Abstract: A black polyester film and a method for manufacturing the same are provided. The black polyester film includes a physically recycled polyester resin and a chemically recycled polyester resin. The physically recycled polyester resin is formed by a plurality of physically recycled polyester chips. The chemically recycled polyester resin is formed by a plurality of chemically recycled polyester chips and mixed with the physically recycled polyester resin. The plurality of chemically recycled polyester chips further include chemically recycled electrostatic pinning polyester chips. The chemically recycled electrostatic pinning polyester chips contain electrostatic pinning additives, and the electrostatic pinning additives are metal salts. Expressed in percent by weight based on a total weight of the polyester film, a content of the electrostatic pinning additives in the polyester film is between 0.005% and 0.1% by weight. The black polyester film further includes a black additive.

Abstract: An electronic device including a protection layer, a display panel, and a sound broadcasting element is provided. The protection layer has an inner surface and a side surface directly connected to the inner surface. The display panel is disposed on the inner surface of the protection layer and has a back surface and a side surface directly connected to the back surface. The sound broadcasting element is located adjacent to the side surface of the display panel, and the sound broadcasting element includes a piezoelectric component and a connection component.

Abstract: A semiconductor structure includes a substrate, and an active device and a passive device over the substrate. The active device is disposed in a first region of the substrate, and the passive device is disposed in a second region of the substrate. The semiconductor structure further includes a shielding structure and a passivation layer. The shielding structure includes a barrier layer and a ceiling layer. The barrier layer is on the passive device and the active device, and the ceiling layer is on the barrier layer. The passivation layer is under the barrier layer and covers a top surface of the passive device. An air cavity is defined by sidewalls of the barrier layer, a bottom surface of the ceiling layer, and the substrate.

Abstract: A field effect transistor includes a substrate having a transistor forming region thereon; an insulating layer on the substrate; a first graphene layer on the insulating layer within the transistor forming region; an etch stop layer on the first graphene layer within the transistor forming region; a first inter-layer dielectric layer on the etch stop layer; a gate trench recessed into the first inter-layer dielectric layer and the etch stop layer within the transistor forming region; a second graphene layer on interior surface of the gate trench; a gate dielectric layer on the second graphene layer and on the first inter-layer dielectric layer; and a gate electrode on the gate dielectric layer within the gate trench.

Abstract: A semiconductor device includes first and second metal-insulator-metal structures. The first metal-insulator-metal structure includes a first bottom conductor plate, a first portion of a first dielectric layer, a first middle conductor plate, a first portion of a second dielectric layer, and a first top conductor plate stacked up one over another. The second metal-insulator-metal structure includes a second bottom conductor plate, a second portion of the first dielectric layer, a second middle conductor plate, a second portion of the second dielectric layer, and a second top conductor plate stacked up one over another. In a cross-sectional view, the first bottom conductor plate is wider than the first middle conductor plate that is wider than the first top conductor plate, and the second bottom conductor plate is narrower than the second middle conductor plate that is narrower than the first top conductor plate.

Abstract: A heat sealable polyester film and a method for manufacturing the same are provided. The heat sealable polyester film is made from a recycled polyester material. The heat sealable polyester film includes a base layer and a heat sealable layer formed on at least one surface of the base layer. The heat sealable layer is formed from a first polyester composition. A main component of the first polyester composition is regenerated polyethylene terephthalate and the first polyester composition further includes at least one of 1,4-butanediol, isophthalic acid, neopentyl glycol, and polybutylene terephthalate. A heat sealing temperature of the heat sealable polyester film ranges from 120° C. to 230° C.

Abstract: The disclosure discloses a heat-sealable polyester film, including a base layer and a heat-seal layer formed on the base layer. The heat-seal layer includes a physically regenerated polyester resin, a chemically regenerated polyester resin, and a modifier. The heat-sealable temperature of the heat-sealable polyester film is between 100° C. and 230° C.

