Abstract: Disclosed herein is an implantable pulse generator. The implantable pulse generator includes a header, a can, a feedthru, a feedthru substrate and a conductor. The header includes a lead connector block. The can is coupled to the header and includes a wall and an electronic substrate housed within the wall. The feedthru is mounted in the wall and includes a header side, a can side and a feedthru wire extending through the feedthru and having a first end and a second end opposite the first end. The first end is electrically coupled to the lead connector block. The feedthru substrate is adjacent the can side and includes capacitance layers, an electrically conductive input layer, and an electrically conductive input surface defined on a surface of the feedthru substrate and electrically coupled to the input layer. The input layer is electrically coupled to the second end. The conductor electrically couples the input surface and the electronic substrate. The conductor may be in the form of a wire bond.

Abstract: An implantable cardiac stimulation device having an improved multi-level electronic module is disclosed. The multi-level module comprises at least two stacked internal substrates for mounting electronic components within a confined region formed between the two stacked substrates. Placement of the two stacked substrates creates an opening establishing fluid communication between the confined region and an exterior of the electronic module. A polymer dielectric coating, such as parylene, is vapor deposited over the entire electronic module which penetrates the confined region via the opening. The parylene provides enhanced protection against dielectric breakdown between the electronic components and their interconnections thereby enabling smaller separation distances between the electronic components. The parylene also provides support for the electronic components and their interconnections while acting as a moisture barrier and a particle getter.

Abstract: An implantable cardiac stimulation device having an improved multi-level electronic package is disclosed. The multi-lever package includes at least two stacked internal substrates for mounting electronic circuits, a protective lid for protecting the substrates, and an external interconnect structure mounted on the lid which is also capable of mounting electronic components. The interconnection between the at least two internal substrates is achieved by vertically-oriented wirebonds, and the interconnection between at least one internal substrate and the external interconnect structure is achieved by vertically-oriented brazed-on pins which pass through holes in the protective lid. This construction minimizes the planar dimensions of the electronic package and optimizes space in the physiologically-curved portions of the housing.