Patents by Inventor Amit Y. Kumar

Amit Y. Kumar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10747457
    Abstract: Technologies for processing network packets in an agent-mesh architecture include a network interface controller (NIC) of a computing device configured to write, by a network fabric interface of a memory fabric of the NIC, a received network packet to the memory fabric in a distributed fashion. The network fabric interface is configured to send an event message indicating the received network packet to a packet processor communicatively coupled to the memory fabric. The packet processor is configured to read, in response to having received the generated event message, at least a portion of the received network packet from the memory fabric, identify an agent of the NIC for additional processing of the received network packet, generate a network packet received event message indicating the received network packet is available for processing, and transmit the network packet received event message to the identified agent. Other embodiments are described herein.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: August 18, 2020
    Assignee: Intel Corporation
    Inventors: Brad Burres, Ronen Chayat, Alain Gravel, Robert Hathaway, Amit Y. Kumar, Jose Niell, Nadav Turbovich
  • Patent number: 10541941
    Abstract: Apparatus and methods for cableless connection of components within chassis and between separate chassis. Pairs of Extremely High Frequency (EHF) transceiver chips supporting very short length millimeter-wave wireless communication links are configured to pass radio frequency signals through holes in one or more metal layers in separate chassis and/or frames, enabling components in the separate chassis to communicate without requiring cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. The EHF-based wireless links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: January 21, 2020
    Assignee: Intel Corporation
    Inventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Hugh Wilkinson, Amit Y. Kumar
  • Patent number: 10374726
    Abstract: Apparatus and methods for rack level pre-installed interconnect for enabling cableless server, storage, and networking deployment. Plastic cable waveguides are configured to couple millimeter-wave radio frequency (RF) signals between two or more Extremely High Frequency (EHF) transceiver chips, thus supporting millimeter-wave wireless communication links enabling components in the separate chassis to communicate without requiring wire or optical cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. A plurality of plastic cable waveguide may be coupled to applicable support/mounting members, which in turn are mounted to a rack and/or top-of-rack switches. This enables the plastic cable waveguides to be pre-installed at the rack level, and further enables racks to be installed and replaced without requiring further cabling for the supported communication links.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: August 6, 2019
    Assignee: Intel Corporation
    Inventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Hugh Wilkinson, Amit Y. Kumar
  • Publication number: 20180302341
    Abstract: Apparatus and methods for cableless connection of components within chassis and between separate chassis. Pairs of Extremely High Frequency (EHF) transceiver chips supporting very short length millimeter-wave wireless communication links are configured to pass radio frequency signals through holes in one or more metal layers in separate chassis and/or frames, enabling components in the separate chassis to communicate without requiring cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. The EHF-based wireless links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.
    Type: Application
    Filed: April 6, 2018
    Publication date: October 18, 2018
    Applicant: lntel Corporation
    Inventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Hugh Wilkinson, Amit Y. Kumar
  • Publication number: 20180212686
    Abstract: Apparatus and methods for rack level pre-installed interconnect for enabling cableless server, storage, and networking deployment. Plastic cable waveguides are configured to couple millimeter-wave radio frequency (RF) signals between two or more Extremely High Frequency (EHF) transceiver chips, thus supporting millimeter-wave wireless communication links enabling components in the separate chassis to communicate without requiring wire or optical cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. A plurality of plastic cable waveguide may be coupled to applicable support/mounting members, which in turn are mounted to a rack and/or top-of-rack switches. This enables the plastic cable waveguides to be pre-installed at the rack level, and further enables racks to be installed and replaced without requiring further cabling for the supported communication links.
    Type: Application
    Filed: January 18, 2018
    Publication date: July 26, 2018
    Applicant: lntel Corporation
    Inventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Hugh Wilkinson, Amit Y. Kumar
  • Publication number: 20180152383
    Abstract: Technologies for processing network packets in an agent-mesh architecture include a network interface controller (NIC) of a computing device configured to write, by a network fabric interface of a memory fabric of the NIC, a received network packet to the memory fabric in a distributed fashion. The network fabric interface is configured to send an event message indicating the received network packet to a packet processor communicatively coupled to the memory fabric. The packet processor is configured to read, in response to having received the generated event message, at least a portion of the received network packet from the memory fabric, identify an agent of the NIC for additional processing of the received network packet, generate a network packet received event message indicating the received network packet is available for processing, and transmit the network packet received event message to the identified agent. Other embodiments are described herein.
    Type: Application
    Filed: September 29, 2017
    Publication date: May 31, 2018
    Inventors: Brad Burres, Ronen Chayat, Alain Gravel, Robert Hathaway, Amit Y. Kumar, Jose Niell, Nadav Turbovich
  • Patent number: 9961018
    Abstract: Apparatus and methods for cableless connection of components within chassis and between separate chassis. Pairs of Extremely High Frequency (EHF) transceiver chips supporting very short length millimeter-wave wireless communication links are configured to pass radio frequency signals through holes in one or more metal layers in separate chassis and/or frames, enabling components in the separate chassis to communicate without requiring cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. The EHF-based wireless links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.
