Abstract: Featured is a device for NMR or MRI signals from excited nuclei as well as related apparatus, systems and methods. The device includes a strip array antenna including one or more conductor and N reactive tuning components, where N is an integer ?1 at least one of the N reactive components is electrically coupled to each of the one or more conductors as well as to ground/virtual ground. The apparent electrical length of the conductors is tuned with the reactive tuning components so it is equal to be about n?/4, where n is an integer ?1 and ? is the wavelength of the signal to be detected. The length of the strip also is such as to be substantially in the approximate range of 1.3 times the depth of interest. The strip conductors are also combined with loop coils to form quadrature detectors.

Abstract: Herein is disclosed a magnetic resonance imaging antenna, including an inner conductor, an outer shield slideably displaceable with respect to the inner conductor, and an insulator electrically insulating the inner conductor from the outer shield. Herein is disclosed a biopsy needle antenna, including a magnetic resonance imaging antenna, having an outer shield, and an inner conductor electrically insulated from the outer shield by a dielectric; and a biopsy needle electrically connected to the inner conductor and electrically insulated from the outer shield by the dielectric. Herein is disclosed a method of obtaining a sample with magnetic resonance imaging guidance, including providing a sampling needle magnetic resonance imaging antenna, advancing the antenna to a structure from which the sample is to be taken, detecting magnetic resonance data by the antenna, and coupling the sample to the antenna.

Abstract: Featured is a device for NMR or MRI signals from excited nuclei as well as related apparatus, systems and methods. The device includes a strip array antenna including one or more conductor and N reactive tuning components, where N is an integer ?1 at least one of the N reactive components is electrically coupled to each of the one or more conductors as well as to ground/virtual ground. The apparent electrical length of the conductors is tuned with the reactive tuning components so it is equal to be about n?/4, where n is an integer ?1 and ? is the wavelength of the signal to be detected. The length of the strip also is such as to be substantially in the approximate range of 1.3 times the depth of interest. The strip conductors are also combined with loop coils to form quadrature detectors.

Abstract: Methods of applying specialty ceramic materials to semiconductor processing apparatus, where the specialty ceramic materials are resistant to halogen-comprising plasmas. The specialty ceramic materials contain at least one yttrium oxide-comprising solid solution. Some embodiments of the specialty ceramic materials have been modified to provide a resistivity which reduces the possibility of arcing within a semiconductor processing chamber.

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate.

Abstract: Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.

Abstract: Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.

Abstract: Electrochemical fabrication processes and apparatus for producing single layer or multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers includes operations for reducing stress and/or curvature distortion when the structure is released from a sacrificial material which surrounded it during formation and possibly when released from a substrate on which it was formed. Six primary groups of embodiments are presented which are divide into eleven primary embodiments. Some embodiments attempt to remove stress to minimize distortion while others attempt to balance stress to minimize distortion.

Abstract: Herein is disclosed a magnetic resonance imaging antenna, including an inner conductor, an outer shield slideably displaceable with respect to the inner conductor, and an insulator electrically insulating the inner conductor from the outer shield. Herein is disclosed a biopsy needle antenna, including a magnetic resonance imaging antenna, having an outer shield, and an inner conductor electrically insulated from the outer shield by a dielectric; and a biopsy needle electrically connected to the inner conductor and electrically insulated from the outer shield by the dielectric. Herein is disclosed a method of obtaining a sample with magnetic resonance imaging guidance, including providing a sampling needle magnetic resonance imaging antenna, advancing the antenna to a structure from which the sample is to be taken, detecting magnetic resonance data by the antenna, and coupling the sample to the antenna.

Abstract: Herein is disclosed a magnetic resonance imaging antenna, including an inner conductor, an outer shield slideably displaceable with respect to the inner conductor, and an insulator electrically insulating the inner conductor from the outer shield. Herein is disclosed a biopsy needle antenna, including a magnetic resonance imaging antenna, having an outer shield, and an inner conductor electrically insulated from the outer shield by a dielectric; and a biopsy needle electrically connected to the inner conductor and electrically insulated from the outer shield by the dielectric. Herein is disclosed a method of obtaining a sample with magnetic resonance imaging guidance, including providing a sampling needle magnetic resonance imaging antenna, advancing the antenna to a structure from which the sample is to be taken, detecting magnetic resonance data by the antenna, and coupling the sample to the antenna.

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate.

Abstract: Electrochemical fabrication processes and apparatus for producing multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers including operations for providing coatings of dielectric material that isolate at least-portions of a first conductive material from (1) other portions of the first conductive material, (2) a second conductive material, or (3) another dielectric material, and wherein the thickness of the dielectric coatings are thin compared to the thicknesses of the layers used in forming the structures. In some preferred embodiments, portions of each individual layer are encapsulated by dielectric material while in other embodiments only boundaries between distinct regions of materials are isolated from one another by dielectric barriers.

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate.

Abstract: Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate.

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate.

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate.

Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate.

Abstract: Some embodiments of the invention are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that partially coats the surface of the probe. Other embodiments are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that completely coats the surface of each layer from which the probe is formed including interlayer regions. These first two groups of embodiments incorporate both the core material and the coating material during the formation of each layer. Still other embodiments are directed to the electrochemical fabrication of microprobe arrays that are partially encapsulated by a dielectric material during a post layer formation coating process. In even further embodiments, the electrochemical fabrication of microprobes from two or more materials may occur by incorporating a coating material around each layer of the structure without locating the coating material in inter-layer regions.

Abstract: Electrochemical fabrication methods for forming single and multilayer mesoscale and microscale structures are disclosed which include the use of diamond machining (e.g. fly cutting or turning) to planarize layers. Some embodiments focus on systems of sacrificial and structural materials which are useful in Electrochemical fabrication and which can be diamond machined with minimal tool wear (e.g. Ni—P and Cu, Au and Cu, Cu and Sn, Au and Cu, Au and Sn, and Au and Sn—Pb), where the first material or materials are the structural materials and the second is the sacrificial material). Some embodiments focus on methods for reducing tool wear when using diamond machining to planarize structures being electrochemically fabricated using difficult-to-machine materials (e.g. by depositing difficult to machine material selectively and potentially with little excess plating thickness, and/or pre-machining depositions to within a small increment of desired surface level (e.g.