Abstract: Disclosed herein, among other things, is a system for electrical stimulation of blood vessels. An embodiment of the system includes at least one electrode having electrical contact with a blood vessel. The embodiment also includes a stimulation circuit electrically connected to the electrode, the circuit adapted to provide stimulation to the vessel. The embodiment further includes a controller connected to the circuit, the controller adapted to select frequency and voltage parameters for the stimulation circuit to selectively affect vascular therapy, including constriction of the vessel and dilation of the vessel. According to various embodiments, the stimulation circuit and controller are contained within an implantable medical device (IMD). The system also includes a sensor connected to the controller, and the controller initiates and adjusts therapy based on a signal received from the sensor, in varying embodiments.

Abstract: Compositions and methods for treating autoimmune diseases are described. In particular, the use of B cell depleting agents and cytotoxic drug/B cell depleting agent conjugates with a drug loading significantly higher than in previously reported procedures and with decreased aggregation and low conjugate fraction (LCF) in treating autoimmune diseases is described. Combination therapies and compositions for treating autoimmune diseases, including the B cell depleting agents, conjugates and/or anti-cytokine agents, are also described.

Abstract: A chemical-mechanical polishing composition that includes less than about 1% wt. abrasive, an additive, and water, where a weigh percent of the additive is greater than a weight percent of the abrasive. Also, a method of polishing a semiconductor substrate in a shallow trench isolation process, the method including contacting the substrate with a polishing pad of a polishing apparatus while applying a high selectivity slurry to the polishing pad, where the slurry comprises less than about 1% wt. abrasive, an additive, and water, and where a weigh percent of the additive is greater than a weight percent of the abrasive. Also, a method of making a chemical-mechanical polishing slurry composition, the method including adding together an abrasive, an additive and water to form the slurry, where a weigh percent of the additive is greater than a weight percent of the abrasive, and the abrasive and additive together comprise less than 2% by wt. of the slurry.

Abstract: A smart polishing media assembly is provided, along with a polishing system and a method for using the same. In one embodiment, the smart polishing media assembly includes a memory device coupled to a polishing material. The polishing material may be in pad, web or belt form. The memory device generally stores at least one material information, historical use information, and/or conditioning information of the polishing material.

Abstract: A method is described. The method includes contacting a non-solid material to a non-linear edge of a sheet of polishing material, and causing the non-solid material to solidify to form a window that contacts the non-linear edge of the polishing material.

Abstract: A polishing system is described. The polishing system includes a polishing layer, and a subpad supporting the polishing layer, where the subpad has a spiral groove formed therein.

Abstract: A polishing apparatus is described. The polishing apparatus includes a rotatable platen, a drive mechanism to incrementally advance a polishing sheet having a polishing surface in a linear direction across the platen, a subpad on the platen to support the polishing sheet, the subpad having a groove formed therein, and a vacuum source connected to the groove of the subpad and configured to apply a vacuum sufficient to pull portions of the polishing sheet into the groove of the subpad to induce a groove in the polishing surface.

Abstract: A method is described. The method includes supporting a polishing sheet having a polishing surface on a subpad having a recess formed therein, applying a vacuum to the recess sufficient to pull portions of the polishing sheet into the recess to induce a recess in the polishing surface, positioning a substrate in a carrier head over the recess in the polishing surface, and lifting the substrate away from the polishing surface while the substrate is positioned over the recess.

Abstract: A polishing article is described. The polishing article includes a linear polishing sheet having a linear transparent portion, wherein the linear transparent portion is formed from a material that has the flexibility to pass around a radius of about 2.5 inches without cracking.

Abstract: A polishing article is described. The polishing article includes an elongated polishing layer, and a transparent carrier layer supporting the polishing layer, where the transparent carrier layer has a projection extending into an aperture in the polishing layer to provide a transparent window in the polishing layer.

Abstract: Various aspects relate to a device. Various device embodiments include at least a first and a second transducer, and a controller. The first transducer is adapted to be positioned to direct a first energy wave toward a neural target, and the second transducer is adapted to be positioned to direct a second energy wave toward the neural target. The controller is connected to the transducers to generate the first energy wave with a first predetermined phase and a first predetermined amplitude from the first transducer and to generate the second energy wave with a second predetermined phase and a second predetermined amplitude from the second transducer. The amplitudes are selected so that a neural stimulation threshold is reached only during constructive wave interference. The phases are selected so that the first and second energy waves constructively interfere at the neural target. Other aspects and embodiments are provided herein.

Abstract: A method of optimizing multi-enterprise supply chain agreements using an electronic scenario based option contract includes creating at a buyer computer a plurality of scenarios of forecasted demand for one or more products and communicating from the buyer computer to a seller computer an offer to enter into an option contract for the supply of the one or more products, the option contract including an option corresponding to each of the plurality of scenarios of forecasted demand. The method further includes executing the option contract, receiving at the buyer computer an indication of current buyer demand for at least one scenario associated with the one or more products, and exercising at least a portion of the option in the option contract based at least in part on the indicated buyer demand.

Abstract: A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.

Abstract: A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.

Abstract: A chemical-mechanical polishing composition that includes less than about 1% wt. abrasive, an additive, and water, where a weigh percent of the additive is greater than a weight percent of the abrasive. Also, a method of polishing a semiconductor substrate in a shallow trench isolation process, the method including contacting the substrate with a polishing pad of a polishing apparatus while applying a high selectivity slurry to the polishing pad, where the slurry comprises less than about 1% wt. abrasive, an additive, and water, and where a weigh percent of the additive is greater than a weight percent of the abrasive. Also, a method of making a chemical-mechanical polishing slurry composition, the method including adding together an abrasive, an additive and water to form the slurry, where a weigh percent of the additive is greater than a weight percent of the abrasive, and the abrasive and additive together comprise less than 2% by wt. of the slurry.