    Type: Grant
    Filed: September 12, 2016
    Date of Patent: May 1, 2018
    Assignee: Intel Corporation
    Inventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Hugh Wilkinson, Amit Y. Kumar
  • Publication number: 20170126330
    Abstract: Apparatus and methods for rack level pre-installed interconnect for enabling cableless server, storage, and networking deployment. Plastic cable waveguides are configured to couple millimeter-wave radio frequency (RF) signals between two or more Extremely High Frequency (EHF) transceiver chips, thus supporting millimeter-wave wireless communication links enabling components in the separate chassis to communicate without requiring wire or optical cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. A plurality of plastic cable waveguide may be coupled to applicable support/mounting members, which in turn are mounted to a rack and/or top-of-rack switches. This enables the plastic cable waveguides to be pre-installed at the rack level, and further enables racks to be installed and replaced without requiring further cabling for the supported communication links.
    Type: Application
    Filed: October 21, 2016
    Publication date: May 4, 2017
    Applicant: lntel Corporation
    Inventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Hugh Wilkinson, Amit Y. Kumar
  • Publication number: 20160380923
    Abstract: Apparatus and methods for cableless connection of components within chassis and between separate chassis. Pairs of Extremely High Frequency (EHF) transceiver chips supporting very short length millimeter-wave wireless communication links are configured to pass radio frequency signals through holes in one or more metal layers in separate chassis and/or frames, enabling components in the separate chassis to communicate without requiring cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. The EHF-based wireless links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.
    Type: Application
    Filed: September 12, 2016
    Publication date: December 29, 2016
    Applicant: lntel Corporation
    Inventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Hugh Wilkinson, Amit Y. Kumar
  • Patent number: 9496592
    Abstract: Apparatus and methods for rack level pre-installed interconnect for enabling cableless server, storage, and networking deployment. Plastic cable waveguides are configured to couple millimeter-wave radio frequency (RF) signals between two or more Extremely High Frequency (EHF) transceiver chips, thus supporting millimeter-wave wireless communication links enabling components in the separate chassis to communicate without requiring wire or optical cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. A plurality of plastic cable waveguide may be coupled to applicable support/mounting members, which in turn are mounted to a rack and/or top-of-rack switches. This enables the plastic cable waveguides to be pre-installed at the rack level, and further enables racks to be installed and replaced without requiring further cabling for the supported communication links.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: November 15, 2016
    Assignee: Intel Corporation
    Inventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Hugh Wilkinson, Amit Y. Kumar
  • Patent number: 9450635
    Abstract: Apparatus and methods for cableless connection of components within chassis and between separate chassis. Pairs of Extremely High Frequency (EHF) transceiver chips supporting very short length millimeter-wave wireless communication links are configured to pass radio frequency signals through holes in one or more metal layers in separate chassis and/or frames, enabling components in the separate chassis to communicate without requiring cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. The EHF-based wireless links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.
    Type: Grant
    Filed: April 3, 2014
    Date of Patent: September 20, 2016
    Assignee: Intel Corporation
    Inventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Hugh Wilkinson, Amit Y. Kumar
  • Publication number: 20150288410
    Abstract: Apparatus and methods for cableless connection of components within chassis and between separate chassis. Pairs of Extremely High Frequency (EHF) transceiver chips supporting very short length millimeter-wave wireless communication links are configured to pass radio frequency signals through holes in one or more metal layers in separate chassis and/or frames, enabling components in the separate chassis to communicate without requiring cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. The EHF-based wireless links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.
    Type: Application
    Filed: April 3, 2014
    Publication date: October 8, 2015
    Inventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Hugh Wilkinson, Amit Y. Kumar
  • Publication number: 20150280827
    Abstract: Apparatus and methods for rack level pre-installed interconnect for enabling cableless server, storage, and networking deployment. Plastic cable waveguides are configured to couple millimeter-wave radio frequency (RF) signals between two or more Extremely High Frequency (EHF) transceiver chips, thus supporting millimeter-wave wireless communication links enabling components in the separate chassis to communicate without requiring wire or optical cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. A plurality of plastic cable waveguide may be coupled to applicable support/mounting members, which in turn are mounted to a rack and/or top-of-rack switches. This enables the plastic cable waveguides to be pre-installed at the rack level, and further enables racks to be installed and replaced without requiring further cabling for the supported communication links.
    Type: Application
    Filed: March 27, 2014
    Publication date: October 1, 2015
    Inventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Hugh Wilkinson, Amit Y. Kumar