Patents by Inventor AN-CHIN LAI

AN-CHIN LAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240155185
    Abstract: A channel hiatus correction method for an HDMI device is provided. A recovery code from scrambled data of the stream is obtained. A liner feedback shift register (LFSR) value of channels of the HDMI port is obtained based on the recovery code and the scrambled data of the stream. The stream is de-scrambled according to the LFSR value of the channels of the HDMI port. Video data is displayed according to the de-scrambled stream.
    Type: Application
    Filed: November 9, 2022
    Publication date: May 9, 2024
    Inventors: Chia-Hao CHANG, You-Tsai JENG, Kai-Wen YEH, Yi-Cheng CHEN, Te-Chuan WANG, Kai-Wen CHENG, Chin-Lung LIN, Tai-Lai TUNG, Ko-Yin LAI
  • Publication number: 20240144717
    Abstract: Disclosed are systems, apparatuses, processes, and computer-readable media to capture images. A method of processing image data includes determining a first region of interest (ROI) in an image. The first ROI is associated with a first object. The method can include determining one or more image characteristics of the first ROI. The method can further include determining whether to perform an upsampling process on image data in the first ROI based on the one or more image characteristics of the first ROI.
    Type: Application
    Filed: October 26, 2022
    Publication date: May 2, 2024
    Inventors: Wen-Chun FENG, Kai LIU, Su-Chin CHIU, Chung-Yan CHIH, Yu-Ren LAI
  • Publication number: 20240145379
    Abstract: Methods and semiconductor devices are provided. A method includes determining a location of a polyimide opening (PIO) corresponding to an under-bump metallization (UBM) feature in a die. The die includes a substrate and an interconnect structure over the substrate. The method also includes determining a location of a stacked via structure in the interconnect structure based on the location of the PIO. The method further includes forming, in the interconnect structure, the stacked via structure comprising at most three stacked contact vias at the location of the PIO.
    Type: Application
    Filed: February 23, 2023
    Publication date: May 2, 2024
    Inventors: Yen-Kun Lai, Wei-Hsiang Tu, Ching-Ho Cheng, Cheng-Nan Lin, Chiang-Jui Chu, Chien Hao Hsu, Kuo-Chin Chang, Mirng-Ji Lii
  • Patent number: 11962847
    Abstract: A channel hiatus correction method for an HDMI device is provided. A recovery code from scrambled data of the stream is obtained. A liner feedback shift register (LFSR) value of channels of the HDMI port is obtained based on the recovery code and the scrambled data of the stream. The stream is de-scrambled according to the LFSR value of the channels of the HDMI port. Video data is displayed according to the de-scrambled stream.
    Type: Grant
    Filed: November 9, 2022
    Date of Patent: April 16, 2024
    Assignee: MEDIATEK INC.
    Inventors: Chia-Hao Chang, You-Tsai Jeng, Kai-Wen Yeh, Yi-Cheng Chen, Te-Chuan Wang, Kai-Wen Cheng, Chin-Lung Lin, Tai-Lai Tung, Ko-Yin Lai
  • Patent number: 11961951
    Abstract: A light emitting diode device includes a substrate, a conductive via, first and second conductive pads, a driving chip, a flat layer, a redistribution layer, a light emitting diode, and an encapsulating layer. The substrate has a first surface and a second surface opposite thereto. The conductive via penetrates from the first surface to the second surface. The first and second conductive pads are respectively disposed on the first and second surface and in contact with the conductive via. The driving chip is disposed on the first surface. The flat layer is disposed over the first surface and covers the driving chip and the first conductive pad. The redistribution layer is disposed on the flat layer and electrically connects to the driving chip. The light emitting diode is flip-chip bonded to the redistribution layer. The encapsulating layer covers the redistribution layer and the light emitting diode.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: April 16, 2024
    Assignee: Lextar Electronics Corporation
    Inventors: Chih-Hao Lin, Jian-Chin Liang, Shih-Lun Lai, Jo-Hsiang Chen
  • Patent number: 11951233
    Abstract: Provided are methods of producing an acellular organ. The method includes the steps of, subjecting an organ derived from an animal to a static supercritical fluid (SCF) treatment followed by a dynamic SCF treatment. Optionally, the method of the present disclosure further includes a hypertonic and a hypotonic treatments prior to the static SCF treatment, and/or a neutralizing treatment after the dynamic SCF treatment. Also disclosed herein are acellular organs produced by the present method.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: April 9, 2024
    Assignee: ACRO BIOMEDICAL COMPANY. LTD.
