Patents by Inventor An-Chi Tsao
An-Chi Tsao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240178159Abstract: A coreless substrate package includes a coreless substrate; a package device mounted on a coreless substrate; an underfill material filling into a space between the package device and the coreless substrate; a stiffener ring disposed on a top surface of the coreless substrate along perimeter of the coreless substrate; and a gap fill material disposed in a gap between the stiffener ring and the package device.Type: ApplicationFiled: November 6, 2023Publication date: May 30, 2024Applicant: MEDIATEK INC.Inventors: Pei-Haw Tsao, Te-Chi Wong
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Patent number: 11996468Abstract: A method of fabricating a device includes providing a fin having an epitaxial layer stack with a plurality of semiconductor channel layers interposed by a plurality of dummy layers. In some embodiments, the method further includes exposing lateral surfaces of the plurality of semiconductor channel layers and the plurality of dummy layers within a source/drain region of the semiconductor device. In some examples, the method further includes etching the exposed lateral surfaces of the plurality of dummy layers to form recesses and forming an inner spacer within each of the recesses, where the inner spacer includes a sidewall profile having a convex shape. In some cases, and after forming the inner spacer, the method further includes performing a sheet trim process to tune the sidewall profile of the inner spacer such that the convex shape of the sidewall profile becomes a substantially vertical sidewall surface after the sheet trim process.Type: GrantFiled: September 2, 2021Date of Patent: May 28, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chien-Chih Lin, Hsiu-Hao Tsao, Szu-Chi Yang, Shih-Hao Lin, Yu-Jiun Peng, Chang-Jhih Syu, An Chyi Wei
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Publication number: 20240159147Abstract: A performance monitoring system for a disc cutter of a tunnel boring machine (TBM) is provided, and includes a disc cutter body, a shaft assembly and an isolation boss; the shaft assembly includes a shaft main body and a bearing spacer located on the shaft main body; a rotating mechanism is arranged in a space between the isolation boss and the bearing spacer; the rotating mechanism includes a rotator and a T-shaped extension support located between the bearing spacer and the rotator; bearing retainers of roller bearings are arranged on two sides of the T-shaped extension support; a ring-shaped grating strip is arranged on one side of the rotator close to the T-shaped extension support; a connecting component is arranged on one side of the rotator away from a rotating bearing; and a sealing assembly is arranged between the T-shaped extension support and the rotator.Type: ApplicationFiled: November 16, 2023Publication date: May 16, 2024Inventors: Nan-Kuang CHEN, Si-Chi CHEN, Hsuan-Yu CHEN, Wan-Shan TSAO
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Patent number: 11948800Abstract: A device includes a pair of gate spacers on a substrate, and a gate structure on the substrate and between the gate spacers. The gate structure includes an interfacial layer, a metal oxide layer, a nitride-containing layer, a tungsten-containing layer, and a metal compound layer. The interfacial layer is over the substrate. The metal oxide layer is over the interfacial layer. The nitride-containing layer is over the metal oxide layer. The tungsten-containing layer is over the nitride-containing layer. The metal compound layer is over the tungsten-containing layer. The metal compound layer has a different material than a material of the tungsten-containing layer.Type: GrantFiled: December 14, 2022Date of Patent: April 2, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yen-Yu Chen, Yu-Chi Lu, Chih-Pin Tsao, Shih-Hsun Chang
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Patent number: 11887967Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the firs surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed by the first package body.Type: GrantFiled: October 4, 2021Date of Patent: January 30, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Shang-Ruei Wu, Chien-Yuan Tseng, Meng-Jen Wang, Chen-Tsung Chang, Chih-Fang Wang, Cheng-Han Li, Chien-Hao Chen, An-Chi Tsao, Per-Ju Chao
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Publication number: 20220028836Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the first surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.Type: ApplicationFiled: October 4, 2021Publication date: January 27, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shang-Ruei WU, Chien-Yuan TSENG, Meng-Jen WANG, Chen-Tsung CHANG, Chih-Fang WANG, Cheng-Han LI, Chien-Hao CHEN, An-Chi TSAO, Per-Ju CHAO
