Abstract: Various embodiments of the present disclosure are directed towards a method for forming an integrated chip. An alignment process is performed on a first semiconductor workpiece and a second semiconductor workpiece by virtue of a plurality of workpiece pins. The first semiconductor workpiece is bonded to the second semiconductor workpiece. A shift value is determined between the first and second semiconductor workpieces by virtue of a first plurality of alignment marks on the first semiconductor workpiece and a second plurality of alignment marks on the second semiconductor workpiece. A layer of an integrated circuit (IC) structure is formed over the second semiconductor workpiece based at least in part on the shift value.

Abstract: The present disclosure relates to the fields of a method a kit for molecular diagnostics and genomics. More particularly, this disclosure relates to a method and a kit fir detecting a DNA fragment joining event or distinguishing an alternative splicing event. The present disclosure also relates to a method for administering a subject with proper treatment by steps of determining the risk of a particular cancer type or genotype.

Abstract: A method for manufacturing an elastic fiber and the elastic fiber are provided. The method includes: providing a thermoplastic polyester elastomer; drying the thermoplastic polyester elastomer; melting the thermoplastic polyester elastomer by an extruder to form a melt; extruding the melt by a spinneret plate to form a plurality of filamentous streams; feeding the filamentous streams into a spinning channel for cooling and curing to form a plurality of monofilaments; and bundling and oiling the monofilaments by an oil wheel, after extending and guiding the monofilaments by a first godet roller and a second godet roller, and winding the monofilaments by a winder to obtain a thermoplastic polyester elastic fiber.

Abstract: The application provides an enzyme immobilization carrier and a preparation method thereof, an immobilized enzyme and a preparation method thereof. The above enzyme immobilization carrier is obtained by an amino modification or a cyanuric chloride modification of super-crosslinked polyvinyl alcohol. The use of the enzyme immobilization carrier provided by the application may effectively improve the stability and reusability of the immobilized enzyme. Moreover, due to the use of the form of enzyme covalent linkage, compared with an embedding method, the preparation method is no need for chemical reagent immersion and the like, it is beneficial to maintain the own activity of the enzyme, and promote the immobilized enzyme to have the better activity while the stability and reusability are kept.

Abstract: A tire-size identification method includes the following steps. An object-detection model frames a tire image in an image to generate a framed tire image. The framed tire image is input into an image-segmentation model. The image-segmentation model outputs the tire inner diameter of the tire. Moreover, the tire inner diameter is input into a classification model. The classification model outputs the tire size.

Abstract: A semiconductor device includes a conductive pad over an interconnect structure, wherein the conductive pad is electrically connected to an active device. The semiconductor device further includes a dielectric layer over the conductive pad, wherein the dielectric layer has a first conformity. The semiconductor device further includes a passivation layer over the dielectric layer, wherein the passivation layer has a second conformity different from the first conformity.

Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a molded semiconductor device, a first redistribution structure, and conductive vias. The molded semiconductor device comprises a sensor die with a first surface and a second surface opposite the first surface, wherein the sensor die has an input/output region and a sensing region at the first surface. The first redistribution structure is disposed on the first surface of the sensor die, wherein the first redistribution structure covers the input/output region and exposes the sensing region, and the first redistribution structure comprises a conductive layer having a redistribution pattern and a ring structure. The redistribution pattern is electrically connected with the sensor die. The ring structure surrounds the sensing region and is separated from the redistribution pattern, wherein the ring structure is closer to the sensing region than the redistribution pattern.

Abstract: In some embodiments, a method is provided. The method includes identifying an incident situation based upon a sensor detecting an abnormal condition. One or more life safety systems are queried to obtain life safety system data. One or more databases, comprising equipment information, chemical information, personnel information, and/or emergency response contingency procedures, are queried to obtain on-site information. The life safety system data and the on-site information are integrated together to generate incident situation information. The incident situation information is displayed through an electronic display.

Abstract: A method includes patterning a trench and depositing a first insulating material along sidewalls and a bottom surface of the trench using a conformal deposition process. Depositing the first insulating material includes forming a first seam between a first portion of the first insulating material on a first sidewall of the trench and a second portion of the first insulating material on a second sidewall of the trench. The method further includes etching the first insulating material below a top of the trench and depositing a second insulating material over the first insulating material and in the trench using a conformal deposition process. Depositing the second insulating material comprises forming a second seam between a first portion of the second insulating material on the first sidewall of the trench and a second portion of the second insulating material on a second sidewall of the trench.