    Inventors: Dar-Jen Hsieh, Chao-Yi Wei, Chao-Chin Chao, Jer-Cheng Kuo, Yi-Ping Lai, Srinivasan Periasamy
  • Patent number: 11949056
    Abstract: The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, micro light emitting elements, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting elements are disposed on the first adhesive layer and have a first surface facing to the first adhesive layer and an opposing second surface. The micro light emitting elements include a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting elements and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A thickness of the flexible substrate is less than 100 um.
    Type: Grant
    Filed: April 20, 2023
    Date of Patent: April 2, 2024
    Assignee: Lextar Electronics Corporation
    Inventors: Chih-Hao Lin, Jo-Hsiang Chen, Shih-Lun Lai, Min-Che Tsai, Jian-Chin Liang
  • Publication number: 20240084483
    Abstract: A liquid color masterbatch composition for fabricating a colored fiber includes 5 parts by weight to 45 parts by weight of a colorant, 40 parts by weight to 94 parts by weight of a carrier, and 1 part by weight to 15 parts by weight of a lubricant, in which a chemical structure of the lubricant includes a carbonyl group and an amine group.
    Type: Application
    Filed: February 6, 2023
    Publication date: March 14, 2024
    Inventors: Rih-Sheng CHIANG, Wei-Jen LAI, Huang-Chin HUNG
  • Publication number: 20230382066
    Abstract: A silicone hydrogel composition includes a first hydrophilic monomer, a siloxane compound, a first crosslinking monomer, a second hydrophilic monomer, and a second crosslinking monomer. The first hydrophilic monomer and the siloxane compound have an acrylate group or an acrylamide group and may also have a methacrylate group or a methacrylamide group. The first crosslinking monomer has a plurality of acrylate groups or acrylamide groups and may also have methacrylate groups or methacrylamide groups. The second hydrophilic monomer has a non-conjugated vinyl group. The second crosslinking monomer has a plurality of non-conjugated vinyl groups. A sum of the weights of the second hydrophilic monomer and the second crosslinking monomer is 40 to 100 parts by weight, relative to 100 parts by weight of the sum of the weights of the first hydrophilic monomer, the siloxane compound, and the first crosslinking monomer.
    Type: Application
    Filed: July 25, 2023
    Publication date: November 30, 2023
    Inventors: Yu-Chin LAI, Ting-Chun KUAN, Di-Yao HSU, Fang-Yu TSAI, Min-Tzung YEH
  • Publication number: 20230307316
    Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface. A semiconductor device is mounted on the top surface of the substrate. The semiconductor device has an active front surface directly facing the substrate, and an opposite rear surface. A vapor chamber lid is in thermal contact with the rear surface of the semiconductor device. The vapor chamber lid includes an internal vacuum-sealed cavity that stores a working fluid, and wick structures for recirculating the working fluid within the internal vacuum-sealed cavity.
    Type: Application
    Filed: March 1, 2023
    Publication date: September 28, 2023
    Applicant: MEDIATEK INC.
