Abstract: Semiconductor module having a first substrate, a second substrate and a spacer distancing the substrates from each other, wherein the spacer is formed by at least one elastic shaped metal body.

Abstract: Semiconductor module including a semiconductor and including a shaped metal body that is electrically contacted by the semiconductor, for forming a contact surface for an electrical conductor, wherein the shaped metal body is bent or folded. A method is also described for establishing electrical contacting of an electrical conductor on a semiconductor, said method including the steps of: fastening a bent or folded shaped metal body of a constant thickness to the semiconductor by means of a first fastening method and then fastening the electrical conductor to the shaped metal body by means of a second fastening method.

Abstract: A method that includes: arranging plastic and further workpieces (1, 3) such that an abutment surface (5) of the plastic workpiece (1) is abutted to a first surface (13) on the further workpiece (3) and a projection (7) on the plastic workpiece (1) extends through a through hole (17) in the further workpiece (3); linearly moving a friction tool (23) parallel to its rotational axis (25) such that a friction surface (31) on the tool (23) contacts a front surface (9) of the projection (7); linearly moving the tool (23) along the rotational axis (25) while rotating the tool (23) so that a pin (29) on the tool (23) penetrates and plasticizes the projection (7) as well as drives a portion of the plasticized projection (7) into an undercut (21) formed in the hole (17) of the further workpiece (3); and retracting the tool (23) from the projection (7).

Abstract: A method that includes: arranging plastic and further workpieces (1, 3) such that an abutment surface (5) of the plastic workpiece (1) is abutted to a first surface (13) on the further workpiece (3) and a projection (7) on the plastic workpiece (1) extends through a through hole (17) in the further workpiece (3); linearly moving a friction tool (23) parallel to its rotational axis (25) such that a friction surface (31) on the tool (23) contacts a front surface (9) of the projection (7); linearly moving the tool (23) along the rotational axis (25) while rotating the tool (23) so that a pin (29) on the tool (23) penetrates and plasticizes the projection (7) as well as drives a portion of the plasticized projection (7) into an undercut (21) formed in the hole (17) of the further workpiece (3); and retracting the tool (23) from the projection (7).

Abstract: A method for connecting a plastic workpiece to a further workpiece. The method includes inserting a pin on the plastic workpiece through a through-opening in the further workpiece and abutting the first and second workpieces against one another. A friction tool, which has a clamping ring and a friction pin, is engaged to the pin and the friction pin is rotated so that frictional heat produced by friction between the friction pin and the pin brings the pin into a plastic state. The rotating friction pin is moved parallel to the axis of rotation toward the working surface so that the pin is plastically deformed.