Abstract: A probe structure for an electronic device is provided. In one aspect, the probe structure includes an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure includes an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier. The probe structure includes one or more other contact structures adapted for connection to a test apparatus.

Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.

Abstract: A video processing method and system for generating a foveated video display with sections having different resolutions uses a network channel for communicating video images having video sections of different resolutions, and includes a video transmission system for processing and transmitting the received video images over the network channel. The system assigns a larger portion of the network channel's bandwidth to a video section with higher resolution. Further, the system includes a video receiving system for receiving and seamlessly combining the first and second video sections of different resolutions to form an output video image on a display device, and a control unit for sending one or more video control parameters to the video transmission system to control capturing, transmitting and processing of the video images.

Abstract: Integrated optoelectronic chips or collections of chips on a module that have both electrical as well as optical interconnects offer many advantages in speed, power consumption and heat generation. Mixed signal types, however, pose significant packaging challenges. This invention describes a land grid array (LGA) interposer which can simultaneously connect electrical and optical signals from a module to a printed circuit board.