    Inventors: Chin-Lai Chen, Wei-Che Huang, Wen-Sung Hsu, Chun-Yin Lin, Li-Song Lin, Tai-Yu Chen
  • Patent number: 11760045
    Abstract: A silicone hydrogel composition includes a first hydrophilic monomer, a siloxane compound, a first crosslinking monomer, a second hydrophilic monomer, and a second crosslinking monomer. The first hydrophilic monomer and the siloxane compound have an acrylate group or an acrylamide group and may also have a methacrylate group or a methacrylamide group. The first crosslinking monomer has a plurality of acrylate groups or acrylamide groups and may also have methacrylate groups or methacrylamide groups. The second hydrophilic monomer has a non-conjugated vinyl group. The second crosslinking monomer has a plurality of non-conjugated vinyl groups. A sum of the weight of the second hydrophilic monomer and the weight of the second crosslinking monomer is 40 to 100 parts by weight, relative to 100 parts by weight of the sum of the weight of the first hydrophilic monomer, the weight of the siloxane compound, and the weight of the first crosslinking monomer.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: September 19, 2023
    Assignee: PEGAVISION CORPORATION
    Inventors: Yu-Chin Lai, Ting-Chun Kuan, Di-Yao Hsu, Fang-Yu Tsai, Min-Tzung Yeh
  • Patent number: 11760987
    Abstract: In alternative embodiments, provided are compositions, including products of manufacture and kits, and methods, for treating a heart failure in a subject in need thereof comprising administering to the subject an isolated or recombinant nucleic acid, an isolated or recombinant or chimeric polypeptide, or an engineered cell, as provided herein, thereby treating the subject. In alternative embodiments, the administration reduces left ventricular (LV) hypertrophy, increases LV peak pressure development, reduced cAMP production and/or improves LV peak pressure decay in a pressure-overload in the subject. In alternative embodiments, provided are compositions and methods for: treating, ameliorating, or slowing the progress of, or protecting (preventing) an individual or a patient against heart failure; or, reducing LV hypertrophy, increasing LV peak pressure development, and/or improving LV peak pressure decay in a pressure-overload in an individual in need thereof.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: September 19, 2023
    Assignees: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA, THE UNITED STATES OF AMERICA AS REPRESENTED BY THE DEPARTMENT OF VETERANS AFFAIRS
    Inventors: H. Kirk Hammond, Mei Hua Gao, Ngai Chin Lai
  • Publication number: 20230271073
    Abstract: A bicycle trainer includes a base having a base portion and a standing portion, a supporting frame rotationally pivoted on the standing portion of the base around an axle, a cassette module mounted on the supporting frame and having multiple sprockets, and a flywheel module mounted on the supporting frame. A height adjusting member includes the standing portion, the supporting frame and a fixing element. The fixing element is placed in or between the standing portion and the supporting frame for keeping the supporting frame at a predetermined angle with respect to the standing portion.
    Type: Application
    Filed: February 23, 2023
    Publication date: August 31, 2023
    Inventors: Hsiao-Wen HSU, Jen-Chieh HUANG, Chao-Wen CHEN, Chin-Lai HUANG, Wen-Hai LO
  • Publication number: 20230174185
    Abstract: A power-measuring device includes a spindle, a power gauge, an electrical circuit, and a cover. The spindle is configured to provide a coupling with a driving unit. The spindle includes a battery chamber within a hollow space of the spindle. The battery chamber is configured to receive a battery unit. The power gauge is coupled with the spindle to measure power applied to the spindle for driving a movement of the driving unit. The electrical circuit is coupled with the spindle, and electrically coupled with the power gauge. The electrical circuit is coupled with the battery unit and configured to receive and process signals from the power gauge. The cover is coupled with the spindle and arranged to enclose at least a portion of at least one of the power gauge and the electrical circuit.
    Type: Application
    Filed: November 24, 2022
    Publication date: June 8, 2023
    Applicant: GIANT MANUFACTURING CO., LTD.
    Inventors: Ching-Yao LIN, Chin-Lai HUANG, Chih-Kai CHANG, Chung-Wei LIN
  • Publication number: 20230046413
    Abstract: A semiconductor assembly package is provided. The semiconductor package assembly includes a system-on-chip (SOC) package, a memory package and a heat spreader. The SOC package includes a logic die and a first substrate. The logic die has pads on it. The first substrate is electrically connected to the logic die by the pads. The memory package includes a second substrate and a memory die. The second substrate has a top surface and a bottom surface. The memory die is mounted on the top surface of the second substrate and is electrically connected to the second substrate using bonding wires. The heat spreader is disposed between the SOC package and the memory package, wherein the heat spreader is in contact with a back surface of the logic die away from the pads.
