Patents by Inventor Amir Widmann
Amir Widmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11498189Abstract: A tool for sealing a workpiece, the workpiece comprising a first component and a second component sharing a rotation axis A, the tool comprising: a fastening head capable of engaging the first component; a first motor operationally coupled to the fastening head; a controller capable of: storing a rotation value representing rotation of the first component a predetermined desired angle around axis A; measuring movement of the first component, and controlling movement of the first motor; the tool, when the fastening head is engaged with the first component, and the second component is essentially immobilized from rotation around axis A, is configured to allow precisely sealing the workpiece by: rotating the first component in a closing direction R toward the second component, according to the rotation value and under the control of the rotation by the controller.Type: GrantFiled: April 27, 2020Date of Patent: November 15, 2022Inventors: Amir Widmann, Agmon David Porat
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Publication number: 20220266425Abstract: A tool for sealing a workpiece, the workpiece comprising a first component and a second component sharing a rotation axis A, the tool comprising: a fastening head capable of engaging the first component; a first motor operationally coupled to the fastening head; a controller capable of: storing a rotation value representing rotation of the first component a predetermined desired angle around axis A; measuring movement of the first component, and controlling movement of the first motor; the tool, when the fastening head is engaged with the first component, and the second component is essentially immobilized from rotation around axis A, is configured to allow precisely sealing the workpiece by: rotating the first component in a closing direction R toward the second component, according to the rotation value and under the control of the rotation by the controller.Type: ApplicationFiled: April 27, 2020Publication date: August 25, 2022Inventors: Amir Widmann, Agmon David Porat
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Patent number: 10649447Abstract: Various methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers are provided. One method for creating a dynamic sampling scheme for a process during which measurements are performed on wafers includes performing the measurements on all of the wafers in at least one lot at all measurement spots on the wafers. The method also includes determining an optimal sampling scheme, an enhanced sampling scheme, a reduced sampling scheme, and thresholds for the dynamic sampling scheme for the process based on results of the measurements. The thresholds correspond to values of the measurements at which the optimal sampling scheme, the enhanced sampling scheme, and the reduced sampling scheme are to be used for the process.Type: GrantFiled: May 16, 2017Date of Patent: May 12, 2020Assignee: KLA-Tencor Corp.Inventors: Pavel Izikson, John Robinson, Mike Adel, Amir Widmann, Dongsub Choi, Anat Marchelli
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Publication number: 20170255188Abstract: Various methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers are provided. One method for creating a dynamic sampling scheme for a process during which measurements are performed on wafers includes performing the measurements on all of the wafers in at least one lot at all measurement spots on the wafers. The method also includes determining an optimal sampling scheme, an enhanced sampling scheme, a reduced sampling scheme, and thresholds for the dynamic sampling scheme for the process based on results of the measurements. The thresholds correspond to values of the measurements at which the optimal sampling scheme, the enhanced sampling scheme, and the reduced sampling scheme are to be used for the process.Type: ApplicationFiled: May 16, 2017Publication date: September 7, 2017Inventors: Pavel Izikson, John Robinson, Mike Adel, Amir Widmann, Dongsub Choi, Anat Marchelli
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Patent number: 9651943Abstract: Various methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers are provided. One method for creating a dynamic sampling scheme for a process during which measurements are performed on wafers includes performing the measurements on all of the wafers in at least one tot at all measurement spots on the wafers. The method also includes determining an optimal sampling scheme, an enhanced sampling scheme, a reduced sampling scheme, and thresholds for the dynamic sampling scheme for the process based on results of the measurements. The thresholds correspond to values of the measurements at which the optimal sampling scheme, the enhanced sampling scheme, and the reduced sampling scheme are to be used for the process.Type: GrantFiled: April 26, 2012Date of Patent: May 16, 2017Assignee: KLA-Tencor Corp.Inventors: Pavel Izikson, John Robinson, Mike Adel, Amir Widmann, Dongsub Choi, Anat Marchelli
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Patent number: 9576861Abstract: Universal target based inspection drive metrology includes designing a plurality of universal metrology targets measurable with an inspection tool and measurable with a metrology tool, identifying a plurality of inspectable features within at least one die of a wafer using design data, disposing the plurality of universal targets within the at least one die of the wafer, each universal target being disposed at least proximate to one of the identified inspectable features, inspecting a region containing one or more of the universal targets with an inspection tool, identifying one or more anomalistic universal targets in the inspected region with an inspection tool and, responsive to the identification of one or more anomalistic universal targets in the inspected region, performing one or more metrology processes on the one or more anomalistic universal metrology targets with the metrology tool.Type: GrantFiled: November 18, 2013Date of Patent: February 21, 2017Assignee: KLA-Tencor CorporationInventors: Allen Park, Ellis Chang, Michael Adel, Kris Bhaskar, Ady Levy, Amir Widmann, Mark Wagner, Songnian Rong
