Patents by Inventor Anderson Singulani
Anderson Singulani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230088107Abstract: An optical element for introducing a predetermined phase delay into incident electromagnetic radiation. The optical element comprises a first layer and a second layer arranged in a propagation path of a portion of the electromagnetic radiation. The first layer comprises a transmission regions configured to introduce a first phase delay into the portion of electromagnetic radiation propagating therethrough. The second layer comprises a metasurface configured to introduce a second phase delay into the portion of electromagnetic radiation propagating therethrough. The metasurface comprises subwavelength sized structures .Type: ApplicationFiled: December 16, 2020Publication date: March 23, 2023Applicant: ams AGInventors: Anderson SINGULANI, Mai LIJIAN, Jozef PULKO, Gernot FASCHING, Jean-Francois Pierre SEURIN, Chuni GHOSH
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Publication number: 20230043101Abstract: Various embodiments may relate to an optical system. The optical system may include a lens structure configured to generate an outgoing Gaussian beam based on an incoming Gaussian beam. The optical system may also include a light source configured to provide the incoming Gaussian beam to the lens structure. The lens structure may be a flat lens or a phase plate.Type: ApplicationFiled: January 14, 2021Publication date: February 9, 2023Inventors: Zhengtong Liu, Jinghua Teng, Hong Son Chu, Qian Wang, Jie Deng, Soo Seng Norman Ang, Xiao Song Eric Tang, Ching Eng Jason Png, Gernot Fasching, Lijian Mai, Anderson Singulani, Jozef Pulko
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Patent number: 11536640Abstract: A particulate matter sensor system for sensing particulate matter in a fluid includes a substrate and a cover disposed on the substrate. The cover defines at least a portion of a flow path through the microfluidic system. The sensor system includes a particulate matter sensor disposed in an interior space between the cover and the substrate. The particulate matter sensor includes an integrated sensor device electrically connected to the substrate. The flow path is defined through the particulate matter sensor. The sensor system includes a fluid circulation device disposed in the interior space between the cover and the substrate and configured to cause fluid to flow along the flow path through the microfluidic system.Type: GrantFiled: December 13, 2018Date of Patent: December 27, 2022Assignees: ams International AG, Technische Universität GrazInventors: Harald Etschmaier, Georg Roehrer, Anderson Singulani, Alexander Bergmann
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Publication number: 20220244168Abstract: An apparatus includes an integrated waveguide structure, and a first light source operable to produce a probe beam having a first wavelength, wherein the probe beam is coupled into a first end of the waveguide structure. A second light source is operable to produce an excitation beam with having a second wavelength to excite gas molecules in close proximity to a path of the probe beam. A light detector is coupled to a second end of the integrated waveguide structure and is operable to detect the probe beam after it passes through the waveguide structure. The apparatus is operable such that excitation of the gas molecules results in a temperature increase of the gas molecules that induces a change in the probe beam that is measurable by the light detector.Type: ApplicationFiled: July 9, 2020Publication date: August 4, 2022Inventors: Jochen Kraft, Rainer Minixhofer, Victor Sidorov, Anderson Singulani, Martin Sagmeister, Fernando Castano
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Publication number: 20220131345Abstract: A device comprising: an illumination device for emitting an illumination beam, the illumination device comprising: an emitter array comprising multiple light emitters; and a meta-structure or micro-prism array comprising multiple transmission areas, the meta-structure of micro-prisms being positioned to receive light emitted from the emitter array, in which light from the meta-structure of micro-prism forms the illumination beam, in which a first one of said multiple transmission areas is arranged to emit light in a different direction than a second one of said multiple transmission areas.Type: ApplicationFiled: September 23, 2019Publication date: April 28, 2022Inventors: Jean-Francois Seurin, Baiming Guo, Markus Rossi, Anderson Singulani
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Patent number: 11127656Abstract: A semiconductor device comprises a semiconductor body and an electrically conductive via which extends through at least a part of the semiconductor body, where the via has a lateral size which is given in a first lateral direction that is perpendicular to a vertical direction given by the main axis of extension of the via and where the via has a top side and a bottom side that faces away from the top side. The semiconductor device further comprises an electrically conductive etch-stop layer arranged at the bottom side of the via in a plane which is parallel to the first lateral direction, and at least one electrically conductive contact layer at the bottom side of the via in a plane which is parallel to the first lateral direction. The lateral extent in the first lateral direction of the etch-stop layer is larger than the lateral size of the via and the lateral extent in the first lateral direction of the contact layer is smaller than the lateral size of the via.Type: GrantFiled: February 14, 2018Date of Patent: September 21, 2021Assignee: AMS AGInventors: Jochen Kraft, Georg Parteder, Anderson Singulani, Raffaele Coppeta, Franz Schrank
