Abstract: A CAM memory cell including: a latch including N first TFETs serially connected one to the other between two supply electric potentials such that each source and drain of each first TFETs is connected either to one supply electric potentials or to the source or drain of another first TFETs, and wherein one electric potentials is applied on the gate of each first TFETs which are in reverse bias VDS and forward bias VGS, with N?2; an output block connected to N?1 storage nodes formed at connection points between the first TFETs, and configured to read a data stored in the storage nodes and/or to output a value representative of a matching or mismatching between a search data and the stored data; a write block configured to apply a data to be stored in the storage nodes.

Abstract: A static random access memory (SRAM) comprises a plurality of memory cells each having a pair of cross-coupled inverters, a first of the inverters being supplied by first and second power supply rails and a second of the inverters being supplied by third and fourth supply rails, an input of the second inverter being coupled to a first bit line via a first transistor; and a power supply circuit adapted to apply a first voltage difference across the first and second power supply rails and a second voltage difference across the third and fourth power supply rails, the second voltage difference being greater than the first voltage difference.

Abstract: Tri-state inverter includes a n-TFET and a p-TFET, the drain of the n-TFET being connected to the drain of the p-TFET and to an output of the tri-state inverter, the gates of the n-TFET and p-TFET being connected to an input of the tri-state inverter, and a control circuit able to apply a first control voltage on the source of the n-TFET and a second control voltage on the source of the p-TFET, the values of the first and second control voltages being positive or zero, wherein, when the tri-state inverter is intended to work as an inverter, the value of the first control voltage is lower than the value of the second control voltage, and when the tri-state inverter is intended to be tri-stated, the value of the first control voltage is higher than the value of the second control voltage.

Abstract: Memory latch comprising: a TFET; a capacitor; a storage node formed by the connection of a first terminal of the capacitor to a first electrode of the TFET; a control circuit configured to supply a first electric potential on a second terminal of the capacitor, a second electric potential on the gate of the TFET and a third electric potential on a second electrode of the TFET, such that: when the stored potential is low, the TFET is reverse biased with a conduction current obtained by band-to-band tunneling with a value higher than a capacitor leakage current; when the stored potential is high, the TFET is reverse biased with an OFF state current value less than the capacitor leakage current.

Abstract: A SRAM memory bit cell is provided that includes a n-TFET and a p-TFET; a storage node formed by the connection of a first electrode of the n-TFET to a first electrode of the p-TFET (drains or sources); and a control circuit able to apply supply voltages on second electrodes of the n-TFET and p-TFET (sources or drains). The control circuit is configured to provide, during a retention mode, supply and bias voltages reverse biasing the n-TFET and p-TFET in a state wherein a conduction current is obtained by band-to-band tunneling in the n-TFET and p TFET. The control circuit is further configured to provide, during a writing of a bit, supply and bias voltages forward biasing the n-TFET and p-TFET and such that one of the n-TFET and p-TFET is in OFF state and that the other of the n-TFET and p-TFET is in ON state.

Abstract: Tri-state inverter comprising: a n-TFET and a p-TFET, the drain of the n-TFET being connected to the drain of the p-TFET and to an output of the tri-state inverter, the gates of the n-TFET and p-TFET being connected to an input of the tri-state inverter; a control circuit able to apply a first control voltage on the source of the n-TFET and a second control voltage on the source of the p-TFET, the values of the first and second control voltages being positive or zero; and wherein, when the tri-state inverter is intended to work as an inverter, the value of the first control voltage is lower than the value of the second control voltage, and when the tri-state inverter is intended to be tri-stated, the value of the first control voltage is higher than the value of the second control voltage.

Abstract: SRAM memory bit cell comprising: a n-TFET and a p-TFET; a storage node formed by the connection of a first electrode of the n-TFET to a first electrode of the p-TFET (drains or sources); a control circuit able to apply supply voltages on second electrodes of the n-TFET and p-TFET (sources or drains); wherein the control circuit is configured to provide: during a retention mode, supply and bias voltages reverse biasing the n-TFET and p-TFET in a state wherein a conduction current is obtained by band-to-band tunneling in the n-TFET and p-TFET; during a writing of a bit, supply and bias voltages forward biasing the n-TFET and p-TFET and such that one of the n-TFET and p-TFET is in OFF state and that the other of the n-TFET and p-TFET is in ON state.

Abstract: A content addressable memory having at least one CAM cell including first and second inverters cross-coupled between first and second storage nodes; a first transistor coupling the first storage node to a bitline, the first transistor being controlled by a first control signal; a second transistor coupling the second storage node to the bitline, the second transistor being controlled by a second control signal; and a control circuit adapted to perform a CAM read operation by pre-charging the bitline to a first voltage level, and then selectively activating either the first or second transistor based on a bit of input data.

Abstract: A content addressable memory having at least one CAM cell including first and second inverters cross-coupled between first and second storage nodes; a first transistor coupling the first storage node to a bitline, the first transistor being controlled by a first control signal; a second transistor coupling the second storage node to the bitline, the second transistor being controlled by a second control signal; and a control circuit adapted to perform a CAM read operation by pre-charging the bitline to a first voltage level, and then selectively activating either the first or second transistor based on a bit of input data.

Abstract: The invention concerns a static random access memory (SRAM) comprising: a plurality of memory cells each having a pair of cross-coupled inverters (102, 104), a first of the inverters (102) being supplied by first and second power supply rails (VDD, VSS) and a second of the inverters (104) being supplied by third and fourth supply rails (114, 116), an input of the second inverter (102) being coupled to a first bit line (BL, WBL) via a first transistor (118); and a power supply circuit (120) adapted to apply a first voltage difference (VDD) across the first and second power supply rails (VDD, VSS) and a second voltage difference (VDH, VSL) across the third and fourth power supply rails (114, 116), the second voltage difference being greater than the first voltage difference.

Abstract: The random access memory cell of SRAM type comprises an access transistor provided with a gate electrode connected to a word line. The access transistor is connected between a bit line and a gate electrode of a first load transistor itself connected to a gate electrode of a driver transistor and to a first source/drain electrode of a second load transistor. The first load transistor and the driver transistor, in series, form an inverter at the supply voltage terminals. At least the transistors not comprised in the inverter comprise two electrically independent gate electrodes. The second gate electrode of the access transistor is connected to the first gate electrode of the second load transistor and the second gate electrode of the latter is connected to the supply voltage.

Abstract: The random access memory cell of SRAM type comprises an access transistor provided with a gate electrode connected to a word line. The access transistor is connected between a bit line and a gate electrode of a first load transistor itself connected to a gate electrode of a driver transistor and to a first source/drain electrode of a second load transistor. The first load transistor and the driver transistor, in series, form an inverter at the supply voltage terminals. At least the transistors not comprised in the inverter comprise two electrically independent gate electrodes. The second gate electrode of the access transistor is connected to the first gate electrode of the second load transistor and the second gate electrode of the latter is connected to the supply voltage.