Patents by Inventor Amanda H. Kumar

Amanda H. Kumar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sealing and stress relief layers and use thereof
    Patent number: 4880684
    Abstract: Sealing and stress relief are provided to a low-fracture strength glass-ceramic substrate. Hermeticity is addressed through the use of capture pads in alignment with vias and through polymer overlays with interconnection between the underlying via or pad metallurgy and the device, chip, wire or pin bonded to the surface of the layer. Multilevel structures are taught along with a self-aligned sealing and wiring process.
    Type: Grant
    Filed: March 11, 1988
    Date of Patent: November 14, 1989
    Assignee: International Business Machines Corporation
    Inventors: David W. Boss, Timothy W. Carr, Derry J. Dubetsky, George M. Greenstein, Warren D. Grobman, Carl P. Hayunga, Amanda H. Kumar, Walter F. Lange, Robert H. Massey, Paul H. Palmateer, John A. Romano, Da-Yuan Shih