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Publication number: 20210172852Abstract: An apparatus for sensing particulate matter in a fluid includes a first substrate; and a sensing device electrically integrated with the first substrate, the sensing device having a receiving surface. The apparatus includes a second substrate separated from the first substrate by a gap. The apparatus includes a heating element disposed in the gap between the first substrate and the second substrate and connected to the second substrate by a post. The heating element is aligned with the receiving surface of the sensing device, and a microfluidic channel is defined between the first substrate and the heating element.Type: ApplicationFiled: December 13, 2018Publication date: June 10, 2021Inventors: Anderson Singulani, Georg Roehrer
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Publication number: 20200400544Abstract: An apparatus for sensing particulate matter in a fluid includes a substrate; and an integrated circuit electrically connected to the substrate, the integrated circuit including a photodetector. The apparatus includes a filter assembly including a particle filter aligned with the photodetector, and a filter housing for the particle filter, the filter housing defining a flow path for fluid through the particle filter. The apparatus includes a light source electrically connected to the substrate and positioned to illuminate the particle filter.Type: ApplicationFiled: December 13, 2018Publication date: December 24, 2020Inventors: Harald Etschmaier, Georg Roehrer, Anderson Singulani, Hubert Enichlmair, Jong-Mun Park, Alexander Bergmann, Paul Maierhofer
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Publication number: 20200393351Abstract: A particulate matter sensor system for sensing particulate matter in a fluid includes a substrate and a cover disposed on the substrate. The cover defines at least a portion of a flow path through the microfluidic system. The sensor system includes a particulate matter sensor disposed in an interior space between the cover and the substrate. The particulate matter sensor includes an integrated sensor device electrically connected to the substrate. The flow path is defined through the particulate matter sensor. The sensor system includes a fluid circulation device disposed in the interior space between the cover and the substrate and configured to cause fluid to flow along the flow path through the microfluidic system.Type: ApplicationFiled: December 13, 2018Publication date: December 17, 2020Inventors: Harald Etschmaier, Georg Roehrer, Anderson Singulani, Alexander Bergmann
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Patent number: 10723615Abstract: A sensor assembly for being mounted on a circuit board comprises an interposer with at least one opening extending between a first and a second main surface of the interposer. The interposer comprises at least two stress decoupling elements, each comprising a flexible structure formed by a respective portion of the interposer being partially enclosed by one of the at least one opening. A sensor die is connected to the flexible structures on the first main surface. At least two board connection elements are arranged on the first main surface and adapted for connecting the assembly to the circuit board.Type: GrantFiled: May 5, 2017Date of Patent: July 28, 2020Assignee: Sciosense B.V.Inventors: Harald Etschmaier, Anderson Singulani
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Publication number: 20200020611Abstract: A semiconductor device comprises a semiconductor body and an electrically conductive via which extends through at least a part of the semiconductor body, where the via has a lateral size which is given in a first lateral direction that is perpendicular to a vertical direction given by the main axis of extension of the via and where the via has a top side and a bottom side that faces away from the top side. The semiconductor device further comprises an electrically conductive etch-stop layer arranged at the bottom side of the via in a plane which is parallel to the first lateral direction, and at least one electrically conductive contact layer at the bottom side of the via in a plane which is parallel to the first lateral direction. The lateral extent in the first lateral direction of the etch-stop layer is larger than the lateral size of the via and the lateral extent in the first lateral direction of the contact layer is smaller than the lateral size of the via.Type: ApplicationFiled: February 14, 2018Publication date: January 16, 2020Inventors: Jochen Kraft, Georg Parteder, Anderson Singulani, Raffaele Coppeta, FRANZ SCHRANK
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Publication number: 20190161340Abstract: A sensor assembly for being mounted on a circuit board comprises an interposer with at least one opening extending between a first and a second main surface of the interposer. The interposer comprises at least two stress decoupling elements, each comprising a flexible structure formed by a respective portion of the interposer being partially enclosed by one of the at least one opening. A sensor die is connected to the flexible structures on the first main surface. At least two board connection elements are arranged on the first main surface and adapted for connecting the assembly to the circuit board.Type: ApplicationFiled: May 5, 2017Publication date: May 30, 2019Inventors: Harald Etschmaier, Anderson Singulani