Abstract: A phase shifter, such as for use in phased antenna arrays, comprising thin film BST capacitors periodically loading a transmission line. The BST thin films can be deposited using RF sputtering on a variety of substrates, and the capacitors can be of a parallel plate configuration or of an interdigitated configuration. An aspect of the invention additionally provides for the use of periodically distributed lumped-element inductors comprising the transmission line. A further aspect provides for programmatic determination of circuit design and configuration parameters based on the input of desired characteristics and materials for the phase shifter.

Abstract: The present invention discloses high-speed, single-drive and dual-drive external optical modulation devices that reduce the voltage and power required to amplify and modulate electrical signals onto an optical carrier. Two primary components of an optical transmitter, namely, the modulator and driver, are integrated, and preferably hybridly integrated, in a single package, thereby eliminating many of the cable connector interfaces that add loss, complexity and cost to the system. Further, integration frees the devices from the standardized impedance (i.e. 50 ohm) constraints that reduce performance, thereby enabling the design of optimized, low voltage, hybridly integrated modulation devices.

Abstract: A phase shifter, such as for use in phased antenna arrays, comprising thin film BST capacitors periodically loading a transmission line. The BST thin films can be deposited using RF sputtering on a variety of substrates, and the capacitors can be of a parallel plate configuration or of an interdigitated configuration. An aspect of the invention additionally provides for the use of periodically distributed lumped-element inductors comprising the transmission line. A further aspect provides for programmatic determination of circuit design and configuration parameters based on the input of desired characteristics and materials for the phase shifter.

Abstract: A microelectromechanical switch is disclosed comprising a conductor, a dielectric layer disposed on the conductor, a metal cap disposed on the dielectric layer and a bridge disposed proximate to the metal cap such that an electrical potential applied between the bridge and conductor causes the bridge to deform and contact the metal cap.

Abstract: A microelectromechanical switch is disclosed comprising a conductor, a dielectric layer disposed on the conductor, a metal cap disposed on the dielectric layer and a bridge disposed proximate to the metal cap such that an electrical potential applied between the bridge and conductor causes the bridge to deform and contact the metal cap.