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Patent number: 9558978Abstract: An apparatus includes a dedicated material handling module having a dedicated automated material handling system (AMHS) defines a transport route between a first tool and a second tool selected from a plurality of tools in a fabrication facility. The dedicated AMHS is configured to transport wafer carriers between the first tool and the second tool or vice versa independent of a fabrication facility AMHS that is configured to transport wafer carriers among the plurality of tools.Type: GrantFiled: May 1, 2013Date of Patent: January 31, 2017Assignee: KLA-TENCOR CORPORATIONInventors: Amir Widmann, Michael Adel, Pati Sekula
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Patent number: 9329033Abstract: Aspects of the present disclosure describe systems and methods for calibrating a metrology tool by using proportionality factors. The proportionality factors may be obtained by measuring a substrate under different measurement conditions. Then calculating the measured metrology value and one or more quality merits. From this information, proportionality factors may be determined. Thereafter the proportionality factors may be used to quantify the inaccuracy in a metrology measurement. The proportionality factors may also be used to determine an optimize measurement recipe. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.Type: GrantFiled: March 15, 2013Date of Patent: May 3, 2016Assignee: KLA-Tencor CorporationInventors: Eran Amit, Dana Klein, Guy Cohen, Amir Widmann, Nimrod Shuall, Amnon Manassen, Nuriel Amir
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Patent number: 9170209Abstract: Inspection guided overlay metrology may include performing a pattern search in order to identify a predetermined pattern on a semiconductor wafer, generating a care area for all instances of the predetermined pattern on the semiconductor wafer, identifying defects within generated care areas by performing an inspection scan of each of the generated care areas, wherein the inspection scan includes a low-threshold or a high sensitivity inspection scan, identifying overlay sites of the predetermined pattern of the semiconductor wafer having a measured overlay error larger than a selected overlay specification utilizing a defect inspection technique, comparing location data of the identified defects of a generated care area to location data of the identified overlay sites within the generated care area in order to identify one or more locations wherein the defects are proximate to the identified overlay sites, and generating a metrology sampling plan based on the identified locations.Type: GrantFiled: October 14, 2013Date of Patent: October 27, 2015Assignee: KLA-Tencor CorporationInventors: Ellis Chang, Amir Widmann, Allen Park
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Patent number: 9116442Abstract: A method and apparatus for process control in a lithographic process are described. Metrology may be performed on a substrate either before or after performing a patterning process on the substrate. One or more correctables to the lithographic patterning process may be generated based on the metrology. The patterning process performed on the substrate (or a subsequent substrate) may be adjusted with the correctables.Type: GrantFiled: December 23, 2011Date of Patent: August 25, 2015Assignee: KLA-Tencor CorporationInventors: Michael Adel, John Fielden, Amir Widmann, John Robinson, Dongsub Choi
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Inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer
Patent number: 8948495Abstract: Methods for inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer are provided. One method includes acquiring images for multiple die printed on a wafer, each of which is printed by performing a double patterning lithography process on the wafer and which include two or more die printed at nominal values of overlay for the double patterning lithography process and one or more die printed at modulated values of the overlay; comparing the images acquired for the multiple die printed at the nominal values to the images acquired for the multiple die printed at the modulated values; and detecting defects in the multiple die printed at the modulated values based on results of the comparing step.Type: GrantFiled: March 2, 2013Date of Patent: February 3, 2015Assignee: KLA-Tencor Corp.Inventors: Gino Marcuccilli, Amir Widmann, Ellis Chang, John Robinson, Allen Park -
Patent number: 8804137Abstract: A combined metrology mark, a system, and a method for calculating alignment on a semiconductor circuit are disclosed. The combined metrology mark may include a mask misregistration structure and a wafer overlay mark structure.Type: GrantFiled: June 21, 2010Date of Patent: August 12, 2014Assignee: KLA-Tencor CorporationInventors: DongSub Choi, Amir Widmann, Zain Saidin, Frank Laske, John Robinson
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Publication number: 20140199791Abstract: Universal target based inspection drive metrology includes designing a plurality of universal metrology targets measurable with an inspection tool and measurable with a metrology tool, identifying a plurality of inspectable features within at least one die of a wafer using design data, disposing the plurality of universal targets within the at least one die of the wafer, each universal target being disposed at least proximate to one of the identified inspectable features, inspecting a region containing one or more of the universal targets with an inspection tool, identifying one or more anomalistic universal targets in the inspected region with an inspection tool and, responsive to the identification of one or more anomalistic universal targets in the inspected region, performing one or more metrology processes on the one or more anomalistic universal metrology targets with the metrology tool.Type: ApplicationFiled: November 18, 2013Publication date: July 17, 2014Applicant: KLA-Tencor CorporationInventors: Allen Park, Ellis Chang, Michael Adel, Kris Bhaskar, Ady Levy, Amir Widmann, Mark Wagner, Songnian Rong
