Patents by Inventor Amanda Hartnett

Amanda Hartnett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low void solder joint for multiple reflow applications
    Patent number: 9468136
    Abstract: Methods and apparatus are provided for attaching a heat spreader to a die and includes disposing a solder thermal interface material between a first surface of a die and a first surface of a heat spreader without disposing a liquid flux between the die and the heat spreader to form an assembly, wherein at least one of the first surface of the die and a first surface of the heat spreader have disposed thereon a metallization structure comprising a transition layer and a sacrificial metallization layer, the sacrificial metallization layer disposed as an outer layer to the metallization structure adjacent the solder thermal interface material; and heating the assembly to melt the thermal interface and attach the die to the heat spreader.
    Type: Grant
    Filed: January 16, 2014
    Date of Patent: October 11, 2016
    Assignee: Indium Corporation
    Inventors: Jordan Peter Ross, Amanda Hartnett, Robert Norman Jarrett
  • LOW VOID SOLDER JOINT FOR MULTIPLE REFLOW APPLICATIONS
    Publication number: 20140193658
    Abstract: Methods and apparatus are provided for attaching a heat spreader to a die and includes disposing a solder thermal interface material between a first surface of a die and a first surface of a heat spreader without disposing a liquid flux between the die and the heat spreader to form an assembly, wherein at least one of the first surface of the die and a first surface of the heat spreader have disposed thereon a metallization structure comprising a transition layer and a sacrificial metallization layer, the sacrificial metallization layer disposed as an outer layer to the metallization structure adjacent the solder thermal interface material; and heating the assembly to melt the thermal interface and attach the die to the heat spreader.
    Type: Application
    Filed: January 16, 2014
    Publication date: July 10, 2014
    Applicant: Indium Corporation
    Inventors: Jordan Peter Ross, Amanda Hartnett, Robert Norman Jarrett