Abstract: An electronic device is provided, including an electronic element, and a protective substrate. The protective substrate includes a concave portion, and a flat portion. The concave portion has a concave surface and a convex surface that is opposite to the concave surface. The flat portion is connected to the concave portion. The electronic element overlaps the concave portion and is arranged under the convex surface.

Abstract: A tag antenna structure of an information carrier includes a carrying sheet and a tag antenna disposed on the carrying sheet. An outer lateral edge of the carrying sheet is symmetrical to a first central axis, and a distance between the outer lateral edge of the carrying sheet and the first central axis is defined as a first outer radius. The tag antenna includes an annular segment and two extending segments respectively extending from two end portions of the annular segment. An outer lateral edge of the annular segment is symmetrical to a second central axis, and a distance between the outer lateral edge of the annular segment and the second central axis is defined as a second outer radius that is smaller than the first outer radius. The second central axis and the first central axis have an offset distance there-between that is larger than zero.

Abstract: A tag antenna structure of an information carrier includes a carrying sheet and a tag antenna disposed on the carrying sheet. An outer lateral edge of the carrying sheet is symmetrical to a first central axis, and a distance between the outer lateral edge of the carrying sheet and the first central axis is defined as a first outer diameter. The tag antenna includes an annular segment and two extending segments respectively extending from two end portions of the annular segment. An outer lateral edge of the annular segment is symmetrical to a second central axis, and a distance between the outer lateral edge of the annular segment and the second central axis is defined as a second outer diameter that is smaller than the first outer diameter. The second central axis and the first central axis have an offset distance there-between that is larger than zero.

Abstract: An antenna structure of an RFID reader includes a carrying plate defining four quadrants and an antenna module disposed on the carrying plate. The antenna module includes a feeding antenna and a grounding antenna. The feeding antenna includes a feeding connecting segment, two feeding transmitting segments connected to the feeding connecting segment, and two feeding radiating segments respectively connected to the two feeding transmitting segments. The grounding antenna includes a grounding connecting segment, two grounding transmitting segments connected to the grounding connecting segment, and two grounding radiating segments respectively connected to the two grounding transmitting segments.

Abstract: The present invention relates to a method for inhibiting growth of intermetallic compounds, comprising the steps of: (i) preparing a substrate element including a substrate on which at least one layer of metal pad is deposited, wherein at least one thin layer of solder is deposited onto the layer of metal pad, and then carry out reflowing process; and (ii) further depositing a bump of solder with an appropriate thickness on the substrate element, characterized in that a thin intermetallic compound is formed by the reaction of the thin solder layer and the metal in the metal pad after appropriate heat treatment of the thin solder layer. In the present invention, the formation of a thin intermetallic compound is able to slow the growth of the intermetallic compound and to prevent the transformation of the intermetallic compounds.

Abstract: A circuit board with twinned Cu circuit layer and a method for manufacturing the same are disclosed, wherein the method comprises the following steps: (A) providing a substrate with a first circuit layer formed thereon, wherein the first circuit layer comprises a conductive pad; (B) forming a first dielectric layer on the surface of the substrate; (C) forming plural openings in the first dielectric layer, wherein each opening penetrates through the first dielectric layer and communicates with the conductive pad to expose the conductive pad; (D) forming a Cu seeding layer in the openings; (E) forming a nano-twinned Cu layer in the openings with an electroplating process; and (F) annealing the substrate to transfer the material of the Cu seeding layer into nano-twinned Cu, wherein the nano-twinned Cu layer and the transferred Cu seeding layer are formed into a second circuit layer.

Abstract: The present invention relates to a method for inhibiting growth of intermetallic compounds, comprising the steps of: (i) preparing a substrate element including a substrate on which at least one layer of metal pad is deposited, wherein at least one thin layer of solder is deposited onto the layer of metal pad, and then carry out reflowing process; and (ii) further depositing a bump of solder with an appropriate thickness on the substrate element, characterized in that a thin intermetallic compound is formed by the reaction of the thin solder layer and the metal in the metal pad after appropriate heat treatment of the thin solder layer. In the present invention, the formation of a thin intermetallic compound is able to slow the growth of the intermetallic compound and to prevent the transformation of the intermetallic compounds.

