direction, which is different from the first direction.

Abstract: A method for scanning a surface, consisting of focusing an array of optical beams using optics having an axis, so as to illuminate a region of the surface intercepted by the axis, such that each optical beam illuminates a portion of a respective sub-region within the region. The method further includes moving at least one of the array and the surface so as to cause a translation of the surface relative to the axis in a first direction. During the translation in the first direction, each of the optical beams is scanned over the respective sub-region in a second direction, which is different from the first direction.

Abstract: An electrostatic chuck is configured for electrostatically securing a wafer while limiting charge on the wafer and physical contact between the electrostatic chuck and the wafer. The electrostatic chuck has a pair of electrodes and at least one support pin electrically isolated from the electrodes. The top portion of the support pin protrudes above the top surface of the electrodes. The support pin can be such that the top portion of the support pin is adjustable with respect to the top surfaces of the electrodes.

Abstract: A multi beam inspection method and system. The inspection system includes: (i) a beam array generator adapted to generate an array of beams characterized by a beam array axis; and (ii) at least one mechanism adapted to position the object under the array of beams such that at least two beams that are positioned along a beam array axis scan substantially simultaneously at least two regions of interest of the object, wherein the first axis is oriented in relation to the beam array axis.

Abstract: A method for scanning a surface, consisting of focusing an array of optical beams using optics having an axis, so as to illuminate a region of the surface intercepted by the axis, such that each optical beam illuminates a portion of a respective sub-region within the region. The method further includes moving at least one of the array and the surface so as to cause a translation of the surface relative to the axis in a first direction. During the translation in the first direction, each of the optical beams is scanned over the respective sub-region in a second direction, which is different from the first direction.

Abstract: A method for scanning a surface, consisting of focusing an array of beams using optics having an axis, so as to irradiate a region of the surface intercepted by the axis, such that each beam irradiates a portion of a respective sub-region within the region. The method further includes moving at least one of the array and the surface so as to cause a translation of the surface relative to the axis in a first direction. During the translation in the first direction, each of the beams is scanned over the respective sub-region in a second direction, which is different from the first direction.

Abstract: A method for writing a master image on a substrate includes dividing the master image into a matrix of frames, each frame including an array of pixels defining a respective frame image in a respective frame position within the master image. An electron beam is scanned in a raster pattern over the substrate, while shaping the electron beam responsively to the respective frame image of each of the frames as the electron beam is scanned over the respective frame position, so that in each frame, the electron beam simultaneously writes a multiplicity of the pixels onto the substrate.

Abstract: A method for writing a master image on a substrate includes dividing the master image into a matrix of frames, each frame including an array of pixels defining a respective frame image in a respective frame position within the master image. An electron beam is scanned in a raster pattern over the substrate, while shaping the electron beam responsively to the respective frame image of each of the frames as the electron beam is scanned over the respective frame position, so that in each frame, the electron beam simultaneously writes a multiplicity of the pixels onto the substrate.

Abstract: A method for writing a master image on a substrate includes dividing the master image into a matrix of frames, each frame including an array of pixels defining a respective frame image in a respective frame position within the master image. An electron beam is scanned in a raster pattern over the substrate, while shaping the electron beam responsively to the respective frame image of each of the frames as the electron beam is scanned over the respective frame position, so that in each frame, the electron beam simultaneously writes a multiplicity of the pixels onto the substrate.

Abstract: A multi beam inspection method and system. The inspection system includes: (i) a beam array generator adapted to generate an array of beams characterized by a beam array axis; and (ii) at least one mechanism adapted to position the object under the array of beams such that at least two beams that are positioned along a beam array axis scan substantially simultaneously at least two regions of interest of the object, wherein the first axis is oriented in relation to the beam array axis.

Abstract: A method for writing a master image on a substrate includes dividing the master image into a matrix of frames, each frame including an array of pixels defining a respective frame image in a respective frame position within the master image. An electron beam is scanned in a raster pattern over the substrate, while shaping the electron beam responsively to the respective frame image of each of the frames as the electron beam is scanned over the respective frame position, so that in each frame, the electron beam simultaneously writes a multiplicity of the pixels onto the substrate.

Abstract: A system and method is provided for testing the resistance of a test wafer having multiple conductors. Embodiments include a method having the steps of providing a signal that is substantially larger than a signal threshold to a test structure; and scanning at least two conductors of the test structure, that are electrically couplet to each other, by a limited voltage resolution SEM. Charged particles emitted from the at least two conductors as a result of the scanning are collected, thus providing an indication about a resistance of the at least two conductors.

Abstract: An electrostatic chuck is configured for electrostatically securing a wafer while limiting charge on the wafer and physical contact between the electrostatic chuck and the wafer. The electrostatic chuck has a pair of electrodes and at least one support pin electrically isolated from the electrodes. The top portion of the support pin protrudes above the top surface of the electrodes. The support pin can be such that the top portion of the support pin is adjustable with respect to the top surfaces of the electrodes.

Abstract: A system and method for testing the resistance of a test wafer that comprises multiple conductors, the method includes the steps of: (i) Providing a signal that is substantially larger than a signal threshold to a test structure; and (ii) Scanning at least a two conductors of the test structure, by a limited voltage resolution SEM, said at least two conductors are electrically coupled to each other, and collecting charged particles emitted from the at least two conductors as a result of the scanning, thus providing an indication about a resistance of the at least two conductors.

Abstract: A particle beam column for high-resolution imaging and measurement of topographic and material features on a specimen. The particle beam column includes a particle source for providing a primary beam along a primary beam axis for impinging on the specimen so as to release secondary electrons and backscattered electrons therefrom. The particle beam column also includes an objective lens for focussing the electrons so as to provide a radial dispersion of electrons relative to the primary beam axis, the radial dispersion of electrons including an inner annulus of backscattered electrons and an outer annulus of secondary electrons. The particle beam column still further includes a backscattered electron detector for detecting the inner annulus of backscattered electrons and a secondary electron detector for detecting the outer annulus of secondary electrons.

Abstract: An electron detector for use in particle beam apparatus, providing particularly high acceptance of backscattered electrons. The electron detector includes an electron multiplier for detecting electrons and an electrode deployed between the electron multiplier and a specimen. The electrode is biased at a negative potential with respect to the specimen and also with respect to the electron multiplier.