Abstract: A method of inspecting flatness of substrate is provided and includes providing a substrate. N first inspecting points are selected from the surface of the substrate along a first straight line, where the coordinate of the i-th first inspecting point is (Xi,Yi,Zi). By using a formula “D=?i=1N?1?{square root over ((Xi+1?Xi)2+(Yi+1?Yi)2+(Zi+1?Zi)2)}”, a first measurement length D is calculated. By using a formula “F=(D?S)/S”, a first flatness index F is calculated. S is the horizontal distance between 1st first inspecting point and N-th first inspecting point. When the first flatness index F is larger than a first threshold, the substrate is determined to be unqualified.

Abstract: The present disclosure describes a semiconductor structure and a method for forming the same. The semiconductor structure can include a substrate, a gate structure over the substrate, a layer of dielectric material over the gate structure, a source/drain (S/D) contact layer formed through and adjacent to the gate structure, and a trench conductor layer over and in contact with the S/D contact layer. The S/D contact layer can include a layer of platinum-group metallic material and a silicide layer formed between the substrate and the layer of platinum-group metallic material. A top width of a top portion of the layer of platinum-group metallic material can be greater than or substantially equal to a bottom width of a bottom portion of the layer of platinum-group metallic material.

Abstract: The present invention discloses a targeted therapy composition and a method for suppressing breast cancer cell proliferation, migration or invasion by administrating the targeted therapy composition to a subject in need thereof. The composition comprises a type 3 epithelial membrane proteins (EMP3) targeted inhibitor. The breast cancer cells are characterized by upregulation of EMP3, EGFR, HER2, HER3, HR, or downregulation of HER4 gene expression. EMP3-targeting oligonucleotide or nuclease is administrated upon the breast cancer cells so as to degrade EMP3-coding DNA or mRNA, and to suppress breast cancer cell proliferation, migration or invasion.

Abstract: Methods and systems for classifying a article of manufacture are disclosed. A classifier is trained with training data including 1) a feature vector related to the article based on measurements related to the article captured at a particular station of a manufacturing process and 2) encoded time series data representing a history of measurements of articles of the same type as the article of manufacture captured at a sequence of stations of the manufacturing process prior to the particular station.

Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: A touchpad assembly comprises a cover plate, a touch printed circuit board, a force-supporting component, a plurality of vibration isolators, and a plurality of strain gauges. The touch printed circuit board comprises a first region, a second region that surrounds the first region, a first surface, and a second surface, wherein the first surface and the second surface face toward and away from the cover plate respectively. The force-supporting component is disposed between the cover plate and the first surface. The vibration isolators are disposed on the second surface and located in the second region. The Young's modulus of the vibration isolators is in a range of 150 kPa to 800 kPa. The strain gauges are disposed on the touch printed circuit board. Each of the strain gauges extends from the second region to the first region.

Abstract: Disclosed herein are second near-infrared (NIR-II) fluorescent composite and its production method. The method mainly includes the steps of, mixing a gold nanocluster having a plurality of a thiol-based compound on its outer surface and alpha-glycerylphosphorylcholine (alpha-GPC) in a solvent to form a mixture; replacing the solvent with an inert gas; and heating the mixture at a temperature about 100-200° C. in the presence of the inert gas until at least a portion of the gold nanocluster is encapsulated by a capping layer consisting of alpha-GPC, thereby producing the NIR-II fluorescent composite. The thus-produced NIR-II fluorescent composite is characterized by having an emission wavelength covering NIR-II region detectable by specialized camera. Also encompassed in the present disclosure is a method for conducting in vivo bioimaging of a target area in a subject.

Abstract: A probe head includes a probe seat, and vertical probes each having a head portion including a head portion installation section with a first width, and a probe tip section including a probe tip contact part with a second width smaller than the first width and a probe tip gradually narrowing part which is located between the head portion installation section and the probe tip contact part, gradually narrows from the first width to the second width, and has a first length smaller than a second length of the probe tip contact part. The head portion installation section protrudes out of a lower surface of the probe seat for a length smaller than the sum of the first and second lengths. The vertical probe is great in current withstanding capability, structural strength and life time, and meets the requirement of probing tiny electrically conductive contacts.

Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.

Abstract: The present disclosure provides a chemical supply system, including a chamber, a tubing extending into the chamber, an interlock apparatus, including a fixture for fastening the tubing, and means for determining whether the tubing is fastened by the fixture.

Abstract: A package structure including a semiconductor die, a redistribution layer structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution layer structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution layer structure includes a backside dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the backside dielectric layer and the inter-dielectric layers. The electronic device is disposed over the backside dielectric layer and electrically connected to an outermost redistribution conductive layer among the redistribution conductive layers, wherein the outermost redistribution conductive layer is embedded in the backside dielectric layer, and the backside dielectric layer comprises a ring-shaped recess covered by the outermost redistribution conductive layer.