Abstract: An electronic device includes a casing defining a sound receiving chamber therein, and a microphone accommodated in the sound receiving chamber. The sound receiving chamber has an arcuate surface being part of an outer elliptical surface. The microphone is located at a focus of the elliptical surface, with a sound receiving surface of the microphone facing the sound receiving chamber. The other focus of the elliptical surface is disposed at a position out of the sound receiving chamber.

Abstract: An LED lamp (100) includes a cover (10) having two concave reflective surfaces (121, 123), a base (21) disposing over the cover, a lens (40) locating in a middle of the base, and two LEDs (30) mounted on a bottom surface of the base. The lens and the LEDs face the reflective surfaces of the cover. The reflective surfaces each are a part of an ellipsoid. The reflective surfaces share a common focus O within an area of the lens. The LEDs are respectively located at other two focuses M1, M2 of the reflective surfaces. Light rays generated by the at least two LEDs are directed to the reflective surfaces, then reflected towards the lens of the base, and finally reach an outside of the LED lamp through the lens.

Abstract: A height-adjustable apparatus, including a chassis, an actuation unit, an adjustment unit, and an elastic unit, is disclosed. The chassis has a positioning unit and an opening. The actuation unit, movably disposed on the chassis, had a first hole and a first engagement part. The first hole accommodates the positioning unit. The adjustment unit passes through the opening and is movably disposed on the chassis. The adjustment unit has a plurality of second engagement parts. The elastic unit is disposed in the first hole and between the positioning unit and the actuation unit. When the actuation unit is actuated, the first engagement part disengages with the second engagement part to allow movement of adjustment unit. When the actuation unit is non-actuated, the elastic unit forces the first engagement part to engage with a selected second engagement part to lock the adjustment unit.

Abstract: A notebook computer includes a display module, a processing unit, an image input/output module and a detecting unit. The processing unit is electrically connected to the display module. The image input/output module is electrically connected to the processing unit and includes an image switch and at least one image connector. The detecting unit is electrically connected to the display module and the image input/output module. The detecting unit is capable of detecting whether a signal transmitted via the image input/output module is an input or output signal, and notifies the display module and the image input/output module accordingly to switch to the input/output image.

Abstract: The present invention relates to a water filter including an outer connector, an inner connector, a flow control sheet and a strainer. A flange extends from the periphery of the upper surface of the outer connector with at least two protrusions extending therefrom. A plurality of guiding ribs is formed at the inner surface of the sidewall of the outer connector near the bottom surface of the outer connector and radiating from the center of the outer connector. A board is formed at the inner surface of the sidewall of the outer connector connecting with upper ends of the guiding ribs. A plurality of puncturing posts projects from the upper surface of the board. A rim extends from the periphery of the upper surface of the inner connector with at least two positioning cutouts being defined therein. The inner connector is received in the outer connector with the positioning cutouts respectively engagingly receiving the protrusions of the outer connector.

Abstract: A height-adjustable apparatus, including a chassis, an actuation unit, an adjustment unit, and an elastic unit, is disclosed. The chassis has a positioning unit and an opening. The actuation unit, movably disposed on the chassis, had a first hole and a first engagement part. The first hole accommodates the positioning unit. The adjustment unit passes through the opening and is movably disposed on the chassis. The adjustment unit has a plurality of second engagement parts. The elastic unit is disposed in the first hole and between the positioning unit and the actuation unit. When the actuation unit is actuated, the first engagement part disengages with the second engagement part to allow movement of adjustment unit. When the actuation unit is non-actuated, the elastic unit forces the first engagement part to engage with a selected second engagement part to lock the adjustment unit.