    Type: Application
    Filed: July 15, 2022
    Publication date: February 16, 2023
    Inventors: Tai-Yu CHEN, Chin-Lai CHEN, Hsiao-Yun CHEN, Wen-Sung HSU, Haw-Kuen SU, Duen-Yi HO, Bo-Jiun YANG, Ta-Jen YU, Bo-Hao MA
  • Publication number: 20230019925
    Abstract: A self-powered apparatus is used for various kinds of cycling and indoor exercise devices. The self-powered apparatus includes a pedal unit, a spindle, a generator and an energy storage element. The pedal unit includes an inner surface to form an accommodating space therein. The spindle is accommodated in the accommodating space. The generator includes a stator and a rotor. The stator is disposed on the spindle, the rotor is disposed on the inner surface of the pedal unit, and the rotor surrounds the stator correspondingly and is non-contact with the stator. The energy storage element is electrically coupled to the generator. When the pedal unit is being pedaled to rotate by a rider, the stator is fixed on the spindle, the rotor rotates relatively to the stator and along with the pedal unit, and a power is generated by the generator to charge the energy storage element.
    Type: Application
    Filed: July 6, 2022
    Publication date: January 19, 2023
    Inventors: Ching-Yao LIN, Hsiao-Wen HSU, Chin-Lai HUANG
  • Patent number: 11493900
    Abstract: A warm-up method for a machine system including a machine component and a machine sensor configured to sense temperature of the machine component is provided. The method comprises steps of; A) activating the machine component to execute a warm-up operation for warming up the machine component; B) determining whether the machine component is warmed up based on a target temperature corresponding to the machine component and a temperature of the machine component that is currently sensed by the machine sensor; and C) when it is determined that the machine component is warmed up, making the machine component not execute the warm-up operation.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: November 8, 2022
    Assignee: HIWIN TECHNOLOGIES CORP.
    Inventors: Chen-Hsiung Hung, Yih-Chyun Hwang, Shui-Chin Lai, Yi Haung
  • Publication number: 20220322949
    Abstract: An ear thermometer capable of identifying an infrared transmittance of a probe cover is provided and includes an ear thermometer body, a probe, and a plurality of activation elements. The probe is disposed on the ear thermometer body. A closed end of the probe cover is used for infrared transmittance, and the probe cover has different infrared transmittances according to a thickness variation thereof. The activation elements are disposed on the ear thermometer body and configured to detect the infrared transmittance of the probe cover. Each of the activation elements includes an ON state and an OFF state so that the activation elements are arranged to form different sensor combinations, which respectively correspond to different infrared transmittances, and any two of the different sensor combinations have the two corresponding infrared transmittances that are different from one another.
    Type: Application
    Filed: April 8, 2021
    Publication date: October 13, 2022
    Inventors: YUNG-CHANG CHANG, TSENG-LUNG LIN, AN-CHIN LAI
  • Publication number: 20220016984
    Abstract: An electric vehicle includes a frame, at least one front wheel and at least one rear wheel coupled to the frame, one or more pedals coupled to the frame and configured for a user's engagement via pedaling, and a controller configured to output one or more driving signals in response to the pedaling of the one or more pedals. The electric vehicle also includes a first motor coupled to and configured to drive one of the front and rear wheels, and a first driver coupled with the first motor and configured to adjust the output to the first motor in response to the one or more driving signals.
    Type: Application
    Filed: July 9, 2021
    Publication date: January 20, 2022
    Applicant: GIANT MANUFACTURING CO., LTD.
    Inventors: Chin-Lai HUANG, Hsiao-Wen HSU, Sheng-Ho HSU
  • Patent number: D1008155
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: December 19, 2023
    Assignee: KENDA RUBBER IND. CO., LTD.
    Inventor: Li-Chin Lai