Patents by Inventor ALVIN LOPEZ ANDAYA

ALVIN LOPEZ ANDAYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Textured bond pads
    Patent number: 11600583
    Abstract: In some examples, a package comprises a semiconductor die and a bond pad formed upon the semiconductor die. The bond pad has a protrusion on a top surface of the bond pad. The package also comprises a metal contact and a bond wire coupled to the protrusion and to the metal contact.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: March 7, 2023
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Rafael Jose Lizares Guevara, Aniceto Tabangcura Rabilas, Jr., Ray Fredric Solis de Asis, Sylvester Tigno Sanchez, Alvin Lopez Andaya
  • Textured Bond Pads
    Publication number: 20210320074
    Abstract: In some examples, a package comprises a semiconductor die and a bond pad formed upon the semiconductor die. The bond pad has a protrusion on a top surface of the bond pad. The package also comprises a metal contact and a bond wire coupled to the protrusion and to the metal contact.
    Type: Application
    Filed: June 23, 2021
    Publication date: October 14, 2021
    Inventors: Rafael Jose Lizares Guevara, Aniceto Tabangcura Rabilas, JR., Ray Fredric Solis de Asis, Sylvester Tigno Sanchez, Alvin Lopez Andaya
  • Textured bond pads
    Patent number: 11081456
    Abstract: In some examples, a package comprises a semiconductor die and a bond pad formed upon the semiconductor die. The bond pad has a protrusion on a top surface of the bond pad. The package also comprises a metal contact and a bond wire coupled to the protrusion and to the metal contact.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: August 3, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Rafael Jose Lizares Guevara, Aniceto Tabangcura Rabilas, Jr., Ray Fredric Solis de Asis, Sylvester Tigno Sanchez, Alvin Lopez Andaya
  • TEXTURED BOND PADS
    Publication number: 20210066220
    Abstract: In some examples, a package comprises a semiconductor die and a bond pad formed upon the semiconductor die. The bond pad has a protrusion on a top surface of the bond pad. The package also comprises a metal contact and a bond wire coupled to the protrusion and to the metal contact.
    Type: Application
    Filed: August 28, 2019
    Publication date: March 4, 2021
    Inventors: Rafael Jose Lizares GUEVARA, Aniceto Tabangcura RABILAS, JR., Ray Fredric Solis de ASIS, Sylvester Tigno SANCHEZ, Alvin Lopez ANDAYA
  • Dicing A Wafer
    Publication number: 20200203227
    Abstract: A method for dicing a wafer includes scribing perforations in a wafer. The wafer has a monocrystalline structure and the perforations have a polycrystalline structures The method also includes adhering the wafer to a top surface of a dicing tape and applying a downward force on a periphery of the dicing tape. The downward force causes a bottom surface of the dicing tape to deform around a contour of a dome shaped chuck, breaking the perforations in the wafer.
    Type: Application
    Filed: March 4, 2020
    Publication date: June 25, 2020
    Inventors: Jerry Gomez Cayabyab, Jennifer Otero Aspuria, Julian Carlo Barbadillo, Alvin Lopez Andaya
  • Dicing a wafer
    Patent number: 10615075
    Abstract: A method for dicing a wafer includes scribing perforations in a wafer. The wafer has a monocrystalline structure and the perforations have a polycrystalline structure. The method also includes adhering the wafer to a top surface of a dicing tape and applying a downward force on a periphery of the dicing tape. The downward force causes a bottom surface of the dicing tape to deform around a contour of a dome-shaped chuck, breaking the perforations in the wafer.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: April 7, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Jerry Gomez Cayabyab, Jeniffer Otero Aspuria, Julian Carlo Concepc Barbadillo, Alvin Lopez Andaya
  • DICING A WAFER
    Publication number: 20190385911
    Abstract: A method for dicing a wafer includes scribing perforations in a wafer. The wafer has a monocrystalline structure and the perforations have a polycrystalline structure. The method also includes adhering the wafer to a top surface of a dicing tape and applying a downward force on a periphery of the dicing tape. The downward force causes a bottom surface of the dicing tape to deform around a contour of a dome-shaped chuck, breaking the perforations in the wafer.
    Type: Application
    Filed: June 13, 2018
    Publication date: December 19, 2019
    Inventors: JERRY GOMEZ CAYABYAB, JENIFFER OTERO ASPURIA, JULIAN CARLO CONCEPC BARBADILLO, ALVIN LOPEZ ANDAYA