Abstract: A die bond touch down detector (20) includes a strain gauge circuit (22) having a plurality of strain gauges (12) formed into a wheatstone bridge configuration. The strain gauges (12) are mounted on a die bond head (10) and measure and detect deformations of the die bond head (10). The strain gauge circuit (22) generates a differential output signal in response to deformations detected by the strain gauges (12). The differential output signal is amplified, filtered, and converted to digital format for processing by a microcontroller (36). The microcontroller (36) performs calibration, display formatting, and touch down signal generation. The die bond touch down detector (20) provides real time monitorization, automatic calibration, and real force applied information for the die bond head (10).