Patents by Inventor Amrita Mallik

Amrita Mallik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Two material high K thermal encapsulant system
    Patent number: 10475715
    Abstract: Some embodiments relate to an electronic package. The electronic package includes a first die and a second die stacked onto the first die. A first encapsulant is positioned between the first die and the second die. The first encapsulant includes a first material that covers a first volume between the first die and the second die. A second encapsulant is positioned between the first die and the second die. The second encapsulant includes a second material that covers a second volume between the first die and the second die. The first material has a higher thermal conductivity than the second material, and the second material more effectively promotes electrical connections between the first die and the second die as compared to the first material.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: November 12, 2019
    Assignee: Intel Corporation
    Inventors: Venmathy McMahan, Sivakumar Nagarajan, Elah Bozorg-Grayeli, Amrita Mallik, Kuang-Han Chu, Liwei Wang, Nisha Ananthakrishnan, Craig J. Weinman, Amram Eitan
  • Thermocompression bonding using plasma gas
    Patent number: 10297567
    Abstract: Described herein are devices and techniques for thermocompression bonding. A device can include a housing, a platform, and a plasma jet. The housing can define a chamber. The platform can be located within the chamber and can be proximate a thermocompression chip bonder. The plasma jet can be located proximate the platform. The plasma jet can be movable about the platform. The plasma jet can include a nozzle arranged to direct a plasma gas onto the platform. Also described are other embodiments for thermocompression bonding.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: May 21, 2019
    Assignee: Intel Corporation
    Inventors: Donglai David Lu, Jimin Yao, Amrita Mallik, George S. Kostiew, Shawna M. Liff
  • THERMOCOMPRESSION BONDING USING PLASMA GAS
    Publication number: 20170179070
    Abstract: Described herein are devices and techniques for thermocompression bonding. A device can include a housing, a platform, and a plasma jet. The housing can define a chamber. The platform can be located within the chamber and can be proximate a thermocompression chip bonder. The plasma jet can be located proximate the platform. The plasma jet can be movable about the platform. The plasma jet can include a nozzle arranged to direct a plasma gas onto the platform. Also described are other embodiments for thermocompression bonding.
    Type: Application
    Filed: December 18, 2015
    Publication date: June 22, 2017
    Inventors: Donglai David Lu, Jimin Yao, Amrita Mallik, George S. Kostiew, Shawna M. Liff
  • TWO MATERIAL HIGH K THERMAL ENCAPSULANT SYSTEM
    Publication number: 20170170088
    Abstract: Some embodiments relate to an electronic package. The electronic package includes a first die and a second die stacked onto the first die. A first encapsulant is positioned between the first die and the second die. The first encapsulant includes a first material that covers a first volume between the first die and the second die. A second encapsulant is positioned between the first die and the second die. The second encapsulant includes a second material that covers a second volume between the first die and the second die. The first material has a higher thermal conductivity than the second material, and the second material more effectively promotes electrical connections between the first die and the second die as compared to the first material.
    Type: Application
    Filed: June 17, 2015
    Publication date: June 15, 2017
    Inventors: Venmathy McMahan, Sivakumar Nagarajan, Elah Bozorg-Grayeli, Amrita Mallik, Kuang-Han Chu, Liwei Wang, Nisha Ananthakrishnan, Craig J. Weinman, Amram Eitan