Patents by Inventor Amit Y. Kumar
Amit Y. Kumar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10747457Abstract: Technologies for processing network packets in an agent-mesh architecture include a network interface controller (NIC) of a computing device configured to write, by a network fabric interface of a memory fabric of the NIC, a received network packet to the memory fabric in a distributed fashion. The network fabric interface is configured to send an event message indicating the received network packet to a packet processor communicatively coupled to the memory fabric. The packet processor is configured to read, in response to having received the generated event message, at least a portion of the received network packet from the memory fabric, identify an agent of the NIC for additional processing of the received network packet, generate a network packet received event message indicating the received network packet is available for processing, and transmit the network packet received event message to the identified agent. Other embodiments are described herein.Type: GrantFiled: September 29, 2017Date of Patent: August 18, 2020Assignee: Intel CorporationInventors: Brad Burres, Ronen Chayat, Alain Gravel, Robert Hathaway, Amit Y. Kumar, Jose Niell, Nadav Turbovich
-
Patent number: 10541941Abstract: Apparatus and methods for cableless connection of components within chassis and between separate chassis. Pairs of Extremely High Frequency (EHF) transceiver chips supporting very short length millimeter-wave wireless communication links are configured to pass radio frequency signals through holes in one or more metal layers in separate chassis and/or frames, enabling components in the separate chassis to communicate without requiring cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. The EHF-based wireless links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.Type: GrantFiled: April 6, 2018Date of Patent: January 21, 2020Assignee: Intel CorporationInventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Hugh Wilkinson, Amit Y. Kumar
-
Patent number: 10374726Abstract: Apparatus and methods for rack level pre-installed interconnect for enabling cableless server, storage, and networking deployment. Plastic cable waveguides are configured to couple millimeter-wave radio frequency (RF) signals between two or more Extremely High Frequency (EHF) transceiver chips, thus supporting millimeter-wave wireless communication links enabling components in the separate chassis to communicate without requiring wire or optical cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. A plurality of plastic cable waveguide may be coupled to applicable support/mounting members, which in turn are mounted to a rack and/or top-of-rack switches. This enables the plastic cable waveguides to be pre-installed at the rack level, and further enables racks to be installed and replaced without requiring further cabling for the supported communication links.Type: GrantFiled: January 18, 2018Date of Patent: August 6, 2019Assignee: Intel CorporationInventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Hugh Wilkinson, Amit Y. Kumar
-
Publication number: 20180302341Abstract: Apparatus and methods for cableless connection of components within chassis and between separate chassis. Pairs of Extremely High Frequency (EHF) transceiver chips supporting very short length millimeter-wave wireless communication links are configured to pass radio frequency signals through holes in one or more metal layers in separate chassis and/or frames, enabling components in the separate chassis to communicate without requiring cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. The EHF-based wireless links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.Type: ApplicationFiled: April 6, 2018Publication date: October 18, 2018Applicant: lntel CorporationInventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Hugh Wilkinson, Amit Y. Kumar
-
Publication number: 20180212686Abstract: Apparatus and methods for rack level pre-installed interconnect for enabling cableless server, storage, and networking deployment. Plastic cable waveguides are configured to couple millimeter-wave radio frequency (RF) signals between two or more Extremely High Frequency (EHF) transceiver chips, thus supporting millimeter-wave wireless communication links enabling components in the separate chassis to communicate without requiring wire or optical cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. A plurality of plastic cable waveguide may be coupled to applicable support/mounting members, which in turn are mounted to a rack and/or top-of-rack switches. This enables the plastic cable waveguides to be pre-installed at the rack level, and further enables racks to be installed and replaced without requiring further cabling for the supported communication links.Type: ApplicationFiled: January 18, 2018Publication date: July 26, 2018Applicant: lntel CorporationInventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Hugh Wilkinson, Amit Y. Kumar
-
Publication number: 20180152383Abstract: Technologies for processing network packets in an agent-mesh architecture include a network interface controller (NIC) of a computing device configured to write, by a network fabric interface of a memory fabric of the NIC, a received network packet to the memory fabric in a distributed fashion. The network fabric interface is configured to send an event message indicating the received network packet to a packet processor communicatively coupled to the memory fabric. The packet processor is configured to read, in response to having received the generated event message, at least a portion of the received network packet from the memory fabric, identify an agent of the NIC for additional processing of the received network packet, generate a network packet received event message indicating the received network packet is available for processing, and transmit the network packet received event message to the identified agent. Other embodiments are described herein.Type: ApplicationFiled: September 29, 2017Publication date: May 31, 2018Inventors: Brad Burres, Ronen Chayat, Alain Gravel, Robert Hathaway, Amit Y. Kumar, Jose Niell, Nadav Turbovich
-
