Patents by Inventor Andre B. Chow

Andre B. Chow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6929951
    Abstract: A method and system for calibrating molecular arrays to a reference molecular array, and for subsequently calibrating the molecular arrays to maintain a constant signal-intensity-to-label-concentration ratio. In the first step of the two-step calibration method, a reference array coated with the fluorophore or chromophore used to label probe molecules is employed, while in the second step of the two-step method, a reference array coated with a stable dye is employed.
    Type: Grant
    Filed: February 28, 2002
    Date of Patent: August 16, 2005
    Assignee: Agilent Technologies, Inc.
    Inventors: John F. Corson, Andreas N. Dorsel, Russell A. Parker, Andre B. Chow
  • Publication number: 20030165871
    Abstract: A method and system for calibrating molecular arrays to a reference molecular array, and for subsequently calibrating the molecular arrays to maintain a constant signal-intensity-to-label-concentration ratio. In the first step of the two-step calibration method, a reference array coated with the fluorophore or chromophore used to label probe molecules is employed, while in the second step of the two-step method, a reference array coated with a stable dye is employed.
    Type: Application
    Filed: February 28, 2002
    Publication date: September 4, 2003
    Inventors: John F. Corson, Andreas N. Dorsel, Russell A. Parker, Andre B. Chow
  • Publication number: 20030113724
    Abstract: A method of bonding a microarray to a package uses optional surface treatments on the microarray and on the package to enhance the adhesion of the microarray to the package using an adhesive. The adhesive bonds to the microarray and the package with sufficient bond strength and flexibility to withstand the stress caused by different expansion rates during exposure to temperature extremes. A method of attaching the microarray to the package uses a plurality of adhesives to provide the bond strength and flexibility. A packaged microarray apparatus comprises a microarray of biological features, a package, and an adhesive bond between the microarray and the package. The apparatus may have surface treatment and/or the adhesive bond may comprise a plurality of adhesives.
    Type: Application
    Filed: October 12, 2001
    Publication date: June 19, 2003
    Inventors: Carol T. Schembri, Andre B. Chow, Laurence R. Shea