Abstract: A heat-dissipating device includes a hollow housing adapted to contact a heat source and for receiving a heat-conducting fluid therein, a heat-conducting member contacting the heat-conducting fluid, and a heat-dissipating fin unit driven to move within an ambient fluid so as to dissipate heat from the fin unit to the ambient fluid.

Abstract: A method for making a heat sink device includes the steps of: (a) providing a first heat conducting plate and a second heat conducting plate, the first heat conducting plate being folded to form a plurality of first connecting parts and a plurality of fin parts, the second heat conducting plate including second connecting parts corresponding to the first connecting parts of the first heat conducting plate; (b) cold pressing the first connecting parts respectively against the second connecting parts so as to connect respectively the first connecting parts to the second connecting parts; and (c) heating and press forging the first connecting parts and the second connecting parts so as to form porosity-free joint parts between the first and second connecting parts.

Abstract: A heat dissipation device for an integrated circuit includes a heat-conducting base plate having a bottom surface which is adapted to contact the upper surface of the integrated circuit, and a corrugated porous heat dissipating plate made of a flexible heat conducting material and fixed on the upper surface of the base plate so as to transfer heat from the base plate to the heat dissipating plate for heat dissipation. The heat dissipating plate has a plurality of ventilation holes formed therethrough, which are located over the base plate so as to enhance currents of air in the spaces between the base plate and the heat dissipating plate. Accordingly, the heat dissipating area in a unit of the space occupied by the heat dissipating plate is large enough to offer a quick and effective heat dissipation.

Abstract: A flexible heat transfer device includes a closed flexible envelopment which is made of a plastic film and which has a receiving space provided therein. The envelopment has a first section and a second section spaced from the first section. The receiving space of the envelopment contains a heat transfer liquid which has a boiling point between a temperature of a heat source and an ambient temperature. Therefore, the heat transfer liquid in the first section of the envelopment is evaporated into a vapor when the first section of the envelopment contacts the heat source, and the vapor is condensed in the second section of the envelopment at the ambient temperature.