Patent number: 9961018Abstract: Apparatus and methods for cableless connection of components within chassis and between separate chassis. Pairs of Extremely High Frequency (EHF) transceiver chips supporting very short length millimeter-wave wireless communication links are configured to pass radio frequency signals through holes in one or more metal layers in separate chassis and/or frames, enabling components in the separate chassis to communicate without requiring cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. The EHF-based wireless links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.Type: GrantFiled: September 12, 2016Date of Patent: May 1, 2018Assignee: Intel CorporationInventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Hugh Wilkinson, Amit Y. Kumar
-
Publication number: 20170126330Abstract: Apparatus and methods for rack level pre-installed interconnect for enabling cableless server, storage, and networking deployment. Plastic cable waveguides are configured to couple millimeter-wave radio frequency (RF) signals between two or more Extremely High Frequency (EHF) transceiver chips, thus supporting millimeter-wave wireless communication links enabling components in the separate chassis to communicate without requiring wire or optical cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. A plurality of plastic cable waveguide may be coupled to applicable support/mounting members, which in turn are mounted to a rack and/or top-of-rack switches. This enables the plastic cable waveguides to be pre-installed at the rack level, and further enables racks to be installed and replaced without requiring further cabling for the supported communication links.Type: ApplicationFiled: October 21, 2016Publication date: May 4, 2017Applicant: lntel CorporationInventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Hugh Wilkinson, Amit Y. Kumar
-
Publication number: 20160380923Abstract: Apparatus and methods for cableless connection of components within chassis and between separate chassis. Pairs of Extremely High Frequency (EHF) transceiver chips supporting very short length millimeter-wave wireless communication links are configured to pass radio frequency signals through holes in one or more metal layers in separate chassis and/or frames, enabling components in the separate chassis to communicate without requiring cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. The EHF-based wireless links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.Type: ApplicationFiled: September 12, 2016Publication date: December 29, 2016Applicant: lntel CorporationInventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Hugh Wilkinson, Amit Y. Kumar
-
Patent number: 9496592Abstract: Apparatus and methods for rack level pre-installed interconnect for enabling cableless server, storage, and networking deployment. Plastic cable waveguides are configured to couple millimeter-wave radio frequency (RF) signals between two or more Extremely High Frequency (EHF) transceiver chips, thus supporting millimeter-wave wireless communication links enabling components in the separate chassis to communicate without requiring wire or optical cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. A plurality of plastic cable waveguide may be coupled to applicable support/mounting members, which in turn are mounted to a rack and/or top-of-rack switches. This enables the plastic cable waveguides to be pre-installed at the rack level, and further enables racks to be installed and replaced without requiring further cabling for the supported communication links.Type: GrantFiled: March 27, 2014Date of Patent: November 15, 2016Assignee: Intel CorporationInventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Hugh Wilkinson, Amit Y. Kumar
-
Patent number: 9450635Abstract: Apparatus and methods for cableless connection of components within chassis and between separate chassis. Pairs of Extremely High Frequency (EHF) transceiver chips supporting very short length millimeter-wave wireless communication links are configured to pass radio frequency signals through holes in one or more metal layers in separate chassis and/or frames, enabling components in the separate chassis to communicate without requiring cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. The EHF-based wireless links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.Type: GrantFiled: April 3, 2014Date of Patent: September 20, 2016Assignee: Intel CorporationInventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Hugh Wilkinson, Amit Y. Kumar
-
Publication number: 20150288410Abstract: Apparatus and methods for cableless connection of components within chassis and between separate chassis. Pairs of Extremely High Frequency (EHF) transceiver chips supporting very short length millimeter-wave wireless communication links are configured to pass radio frequency signals through holes in one or more metal layers in separate chassis and/or frames, enabling components in the separate chassis to communicate without requiring cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. The EHF-based wireless links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.Type: ApplicationFiled: April 3, 2014Publication date: October 8, 2015Inventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Hugh Wilkinson, Amit Y. Kumar
-
Publication number: 20150280827Abstract: Apparatus and methods for rack level pre-installed interconnect for enabling cableless server, storage, and networking deployment. Plastic cable waveguides are configured to couple millimeter-wave radio frequency (RF) signals between two or more Extremely High Frequency (EHF) transceiver chips, thus supporting millimeter-wave wireless communication links enabling components in the separate chassis to communicate without requiring wire or optical cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. A plurality of plastic cable waveguide may be coupled to applicable support/mounting members, which in turn are mounted to a rack and/or top-of-rack switches. This enables the plastic cable waveguides to be pre-installed at the rack level, and further enables racks to be installed and replaced without requiring further cabling for the supported communication links.Type: ApplicationFiled: March 27, 2014Publication date: October 1, 2015Inventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Hugh Wilkinson, Amit Y. Kumar