Abstract: Printed circuit boards (PCBs) can be designed to have dynamic warp characteristics complimentary to those of an attached component. A PCB and an attached component can be designed to dynamically warp, during a thermal excursion, in the same direction and with approximately the same magnitude of warp. Warp characteristics of the PCB and the attached component can be determined by the vertical thickness of conductor and dielectric layers, by the wiring density and number of conductor layers. Warp characteristics can also be at least partially determined by the arrangement/ordering of conductor and dielectric layers, by dimensions of a sash structure surrounding a component outline and by dimensions of a prepreg layer applied to an existing design. Such a prepreg layer can cover a portion or an entirety of one of the PCBs planar surfaces.

Abstract: A method for enhancing internal layer-layer thermal interface performance and a chip stack of semiconductor chips using the method. The chip stack includes a first chip with circuitry on a first side, a second chip coupled to the first chip by a grid of connectors, and a thermal interface material pad between the chips. The thermal interface includes nanofibers and a polymer that allows for optimal alignment of the nanofibers and polymer chains.

Abstract: A method for designing structures with complimentary dynamic warp characteristics for attachment of a component to a PC board is disclosed. The method may include determining characteristics of thermally induced dynamic warp of the PC board and of the first component, analyzing and comparing differences between the dynamic warp characteristics of the PC board and the first component and selecting design modifications to match PC board and the first component dynamic warp characteristics. Selecting design modifications may include determining if the first component dynamic warp characteristics can be changed, determining if matching the dynamic warp characteristics of the PC board and the first component can be achieved by modifying the design of at least one of the PC board and the first component. The result of the method may be modified dynamic warp characteristics of at least one of the PC board and the first component.

Abstract: A method for enhancing internal layer-layer thermal interface performance and a chip stack of semiconductor chips using the method. The method includes adding a thermosetting polymer to the thermal interface material, dispersing a plurality of nanofibers into the thermal interface material, and un-crosslinking the thermosetting polymer in the thermal interface material. The method further includes extruding the thermal interface material through a die to orient the conductive axis of the nanofibers and polymer chains in the desired direction, and re-crosslinking the thermosetting polymer in the thermal interface material. The chip stack includes a first chip with circuitry on a first side, a second chip coupled to the first chip by a grid of connectors, and a thermal interface material pad between the chips. The thermal interface includes nanofibers and a polymer that allows for optimal alignment of the nanofibers and polymer chains.

Abstract: A method for designing structures with complimentary dynamic warp characteristics for attachment of a component to a PC board is disclosed. The method may include determining characteristics of thermally induced dynamic warp of the PC board and of the first component, analyzing and comparing differences between the dynamic warp characteristics of the PC board and the first component and selecting design modifications to match PC board and the first component dynamic warp characteristics. Selecting design modifications may include determining if the first component dynamic warp characteristics can be changed, determining if matching the dynamic warp characteristics of the PC board and the first component can be achieved by modifying the design of at least one of the PC board and the first component. The result of the method may be modified dynamic warp characteristics of at least one of the PC board and the first component.

Abstract: A method for designing structures with complimentary dynamic warp characteristics for attachment of a component to a PC board is disclosed. The method may include determining characteristics of thermally induced dynamic warp of the PC board and of the first component, analyzing and comparing differences between the dynamic warp characteristics of the PC board and the first component and selecting design modifications to match PC board and the first component dynamic warp characteristics. Selecting design modifications may include determining if the first component dynamic warp characteristics can be changed, determining if matching the dynamic warp characteristics of the PC board and the first component can be achieved by modifying the design of at least one of the PC board and the first component. The result of the method may be modified dynamic warp characteristics of at least one of the PC board and the first component.

Abstract: A method of statistical analysis is based on an accelerated degradation model for estimating the failure rate from a set of accelerated life data (e.g. stress, humidity, temperature, voltage, resistance, vibration, etc.). The method re-samples randomly distributed data and organizes it into subsets that may be ordered. The maximum is found for each subset. From the maximums a parametric LEV distribution is determined. Maximum Likelihood Estimation methods may be used to find the parameters employed in the determined LEV distribution. The failure rate is calculated using the determined LEV distribution of the sample maximums.

