Abstract: An assembly of an electronic device inside a flexible container in which the device is held within a sealed chamber of the container. The electronic device, which may be a printed circuit board, has signal terminals which are connected to elongate insulated signal conductors. These conductors pass through a laminate construction wall of the container for connection to outside electrical conductors. The signal conductors are electrically isolated from an EMI protection layer which forms part of the laminate construction wall. A grounding device includes a ground element electrically connected to a ground conductor of the electronic device, the ground element being secured to the inside surface of the container provided by a dielectric inner layer. The ground element is thus in capacitive coupling with the EMI protection layer.

Abstract: Electronic unit in which a printed circuit board is located within a housing which includes a heat sink. The board is normally urged out of heat conductive relationship with the heat sink. As temperature increases the circuit board and heat sink are caused to move relatively so as to bring the board into heat conductive relationship with the heat sink so as to remove heat from the board. As temperature decreases the board and heat sink are again moved out of heat conductive relationship. Preferably a heat conduction element is provided to conduct heat from the board. This comprises at least one compressible member, e.g. compressible cellular material, which is progressively compressed as temperature increases. Preferably the heat conductive efficiency of the compressible member increases as compression increases.

Abstract: Within an electronic shelf, physically separating or isolating in a front to rear direction keying elements from connector alignment elements to provide a separation distance, minimizes the undesirable interaction that may occur between keying elements and connector alignment elements due to tolerance effects. Worst case manufacturing tolerances with respect to keying elements, for example, no longer influence in any significant way, the co-action of the connector alignment elements. Insertion of circuit packs into respective receiving stations is achieved with less effort since effort is not required to overcome extra frictional forces resulting from the keying elements interacting with the connector alignment elements.