Abstract: Strings of non-volatile memory cells include one or more joint regions adjacent to dummy non-volatile memory cells. During erase operations, different voltage levels are used for different dummy word lines coupled to respective dummy non-volatile memory cells. For example, a selection circuit may set a voltage level of a particular dummy word line to a voltage level greater than a different dummy word line. In another example, the selection circuit may determine a voltage level for a given dummy word line based on a distance between a non-volatile memory cell coupled to the given dummy word line and a selection device included in a string of non-volatile memory cells. Electron holes generated using the dummy word lines during erase operations may neutralize undesired trapped charges in a non-volatile memory string, thereby reducing disparity in erase times for different strings in the non-volatile memory circuit.

Abstract: Strings of non-volatile memory cells include one or more joint regions adjacent to dummy non-volatile memory cells. During erase operations, different voltage levels are used for different dummy word lines coupled to respective dummy non-volatile memory cells. For example, a selection circuit may set a voltage level of a particular dummy word line to a voltage level greater than a different dummy word line. In another example, the selection circuit may determine a voltage level for a given dummy word line based on a distance between a non-volatile memory cell coupled to the given dummy word line and a selection device included in a string of non-volatile memory cells. Electron holes generated using the dummy word lines during erase operations may neutralize undesired trapped charges in a non-volatile memory string, thereby reducing disparity in erase times for different strings in the non-volatile memory circuit.

Abstract: In non-volatile memory circuits, the amount of time needed for bit lines to settle can vary significantly depending on the location of the blocks selected. For example, in a sensing operation, the amount of time for bit lines to settle when being pre-charged by sense amplifiers will be shorter for blocks near the sense amps than for far side blocks. These variations can be particularly acute in high density memory structures, such as in 3D NAND memory, such as that of the BiCS variety. Rather than use the same timing for all blocks, the blocks can be segmented into groups based on their proximity to the sense amps. When performing a sensing operation, the timing can be adjusted based on the block group to which a selected page of memory cells belongs.

Abstract: In non-volatile memory circuits, the amount of time needed for bit lines to settle can vary significantly depending on the location of the blocks selected. For example, in a sensing operation, the amount of time for bit lines to settle when being pre-charged by sense amplifiers will be shorter for blocks near the sense amps than for far side blocks. These variations can be particularly acute in high density memory structures, such as in 3D NAND memory, such as that of the BiCS variety. Rather than use the same timing for all blocks, the blocks can be segmented into groups based on their proximity to the sense amps. When performing a sensing operation, the timing can be adjusted based on the block group to which a selected page of memory cells belongs.