Abstract: A separable electrical interface is provided, the interface having a circuit card having one or more electrically conductive card edge tabs. Each of the card edge tabs has a raised, curved top surface profile. The separable electrical interface also includes one or more connector contacts. Each of the one or more connector contacts has a curved surface profile. The curved surface of each of the one or more connector contacts is positioned relative to a corresponding card edge tab to selectively engage the raised curved surface of the corresponding card edge tab at the point of final contact.

Abstract: A system for predicting a fan failure has a sensor to detect a gas emitted from grease in the fan. A concentration level of the emitted gas is indicative of grease degradation. The system also has circuitry coupled to the sensor to compare the level of the detected gas to a predetermined level. The system also has an alert apparatus coupled to the circuitry to generate an alert after the circuitry determines that the level of the detected gas exceeds the predetermined level.

Abstract: A method of statistical analysis is based on an accelerated degradation model for estimating the failure rate from a set of accelerated life data (e.g. stress, humidity, temperature, voltage, resistance, vibration, etc.). The method re-samples randomly distributed data and organizes it into subsets that may be ordered. The maximum is found for each subset. From the maximums a parametric LEV distribution is determined. Maximum Likelihood Estimation methods may be used to find the parameters employed in the determined LEV distribution. The failure rate is calculated using the determined LEV distribution of the sample maximums.

Abstract: An apparatus is provided having an integrated circuit device disposed on a printed circuit board and a heat dissipation device on the integrated circuit device. An actuation screw in a spring plate is urged against a portion of the heat dissipation device by tightening the actuation screw. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, a method is provided in which the actuation screw is tightened, but prevented from being tightened beyond the mechanical constraint.

Abstract: A surface mounted apparatus for use with electrical component interconnections including a planar surface, a slide disposed proximate to the planar surface and being made of a material having a coefficient of thermal expansion (CTE) that is substantially matched to that of a material of the planar surface, the slide being further configured to accommodate solderable contact elements stitched therethrough and soldered to the planar surface, a connector body to support the slide in a cavity defined therein, the cavity being sufficiently large to allow the slide to float in accordance with thermal expansions and contractions of the slide and the planar surface, which respectively occur during solder reflow and subsequent cool-down of the connector assembly.

Abstract: Embodiments of the present invention address deficiencies of the art in respect to backplane connectivity and provide a backplane connector for high density broadside differential signaling. In an embodiment of the invention, a backplane connector can be provided. The backplane connector can include a signal header assembly and a signal receptacle assembly. The signal header assembly can include pairs of differential signaling conductors arranged in columns for broadside signaling. Comparably, the signal receptacle assembly can include pairs of conductor receptacles arranged in columns to receive corresponding ones of the pairs of the differential signaling conductors.

Abstract: In a first aspect, a first method of manufacturing a connector for a printed circuit board (PCB) is provided. The first method includes the steps of (1) forming a housing for the connector using a material having first properties; and (2) before the housing is coupled to the PCB, annealing the connector housing to change the first properties of the material such that, after the connector is coupled to the PCB using a reflow process, warpage of a resulting connector-PCB assembly is within a predetermined tolerance. Numerous other aspects are provided.

Abstract: In a first aspect, a first method of manufacturing a connector for a printed circuit board (PCB) is provided. The first method includes the steps of (1) forming a housing for the connector using a material having first properties; and (2) before the housing is coupled to the PCB, annealing the connector housing to change the first properties of the material such that, after the connector is coupled to the PCB using a reflow process, warpage of a resulting connector-PCB assembly is within a predetermined tolerance. Numerous other aspects are provided.

Abstract: A method and apparatus for applying a specified compressive force by a heat dissipation device for an integrated circuit are given, including placing the integrated circuit device onto a printed circuit board and then placing the heat dissipation device onto the integrated circuit device. The method includes tightening an actuation screw in a spring plate against a portion of the heat dissipation device. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, the specific compressive force may be less than or equal to a maximum pressure which may be exerted on the integrated circuit device.

Abstract: A contact assembly including an insulative carrier having a plurality of passages formed therein. A spring contact is positioned in the plurality of passages. The spring contact includes a helical spring and a contact plate affixed to one end of the helical spring. The contact plate has a plurality of portions extending away from the contact plate and extending away from the helical spring.