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Publication number: 20140060148Abstract: Aspects of the present disclosure describe systems and methods for calibrating a metrology tool by using proportionality factors. The proportionality factors may be obtained by measuring a substrate under different measurement conditions. Then calculating the measured metrology value and one or more quality merits. From this information, proportionality factors may be determined. Thereafter the proportionality factors may be used to quantify the inaccuracy in a metrology measurement. The proportionality factors may also be used to determine an optimize measurement recipe. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.Type: ApplicationFiled: March 15, 2013Publication date: March 6, 2014Inventors: Eran Amit, Dana Klein, Guy Cohen, Amir Widmann, Nimrod Shuall, Amnon Manassen, Nuriel Amir
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Patent number: 8655469Abstract: A method for automatic process control (APC) performance monitoring may include, but is not limited to: computing one or more APC performance indicators for one or more production lots of semiconductor devices; and displaying a mapping of the one or more APC performance indicators to the one or more production lots of semiconductor devices.Type: GrantFiled: June 9, 2011Date of Patent: February 18, 2014Assignee: KLA-Tencor CorporationInventors: DongSub Choi, Amir Widmann, Daniel Kandel, David Tien
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Publication number: 20130294871Abstract: An apparatus includes a dedicated material handling module having a dedicated automated material handling system (AMHS) defines a transport route between a first tool and a second tool selected from a plurality of tools in a fabrication facility. The dedicated ANHS is configured to transport wafer carriers between the first tool and the second tool or vice versa independent of a fabrication facility AMHS that is configured to transport wafer carriers among the plurality of tools. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.Type: ApplicationFiled: May 1, 2013Publication date: November 7, 2013Applicant: KLA -TENCOR CORPORATION,Inventors: AMIR WIDMANN, MICHAEL ADEL, PATI SEKULA
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Patent number: 8559001Abstract: Inspection guided overlay metrology may include performing a pattern search in order to identify a predetermined pattern on a semiconductor wafer, generating a care area for all instances of the predetermined pattern on the semiconductor wafer, identifying defects within generated care areas by performing an inspection scan of each of the generated care areas, wherein the inspection scan includes a low-threshold or a high sensitivity inspection scan, identifying overlay sites of the predetermined pattern of the semiconductor wafer having a measured overlay error larger than a selected overlay specification utilizing a defect inspection technique, comparing location data of the identified defects of a generated care area to location data of the identified overlay sites within the generated care area in order to identify one or more locations wherein the defects are proximate to the identified overlay sites, and generating a metrology sampling plan based on the identified locations.Type: GrantFiled: January 5, 2011Date of Patent: October 15, 2013Assignee: KLA-Tencor CorporationInventors: Ellis Chang, Amir Widmann, Allen Park
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Publication number: 20120208301Abstract: Various methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers are provided. One method for creating a dynamic sampling scheme for a process during which measurements are performed on wafers includes performing the measurements on all of the wafers in at least one tot at all measurement spots on the wafers. The method also includes determining an optimal sampling scheme, an enhanced sampling scheme, a reduced sampling scheme, and thresholds for the dynamic sampling scheme for the process based on results of the measurements. The thresholds correspond to values of the measurements at which the optimal sampling scheme, the enhanced sampling scheme, and the reduced sampling scheme are to be used for the process.Type: ApplicationFiled: April 26, 2012Publication date: August 16, 2012Applicant: KLA-TENCOR CORPORATIONInventors: Pavel Izikson, John Robinson, Mike Adel, Amir Widmann, Dongsub Choi, Anat Marchelli
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Patent number: 8175831Abstract: Various methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers are provided. One method for creating a dynamic sampling scheme for a process during which measurements are performed on wafers includes performing the measurements on all of the wafers in at least one lot at all measurement spots on the wafers. The method also includes determining an optimal sampling scheme, an enhanced sampling scheme, a reduced sampling scheme, and thresholds for the dynamic sampling scheme for the process based on results of the measurements. The thresholds correspond to values of the measurements at which the optimal sampling scheme, the enhanced sampling scheme, and the reduced sampling scheme are to be used for the process.Type: GrantFiled: April 22, 2008Date of Patent: May 8, 2012Assignee: KLA-Tencor Corp.Inventors: Pavel Izikson, John Robinson, Mike Adel, Amir Widmann, Dongsub Choi, Anat Marchelli
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Publication number: 20120094400Abstract: A method and apparatus for process control in a lithographic process are described. Metrology may be performed on a substrate either before or after performing a patterning process on the substrate. One or more correctables to the lithographic patterning process may be generated based on the metrology. The patterning process performed on the substrate (or a subsequent substrate) may be adjusted with the correctables.Type: ApplicationFiled: December 23, 2011Publication date: April 19, 2012Applicant: KLA-Tencor CorporationInventors: Michael Adel, John Fielden, Amir Widmann, John Robinson, Dongsub Choi