Abstract: A flooring as a covering for a subfloor, wherein the flooring includes a layer made from a hardenable material which is hardened when the flooring is in the finished state and in which at least one electric component is embedded, wherein the electric component includes a lower side facing the subfloor when in the mounted position, and an upper side opposite the lower side. It is provided that the at least one electric component includes at least one surface section, in particular the upper side and/or the lower side, an adhesion promoter for the hardenable material and/or at least one recess which extends from its upper side to its lower side.

Abstract: A floor covering as a covering for a subfloor, wherein the floor covering has a layer which is composed of a curable material which is cured in the finished state of the floor covering and into which a reinforcing fabric and at least one electrical component are embedded. The at least one electrical component is connected by way of its bottom side to a subfloor, in particular an unfurnished floor, by adhesive bonding, and the reinforcing fabric covers the at least one electrical component by way of its side which is averted from the subfloor, so that the top side of the at least one electrical component is covered by the reinforcing fabric and the curable material.

Abstract: A floor covering as a covering for a subfloor, wherein the floor covering has a layer which is composed of a curable material which is cured in the finished state of the floor covering and into which a reinforcing fabric and at least one electrical component are embedded. The at least one electrical component is connected by way of its bottom side to a subfloor, in particular an unfurnished floor, by adhesive bonding, and the reinforcing fabric covers the at least one electrical component by way of its side which is averted from the subfloor, so that the top side of the at least one electrical component is covered by the reinforcing fabric and the curable material.

Abstract: A method for producing a floor covering substrate is provided, wherein at least one electronic device is embedded within a layer, which includes at least one curable material; wherein the at least one electronic device is embedded in a substrate layer and/or on a substrate layer; wherein the substrate layer, including the electronic device, is embedded in a layer, which includes at least one curable material; wherein the substrate layer that includes a porous or meshed structure or a reinforcement fabric, which is penetrable for the at least one curable material.