Abstract: Embodiments relate to a system, an apparatus, and a method that involve a plurality of stackable enclosure units that include inter-unit or inter-module passages for facilitating cooling of interior compartments of the units, especially server units.

Abstract: Embodiments relate to a system with a primary body in communication with at least one heat source. A chamber housed within the primary body includes a boundary to separate the heat source from fluid contact and a secondary body housed in the chamber. The secondary body includes a conduit and a cover in communication with the conduit wherein the cover has a fluid flow inlet extending into the conduit and the conduit includes a series of convection ports to exhaust fluid into the chamber. Upon surging through the convection ports, the fluid comes in contact with the plenum of the primary body and dissipates the heat generated from the heat source and transferred to the primary body. An outlet, separate from the inlet, removes the fluid from the chamber.

Abstract: Embodiments relate to a system with a primary body in communication with at least one heat source. A chamber housed within the primary body includes a boundary to separate the heat source from fluid contact and a secondary body housed in the chamber. The secondary body includes a conduit and a cover in communication with the conduit wherein the cover has a fluid flow inlet extending into the conduit and the conduit includes a series of convection ports to exhaust fluid into the chamber. Upon surging through the convection ports, the fluid comes in contact with the plenum of the primary body and dissipates the heat generated from the heat source and transferred to the primary body. An outlet, separate from the inlet, removes the fluid from the chamber.

Abstract: An electronic component includes a component enclosure. At least one subcomponent is positioned within the component enclosure. The at least one subcomponent is configured to be thermally coupled to the component enclosure.

Abstract: An electronic component includes a component enclosure. At least one subcomponent is positioned within the component enclosure. The at least one subcomponent is configured to be thermally coupled to the component enclosure.

Abstract: A circuit board cooling system employs a closed liquid delivery system to transfer heat from integrated circuits to a cooling liquid. The system includes one or more cooling panels that may be attached to a circuit board. Each cooing panel includes at least one channel for the circulation of cooling liquid stamped into a thermally conductive material. Each panel may include multiple levels in order to conform to the profile of integrated circuits to be cooled.

Abstract: A circuit board cooling system employs a closed liquid delivery system to transfer heat from integrated circuits to a cooling liquid. The system includes one or more cooling panels that may be attached to a circuit board. Each cooing panel includes at least one channel for the circulation of cooling liquid stamped into a thermally conductive material. Each panel may include multiple levels in order to conform to the profile of integrated circuits to be cooled.

Abstract: A load counterbalancing system with a constant load displacement force includes a load element, a position transducer and an actuator element. An environmental force acting upon the load element is counterbalanced by a support force provided by the actuator element. The environmental force is assumed to be a predetermined function of the position of the load element, and the actuator element applies the support force to the load element as defined by the predetermined function. The invention allows an operator to move the load element through its entire range of motion with a constant applied force, and to place the load element statically at any position in the range of motion.