Abstract: Movement of an autonomously motile device may be controlled by a user device. The user device may display image data captured by a camera of the autonomously motile device; a user may provide input, such as a touch gesture on a display screen, indicating a command for the autonomously motile device to move to a location indicated by the input. The autonomously motile device determines a coordinate of the input and a time of the touch input; the autonomously motile device then determines a direction and distance of a corresponding movement.

Abstract: A door interface system for a vehicle door includes a sensor and a visual indicator. The sensor may be a proximity sensor and may be positioned proximate to the visual indicator such that it will detect an object proximate to the proximity sensor. The visual indicator may convey the position of the sensor and/or a status of the vehicle door. The door interface system is configured to control the vehicle door based at least in part on detecting an object proximate the visual indicator.

Abstract: A combination (10) pillow (P) and sling (S) in which respective ends of the sling are secured to corresponding ends of the pillow. The pillow is filled with a cushioning material that supports a wearer's head or neck. The sling is sized to fit about a support for the wearer to rest their head or neck against the pillow when the sling is attached to the support, or to fit over and about an upper portion of the wearer's anatomy to cushion something resting on or against the pillow in front of the wearer.

Abstract: Systems and methods for creating a personalized health program are disclosed. The systems and methods may use a personalization engine to accept health data and condition specific actions and to output a list of at least one personalized action. The personalized actions may help patients in creating and sustaining behaviors to help improve health and productivity and lower healthcare costs. Such personalized health programs may use incentives to make such programs more effective.

Abstract: The invention provides a heat sink assembly having a positionable heat sink permitting the heat sink to be mounted to a substrate in more than one configuration. Various features are described for permitting multiple degrees of freedom in the arrangement of the heat sink assembly. Such features permit the heat sink assembly to be adapted to different environments. The heat sink assembly also has features such as a vane for directing air flow relative to the heat sink. Features for varying and maintaining pressure between the heat sink and a component to be cooled are also included.

Abstract: A thermo-electro sub-assembly comprises a gas supply, a first duct, a first heatsink adjacent a first device, a second duct, and a second heat sink adjacent a second device. The gas supply may be realized as a fan, a blower, or a compressed gas source. The first duct provides a passageway for delivering pressurized gas from the gas supply to the first heat sink. The duct may include a plurality of vanes for reducing the turbulence and air boundary separation within the duct. The first heatsink is in thermal communication with a first heat-producing device such as a microprocessor. In a preferred embodiment the heatsink comprises an axial shaped folded fin heatsink. The second duct is used to provide a pathway for the air leaving the first heatsink and delivers the air to the second heatsink. The second duct may also include a plurality of vanes for reducing turbulence and boundary flow separation within the second duct.

Abstract: The invention provides a heat sink assembly having a positionable heat sink permitting the heat sink to be mounted to a substrate in more than one configuration. Various features are described for permitting multiple degrees of freedom in the arrangement of the heat sink assembly. Such features permit the heat sink assembly to be adapted to different environments. The heat sink assembly also has features such as a vane for directing air flow relative to the heat sink. Features for varying and maintaining pressure between the heat sink and a component to be cooled are also included.

Abstract: A heat removal system comprising a gas supply, a duct, and a heatsink is presented. The gas supply may be realized as a fan, a blower, or a compressed gas source and is located remotely from the heatsink. The duct provides a passageway for delivering high velocity gas from the gas supply to the first heat sink. The duct includes a plurality of vanes for reducing the turbulence and air boundary separation within the duct. The heatsink is in thermal communication with a heat-producing device such as a microprocessor.

Abstract: The present invention comprises a heatsink adjacent a first device wherein a gas supply can be located to provide gas in any direction with respect to the heatsink. The gas supply may be realized as a fan, a blower, or a compressed gas source. The gas supply may be provided in any direction or in multiple directions. The heatsink is in thermal communication with a first heat-producing device such as a microprocessor. In a preferred embodiment the heatsink comprises a radial shaped folded fin heatsink arranged for axial flow.

Abstract: A heat removal system comprising a gas supply, a duct, and a heatsink is presented. The gas supply may be realized as a fan, a blower, or a compressed gas source and is located remotely from the heatsink. The duct provides a passageway for delivering high velocity gas from the gas supply to the first heat sink. The duct includes a plurality of vanes for reducing the turbulence and air boundary separation within the duct. The heatsink is in thermal communication with a heat-producing device such as a microprocessor.

Abstract: A thermo-electro sub-assembly comprises a gas supply, a first duct, a first heatsink adjacent a first device, a second duct, and a second heat sink adjacent a second device. The gas supply may be realized as a fan, a blower, or a compressed gas source. The first duct provides a passageway for delivering pressurized gas from the gas supply to the first heat sink. The duct may include a plurality of vanes for reducing the turbulence and air boundary separation within the duct. The first heatsink is in thermal communication with a first heat-producing device such as a microprocessor. In a preferred embodiment the heatsink comprises an axial shaped folded fin heatsink. The second duct is used to provide a pathway for the air leaving the first heatsink and delivers the air to the second heatsink. The second duct may also include a plurality of vanes for reducing turbulence and boundary flow separation within the second duct.