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Patent number: 11206495Abstract: A MEMS microphone includes a substrate. A dielectric layer is disposed on the substrate, having an opening and includes: indent region surrounding the opening; pillars extending from an indent surface at the indent region to the substrate; and an outer part surrounding the indent region and disposed on the substrate. A signal sensing space is created at the indent region between the pillars and between the pillars and the outer part. A first electrode layer is disposed on the indent surface of the dielectric layer. A second electrode layer is disposed on the substrate. A sensing diaphragm is held by the dielectric layer, including two elastic diaphragms supported by the dielectric layer; and a conductive plate between the first elastic diaphragm and the second elastic diaphragm. The conductive plate has a central part embedded in the holding structure and a peripheral part extending into the signal sensing space.Type: GrantFiled: November 7, 2019Date of Patent: December 21, 2021Assignee: Solid State System Co., Ltd.Inventors: Tsung-Min Hsieh, Li-Chi Tsao, Chien-Hsing Lee
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Patent number: 11139274Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the first surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.Type: GrantFiled: January 31, 2020Date of Patent: October 5, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Shang-Ruei Wu, Chien-Yuan Tseng, Meng-Jen Wang, Chen-Tsung Chang, Chih-Fang Wang, Cheng-Han Li, Chien-Hao Chen, An-Chi Tsao, Per-Ju Chao
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Publication number: 20210144485Abstract: A MEMS microphone includes a substrate. A dielectric layer is disposed on the substrate, having an opening and includes: indent region surrounding the opening; pillars extending from an indent surface at the indent region to the substrate; and an outer part surrounding the indent region and disposed on the substrate. A signal sensing space is created at the indent region between the pillars and between the pillars and the outer part. A first electrode layer is disposed on the indent surface of the dielectric layer. A second electrode layer is disposed on the substrate. A sensing diaphragm is held by the dielectric layer, including two elastic diaphragms supported by the dielectric layer; and a conductive plate between the first elastic diaphragm and the second elastic diaphragm. The conductive plate has a central part embedded in the holding structure and a peripheral part extending into the signal sensing space.Type: ApplicationFiled: November 7, 2019Publication date: May 13, 2021Applicant: Solid State System Co., Ltd.Inventors: Tsung-Min Hsieh, Li-Chi Tsao, Chien-Hsing Lee
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Publication number: 20210113492Abstract: The present disclosure provides a method for inhibiting proliferation and metastasis of cancer cells by using a naphthoquinone derivative.Type: ApplicationFiled: July 9, 2020Publication date: April 22, 2021Inventors: Linyi Chen, Yu-Jung Chang, Yen-Chi Tsao, Chun-Hsien Wang
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Publication number: 20200251449Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the firs surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.Type: ApplicationFiled: January 31, 2020Publication date: August 6, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shang-Ruei Wu, Chien-Yuan Tseng, Meng-Jen Wang, Chen-Tsung Chang, Chih-Fang Wang, Cheng-Han Li, Chien-Hao Chen, An-Chi Tsao, Per-Ju Chao
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Patent number: 10728674Abstract: A structure of micro-electro-mechanical-system (MEMS) microphone package includes a packaging substrate and an integrated circuit disposed on the packaging substrate. In addition, a MEMS microphone is disposed on the packaging substrate, wherein the MEMS microphone is electrically connected to the integrated circuit. A conductive adhesion layer is disposed on the packaging substrate, surrounding the integrated circuit and the MEMS microphone. A cap structure has a bottom part being adhered to the conductive adhesion layer. An underfill layer is disposed on the packaging substrate, covering an outer side of the conductive adhesion layer.Type: GrantFiled: August 27, 2018Date of Patent: July 28, 2020Assignee: Solid State System Co., Ltd.Inventors: Tsung-Min Hsieh, Li-Chi Tsao, Chien-Hsing Lee, Jhyy-Cheng Liou
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Publication number: 20200068317Abstract: A structure of micro-electro-mechanical-system (MEMS) microphone package includes a packaging substrate and an integrated circuit disposed on the packaging substrate. In addition, a MEMS microphone is disposed on the packaging substrate, wherein the MEMS microphone is electrically connected to the integrated circuit. A conductive adhesion layer is disposed on the packaging substrate, surrounding the integrated circuit and the MEMS microphone. A cap structure has a bottom part being adhered to the conductive adhesion layer. An underfill layer is disposed on the packaging substrate, covering an outer side of the conductive adhesion layer.Type: ApplicationFiled: August 27, 2018Publication date: February 27, 2020Applicant: Solid State System Co., Ltd.Inventors: Tsung-Min Hsieh, Li-Chi Tsao, Chien-Hsing Lee, Jhyy-Cheng Liou
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Patent number: 8952330Abstract: System and method for EMI shielding for a CD-SEM are described. One embodiment is a scanning electron microscope (“SEM”) comprising an electron gun for producing an electron beam directed toward a sample; a secondary electron (“SE”) detector for detecting secondary electrons reflected from the sample in response to the electron beam; and a dual-layer shield disposed around and enclosing the SE detector. The shield comprises a magnetic shielding lamina layer and a metallic foil layer.Type: GrantFiled: January 17, 2014Date of Patent: February 10, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Chi Tsao, Syun-Jie Jhan, Yi-Cheng Shih, Chwen Yu
