Patents by Inventor Alonso Loa Almaguer

Alonso Loa Almaguer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire set having a sheath bonded to a polyvinylchloride overmolding using polyurethane
    Patent number: 8602820
    Abstract: An electrical apparatus according to the present disclosure comprises a molded device having a molded portion and being formed via an overmolding process. The electrical apparatus includes a wire set at least partially overmolded within the device, the wire set having an outer sheath surrounding a plurality of wires. The molded portion surrounds a portion of the wire set. The electrical apparatus further includes polyurethane bonding material occurring between the outer sheath and the molded portion. The polyurethane bonding material bonds at least a portion of the wire set to the molded portion during the overmolding process.
    Type: Grant
    Filed: December 1, 2011
    Date of Patent: December 10, 2013
    Assignee: Grote Industries, Inc.
    Inventors: Miguel Omar Cortes Roque, Roberto Carlos Garcia Cardona, Alonso Loa Almaguer, Robert Hugh Dobrow, Hector Eloy Mendoza Alvarado, Alfredo Haros Hernandez, Antonio Leal Morales
  • Method for polyurethane bonding during and after overmolding
    Patent number: 8226872
    Abstract: An electrical apparatus according to the present disclosure comprises a molded device having a molded portion and being formed via an overmolding process. The electrical apparatus includes a wire set at least partially overmolded within the device, the wire set having an outer sheath surrounding a plurality of wires. The molded portion surrounds a portion of the wire set. The electrical apparatus further includes polyurethane bonding material occurring between the outer sheath and the molded portion. The polyurethane bonding material bonds at least a portion of the wire set to the molded portion during the overmolding process.
    Type: Grant
    Filed: January 18, 2010
    Date of Patent: July 24, 2012
    Assignee: Grote Industries, Inc.
    Inventors: Miguel Omar Cortes Roque, Roberto Carlos Garcia Cardona, Alonso Loa Almaguer, Robert Hugh Dobrow, Hector Eloy Mendoza Alvarado, Alfredo Haros Hernandez, Antonio Leal Morales
  • SYSTEM AND METHOD FOR POLYURETHANE BONDING DURING AND AFTER OVERMOLDING
    Publication number: 20120077378
    Abstract: An electrical apparatus according to the present disclosure comprises a molded device having a molded portion and being formed via an overmolding process. The electrical apparatus includes a wire set at least partially overmolded within the device, the wire set having an outer sheath surrounding a plurality of wires. The molded portion surrounds a portion of the wire set. The electrical apparatus further includes polyurethane bonding material occurring between the outer sheath and the molded portion. The polyurethane bonding material bonds at least a portion of the wire set to the molded portion during the overmolding process.
    Type: Application
    Filed: December 1, 2011
    Publication date: March 29, 2012
    Inventors: Miguel Omar Cortes Roque, Roberto Carlos Garcia Cardona, Alonso Loa Almaguer, Robert Hugh Dobrow, Hector Eloy Mendoza Alvarado, Alfredo Haros Hernandez, Antonio Leal Morales
  • System and Method for Polyurethane Bonding During and After Overmolding
    Publication number: 20110177720
    Abstract: An electrical apparatus according to the present disclosure comprises a molded device having a molded portion and being formed via an overmolding process. The electrical apparatus includes a wire set at least partially overmolded within the device, the wire set having an outer sheath surrounding a plurality of wires. The molded portion surrounds a portion of the wire set. The electrical apparatus further includes polyurethane bonding material occurring between the outer sheath and the molded portion. The polyurethane bonding material bonds at least a portion of the wire set to the molded portion during the overmolding process.
    Type: Application
    Filed: January 18, 2010
    Publication date: July 21, 2011
    Inventors: Miguel Omar Cortes Roque, Roberto Carlos Garcia Cardona, Alonso Loa Almaguer, Robert Hugh Dobrow, Hector Eloy Mendoza Alvarado, Alfredo Haros Hernandez, Antonio Leal Morales