Abstract: The invention comprises a device and method for surface cleaning of individual wafers or substrates arranged in a stack along a stacking direction, where a jet of fluid is sent towards the stack in a direction perpendicular to the stacking direction and it is provided a relative movement between the wafer stack and the nozzle in the stacking direction.

Abstract: A method for caulking or grouting a corner involving providing a tape with two strips of adhesive tape, the strips being spaced apart such that a channel is formed therebetween. A non-adhesive dividing strip is attached to the strips. The strips are folded along the centerline of and rolled upon a cylindrical core (16). The roll is placed against one wall with the folded edge inserted into the corner. Using the roll as a guide the tape is unrolled along the corner by moving the roll along the corner, progressively unrolling tape from the roll and unpeeling the dividing strip. After the tape is in place, caulk or grout is applied in the channel between the adhesive strips.

Abstract: The invention relates to a method for separation of a silicon wafer (12a) from a vertical stack (10) of silicon wafers (12). The method is characterised in that it comprises attaching a movable transport device (2) to a surface of the silicon wafer (12a) in the stack (10), and horizontal movement of the silicon wafer (12a) parallel (A) to the surface of the silicon wafer (12a) until the silicon wafer (12a) is separated from the stack (10). The invention also comprises a device for implementing the method.