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Publication number: 20140318213Abstract: An acoustic micro-device testing apparatus including an acoustic device, at least one device under test (DUT), and a bearing plate is disclosed. The acoustic device provides a testing acoustic source to a first side of the DUT through the main channel and to a second side of the DUT through the side channel. The bearing plate has a first surface and a second surface. The first surface has a chamber sunken into the bearing plate. The second surface has a bearing space sunken into the bearing plate and bearing the DUT. The bearing plate has a main channel connecting the chamber and the DUT and at least one side channel connecting the chamber and the bearing space directly or through the main channel. A cover unit covers the bearing plate so that the bearing space and the chamber form a confined space. The DUT is in the confined space.Type: ApplicationFiled: June 28, 2013Publication date: October 30, 2014Inventors: Li-Chi Tsao, Chien-Hsing Lee
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Publication number: 20140124667Abstract: System and method for EMI shielding for a CD-SEM are described. One embodiment is a scanning electron microscope (“SEM”) comprising an electron gun for producing an electron beam directed toward a sample; a secondary electron (“SE”) detector for detecting secondary electrons reflected from the sample in response to the electron beam; and a dual-layer shield disposed around and enclosing the SE detector. The shield comprises a magnetic shielding lamina layer and a metallic foil layer.Type: ApplicationFiled: January 17, 2014Publication date: May 8, 2014Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Chi Tsao, Syun-Jie Jhan, Yi-Cheng Shih, Chwen Yu
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Patent number: 8633439Abstract: System and method for EMI shielding for a CD-SEM are described. One embodiment is a scanning electron microscope (“SEM”) comprising an electron gun for producing an electron beam directed toward a sample; a secondary electron (“SE”) detector for detecting secondary electrons reflected from the sample in response to the electron beam; and a dual-layer shield disposed around and enclosing the SE detector. The shield comprises a magnetic shielding lamina layer and a metallic foil layer.Type: GrantFiled: July 1, 2011Date of Patent: January 21, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Chi Tsao, Syun-Jie Jhan, Yi-Cheng Shih, Chwen Yu
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Patent number: 8464589Abstract: A MEMS structure includes a substrate, a structural dielectric layer, and a diaphragm. A structural dielectric layer is disposed over the substrate. The diaphragm is held by the structural dielectric layer at a peripheral end. The diaphragm includes multiple trench/ridge rings at a peripheral region surrounding a central region of the diaphragm. A corrugated structure is located at the central region of the diaphragm, surrounded by the trench/indent rings.Type: GrantFiled: October 14, 2010Date of Patent: June 18, 2013Assignee: Solid State System Co., Ltd.Inventors: Chien-Hsing Lee, Tsung-Min Hsieh, Li-Chi Tsao, Jhyy-Cheng Liou
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Publication number: 20130001419Abstract: System and method for EMI shielding for a CD-SEM are described. One embodiment is a scanning electron microscope (“SEM”) comprising an electron gun for producing an electron beam directed toward a sample; a secondary electron (“SE”) detector for detecting secondary electrons reflected from the sample in response to the electron beam; and a dual-layer shield disposed around and enclosing the SE detector. The shield comprises a magnetic shielding lamina layer and a metallic foil layer.Type: ApplicationFiled: July 1, 2011Publication date: January 3, 2013Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chia-Chi Tsao, Syun-Jie Jhan, Yi-Cheng Shih, Chwen Yu
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Patent number: 8240057Abstract: A method of manufacturing a self-aligned stylus with high sphericity includes the steps of: forming a polymeric layer on a substrate; placing a sphere on the polymeric layer; softening the polymeric layer to make a portion of the sphere sink into the polymeric layer; forming a specific light absorbing layer on the polymeric layer; illuminating the sphere and the specific light absorbing layer with specific light such that the specific light is focused by the sphere to expose the polymeric layer to form an exposed portion and an unexposed portion; removing the specific light absorbing layer; and baking the polymeric layer and then removing the unexposed portion. A self-aligned stylus with high sphericity is also disclosed.Type: GrantFiled: April 22, 2008Date of Patent: August 14, 2012Assignee: National Taiwan UniversityInventors: Wen-Pin Shih, Yao-Chuan Tsai, Duo-Ru Chang, Li-Chi Tsao, Ming-Dao Wu, Po-Jen Shih